Abstract: A circuit die is disposed into a region defined by a mold. A molding material is then introduced into the region to encapsulate the circuit die. Prior to substantial curing of the molding material, at least a portion of the molding material is removed from over a surface of the circuit die, creating a recessed region in the encapsulating material. A heat spreader may then be disposed within the recessed region, as well as over the top surface of the encapsulating material. The heat spreader may have a downset that substantially aligns with the recessed region and reduces the distance between the heat spreader and the spacer for better heat dissipation.

Abstract: An IC package that is suitable for surface mounting arrangements includes a heat spreader device that is coupled to a bottom portion of the package below the IC die. Coupling the heat spreader device to the bottom portion of the package reduces or eliminates the possibility that placement of the heat spreader device will result in the molding compound bleeding on top of the heat spreader device, and delamination at the footings of the heat spreader device that can cause the package to delaminate, or “popcorn”.

Abstract: A circuit die is disposed into a region defined by a mold. A molding material is then introduced into the region to encapsulate the circuit die. Prior to substantial curing of the molding material, at least a portion of the molding material is removed from over a surface of the circuit die, creating a recessed region in the encapsulating material. A heat spreader may then be disposed within the recessed region, as well as over the top surface of the encapsulating material. The heat spreader may have a downset that substantially aligns with the recessed region and reduces the distance between the heat spreader and the spacer for better heat dissipation.

Abstract: A BGA ball mount line with a dual in-line mounter flowing into one reflow oven and one in-line cleaner. The dual in-line mounter comprises a first ball mount cell and a second ball mount cell. The second ball mount cell is parallel to and a mirror image of the first ball mount cell. The first ball mount cell and the second ball mount cell can be run by a single operator located between them. In one embodiment of the invention, the BGA ball mount line with dual in-line mounters is implemented in three phases to provide a smooth transition. In the first phase, a proto-line is set-up with a first ball mount cell, a loading cell, a diverter cell, and an unloading cell, to optimize the first ball mount cell. In the second phase, a reflow oven and a flux cleaner are added to form a production line. In the third phase, a second ball mount cell is added to form a BGA ball mount line with a dual in-line mounter.

Abstract: A mold has at least one vent hole formed in the mold. The vent hole is positioned to allow egress of air from the mold. The vent hole has an inside end and an outside end. The vent hole has a cross section that increases in area from the inside end to the outside end. The vent hole may have a shape of a trapezoidal prism, a truncated pyramid or a truncated cone; the cross section of the vent hole may be a rectangle. A preferred mold has three air vent holes at three corners of the mold. An integrated circuit is placed within the mold. A material to be molded is injected into the mold to encapsulate the integrated circuit. Mold cleaning is facilitated by the shape of the vent, and plastic flashes may be easily removed through the vent hole.

Abstract: An apparatus cuts a substrate having first and second portions, each portion having a respectively different level. A first support surface is located at a first level. The first portion of the substrate is supported by the first support surface. A second support surface is located at a second level different from the first level. The second portion of the substrate is supported by the second support surface. The first and second support surfaces are first and second die surfaces, respectively. A punch cuts the substrate between the first support surface and the second support surface. The punch has a V-shaped cross section. A stripper plate has first and second portions. The punch is positioned between the first and second portions of the stripper plate. The first portion of the substrate is clamped between the first portion of the stripper plate and the first die surface. The second portion of the substrate is clamped between the second portion of the stripper plate and the second die surface.