Patents by Inventor Kojiro IWASA

Kojiro IWASA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for producing high frequency circuit board, and high frequency circuit board
    Patent number: 10827604
    Abstract: A method for producing a high frequency circuit board includes forming an antenna pattern on an upper surface of the provisional substrate. The method includes performing hot-press in a state where a thermoplastic resin and a provisional conductor are stacked on the upper surface of the provisional substrate, to form a first dielectric layer portion covering the antenna pattern. The method includes removing the provisional conductor and shaving the first dielectric layer portion to form a cavity to house an electronic component. The method includes mounting the electronic component on the antenna pattern in the cavity. The method includes performing hot-press in a state where a thermosetting resin and a ground conductor are stacked at an opening side of the cavity in the first dielectric layer portion, to form a second dielectric layer portion to embed the electronic component in the cavity. The method includes removing the provisional substrate.
    Type: Grant
    Filed: July 2, 2019
    Date of Patent: November 3, 2020
    Assignee: NIPPON PILLAR PACKING CO., LTD.
    Inventors: Takeshi Okunaga, Akira Nakatsu, Kojiro Iwasa, Yusuke Natsuhara
  • METHOD FOR PRODUCING HIGH FREQUENCY CIRCUIT BOARD, AND HIGH FREQUENCY CIRCUIT BOARD
    Publication number: 20200260572
    Abstract: A method for producing a high frequency circuit board includes forming an antenna pattern on an upper surface of the provisional substrate. The method includes performing hot-press in a state where a thermoplastic resin and a provisional conductor are stacked on the upper surface of the provisional substrate, to form a first dielectric layer portion covering the antenna pattern. The method includes removing the provisional conductor and shaving the first dielectric layer portion to form a cavity to house an electronic component. The method includes mounting the electronic component on the antenna pattern in the cavity. The method includes performing hot-press in a state where a thermosetting resin and a ground conductor are stacked at an opening side of the cavity in the first dielectric layer portion, to form a second dielectric layer portion to embed the electronic component in the cavity. The method includes removing the provisional substrate.
    Type: Application
    Filed: July 2, 2019
    Publication date: August 13, 2020
    Applicant: NIPPON PILLAR PACKING CO., LTD.
    Inventors: Takeshi OKUNAGA, Akira NAKATSU, Kojiro IWASA, Yusuke NATSUHARA