Patents by Inventor Kok Loo

Kok Loo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • I/O circuitry for reducing ground bounce and VCC sag in integrated circuit devices
    Publication number: 20070007991
    Abstract: Methods and circuitry for reducing ground bounce and VCC sag effects in integrated circuit (“IC”) devices is provided. In particular, a via-programmable design for I/O circuitry in IC devices is provided. The via-programmable I/O circuitry is used to disconnect I/O pin driver circuitry from and create a substantially direct connection between unused I/O pins and the ground and/or VCC signals of an IC device to reduce ground bounce and VCC sag, respectively.
    Type: Application
    Filed: June 29, 2005
    Publication date: January 11, 2007
    Inventors: Eng Lee, Kok Loo