Abstract: A guard member for covering devices which is provided in an upper rotating body is provided with left and right maintenance holes for maintenance of the devices from two positions on the left side and the right side, and left and right maintenance panels for rotating taking the rear side as a support point so as to open and close the maintenance holes. In this case, panel main bodies of the both panels are formed vertically symmetrically with the same shape and the same size as each other corresponding to the maintenance holes. The both panels are attached to the guard member in a vertically reversed state to each other and in a state that the hinge members are located on the rear side.

Abstract: On the premise that a partition wall for defining an engine room is provided on the left side of a rear portion of an upper frame the partition wall constituting an upper rotating body and that an engine and a cooler are disposed in the engine room, a front support frame which supports a front portion of the cooler is connected to a rear surface of the partition wall in a state of surface abutment against the rear surface, whereby the support frame also serves as a support pillar for the partition wall, the partition wall also serves as a stay for the prevention of transverse vibration of the support frame, and the use of a sealing member for filling up a gap between the partition wall and the support frame can be omitted.

Abstract: Disclosed is a thermosetting resin composition which enables to obtain a molded article that is excellent in mechanical properties, dimensional stability and heat resistance and is further capable of maintaining the shape of the article molded before curing even after the resin composition is cured. The thermosetting resin composition contains 100 parts by weight of a thermosetting resin and 1-100 parts by weight of an inorganic compound dispersed in the thermosetting resin, and the dispersion particle diameter of the inorganic compound is not more than 2 ?m. Not less than 75% of the shape of an article molded before curing is maintained after the resin composition is cured. Also disclosed are a material for substrates and a film for substrates respectively composed by using such a thermosetting resin composition.

Abstract: Disclosed is a thermoplastic resin composition which enables to obtain a molded article that is capable of maintaining the molded shape even when the article is heated after molding and is excellent in dimensional stability and heat resistance. The thermoplastic resin composition contains 100 parts by weight of a thermoplastic resin and 0.1-100 parts by weight of an inorganic compound dispersed in the thermoplastic resin. Not less than 75% of the molded shape of an article can be maintained even after the article is heated to a temperature not less than the glass transition temperature or melting point of the thermoplastic resin. Also disclosed are a material and a film for substrates composed by using such a thermoplastic resin composition.

Abstract: A resin composition, substrate material, sheet, laminated board, resin-bearing copper foil, copper-clad laminate, TAB tape, printed board, prepreg and adhesive sheet are provided which exhibit improved mechanical properties, dimensional stability, heat resistance and flame retardance, particularly high-temperature physical properties. A resin composition containing 100 parts by weight of a thermosetting resin and 0.1-65 parts by weight of an inorganic compound, the resin composition having a mean linear expansion coefficient (?2) of up to 17×10?3 [° C.?1] over the temperature range from a temperature 10° C. higher than a glass transition temperature of the resin composition to a temperature 50° C. higher than the glass transition temperature of the resin composition.

Abstract: It is an object of the invention to provide a material for insulating substrate, a printed board, a laminate, copper foil with resin, a copper-clad laminate, a polyimide film, a film for TAB and a prepreg, which are excellent in physical properties, dimensional stability, heat resistance, flame retardancy etc.