Abstract: A fluororesin film including a fluorine-containing composition, wherein the oxygen element percentage as measured when heat treatment is performed at 180° C. for 3 minutes and then the state of one or both surfaces of the film is observed by scanning X-ray photoelectron spectroscopy (XPS/ESCA) is 1.35 atom % or more, and an absolute value of the rate of dimensional change in MD and TD before and after heat treatment as measured when the film is heat-treated at 180° C. for 10 minutes and then cooled to room temperature is 2% or less. Also disclosed is a copper-clad laminate, including copper foil and the fluororesin film; a substrate for circuit, including the copper-clad laminate; and a method for producing the copper-clad laminate.