Patents by Inventor Kok Keng Wan

Kok Keng Wan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-level components for integrated-circuit packages
    Patent number: 11476198
    Abstract: Disclosed embodiments include multi-level fan-out integrated-circuit package substrates that provide a low-loss path to active and passive devices, by shunting away from interconnects and inductive loops. The multi-level form factor of a molded mass, allows for the low-loss path.
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: October 18, 2022
    Assignee: Intel Corporation
    Inventors: Bok Eng Cheah, Jackson Chung Peng Kong, Jenny Shio Yin Ong, Seok Ling Lim, Kok Keng Wan