Patents by Inventor Kok Leong Chan

Kok Leong Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame with grooved lead finger
    Patent number: 9006874
    Abstract: A lead finger of a lead frame has a number of channels or grooves in a portion of its top surface that provide a locking mechanism for securing a bond wire to the lead finger. The bond wire may be attached to the lead finger by stitch bonding.
    Type: Grant
    Filed: January 6, 2014
    Date of Patent: April 14, 2015
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Wai Keong Wong, Kok Leong Chan, Wei Kee Chan
  • LEAD FRAME WITH GROOVED LEAD FINGER
    Publication number: 20140120664
    Abstract: A lead finger of a lead frame has a number of channels or grooves in a portion of its top surface that provide a locking mechanism for securing a bond wire to the lead finger. The bond wire may be attached to the lead finger by stitch bonding.
    Type: Application
    Filed: January 6, 2014
    Publication date: May 1, 2014
    Inventors: Wai Keong Wong, Kok Leong Chan, Wei Kee Chan
  • Lead frame with grooved lead finger
    Patent number: 8643159
    Abstract: A lead finger of a lead frame has a number of channels or grooves in a portion of its top surface that provide a locking mechanism for securing a bond wire to the lead finger. The bond wire may be attached to the lead finger by stitch bonding.
    Type: Grant
    Filed: April 9, 2012
    Date of Patent: February 4, 2014
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Wai Keong Wong, Kok Leong Chan, Wei Kee Chan
  • LEAD FRAME WITH GROOVED LEAD FINGER
    Publication number: 20130264693
    Abstract: A lead finger of a lead frame has a number of channels or grooves in a portion of its top surface that provide a locking mechanism for securing a bond wire to the lead finger. The bond wire may be attached to the lead finger by stitch bonding.
    Type: Application
    Filed: April 9, 2012
    Publication date: October 10, 2013
    Applicant: FREESCALE SEMICONDUCTOR, INC
    Inventors: Wai Keong WONG, Kok Leong CHAN, Wei Kee CHAN
  • Vortex reducer
    Patent number: 8397751
    Abstract: A vortex reducing apparatus and method for drainage of a process tank are described. The vortex reducer including a keel having a longitudinal axis, a top flow foil coupled to the keel and a bottom flow foil coupled to the keel. The top flow foil and the bottom flow foil are each coupled to the keel at a first angle with respect to the longitudinal axis.
    Type: Grant
    Filed: April 15, 2010
    Date of Patent: March 19, 2013
    Assignee: WD Media, Inc.
    Inventors: Kok Leong Chan, Say Wei Pang