Patents by Inventor Kok Lee

Kok Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070051255
    Abstract: A method for depositing a printing material on a substrate is provided. The method begins by providing a stencil disposed adjacent to the substrate. The stencil includes a number of apertures to allow printing material to pass therethrough. Printing material is deposited onto and spread across the stencil with a squeegee blade. To increase the volume of printing material over a set of selected apertures, the squeegee blade includes a printing edge having a profile feature. The increased printing material then passes through the set of selected apertures to deposit onto the substrate.
    Type: Application
    Filed: August 24, 2005
    Publication date: March 8, 2007
    Inventors: FoongYow Chan, Rahmat Hashim, SeongPeng Au, Kok Lee
  • Publication number: 20060172662
    Abstract: CMP pad conditioning processes have been monitored and controlled by detecting the vibrational spectrum of a sensor mounted on the conditioner support arm. An accelerometer is used as the detector so that vibrational velocity (which correlates with pad wear) can be measured, rather than displacement or acceleration. After the vibrational spectrum has been transformed to its frequency domain equivalent, it is monitored for the presence of abnormal peaks in order to control the conditioning process.
    Type: Application
    Filed: January 31, 2005
    Publication date: August 3, 2006
    Inventors: Khoon Lim, Kok Lee
  • Publication number: 20050217293
    Abstract: A method for controlling a cooling device for a switched power device, e.g., a digital amplifier, is presented. The method includes sensing the output signal and adjusting the power of the cooling device according to the output power of the switched power device. The invention eliminates the need for temperature sensors attached to the heat sink by recognizing that the heat generated in switched power devices is correlated to the output power. Further, a circuit implementing the method and an amplifier using the inventive circuit is presented.
    Type: Application
    Filed: March 31, 2005
    Publication date: October 6, 2005
    Inventors: Kok Lee, Chun Tee