Abstract: A method for producing an inkjet printhead element comprises providing a thinfilm die and a barrier layer thereon, wherein the barrier layer comprises a thermoplastic component and a thermoset component. The barrier layer is heated such that the barrier layer becomes tacky. The orifice plate is aligned to the barrier layer and is brought into contact with the barrier layer. Here, the orifice plate is held in place on the barrier layer by the tackiness of the barrier layer. Finally, the assembly of the thin film die, the barrier layer and the orifice plate is subjected to a stake and bake process to attach the orifice plate permanently to the barrier layer and, hence, to the thin film die.

Abstract: A method for producing an inkjet printhead element comprises providing a thinfilm die and a barrier layer thereon, wherein the barrier layer comprises a thermoplastic component and a thermoset component. The barrier layer is heated such that the barrier layer becomes tacky. The orifice plate is aligned to the barrier layer and is brought into contact with the barrier layer. Here, the orifice plate is held in place on the barrier layer by the tackiness of the barrier layer. Finally, the assembly of the thin film die, the barrier layer and the orifice plate is subjected to a stake and bake process to attach the orifice plate permanently to the barrier layer and, hence, to the thin film die.

Abstract: A process for forming an orifice plate for a thermal inkjet printhead involves the use of a photoimageable polymer and photolithography for forming a plastic orifice plate having a defined pattern of orifices therein. A substrate is used to support a photoimageable polymer layer (which ultimately becomes the orifice plate) during the photolithographic steps, which preserves the structural integrity of the polymer layer. The process allows high accuracy in the dimensioning, spacing and shaping of the orifices. A thermal inkjet print head assembly is also disclosed which involves bonding the plastic orifice plate to a polymer barrier layer of a thin film resistor heater structure using heat and pressure.