Patents by Inventor Kok Meng Goh

Kok Meng Goh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080096399
    Abstract: An electrically conductive terminal 2, 3 for a circuit board connector has a heat sink fin 16 which is thermally coupled to two connection portions 12, 14 for dissipation of heat generated in the connection portions. The heat sink fin and one of the connection portions 12 extend from a central body portion 10 in the same direction. The heat sink fin is preferably located outside one of the connection portions 12 to protect the latter from physical damage. A lock portion 18, with a barb 26 for retaining the terminal in the connector housing 1, may extend from the central body portion in a direction opposite to the heat sink fin 16. The terminal 2, 3, and particularly the lock portion 18, can be inserted into a cavity 28 in the connector housing 1 by pushing on the distal end 24 of the heat sink fin. The terminal may be stamped from a sheet metal material. Also claimed is a connector having a row of such terminals mounted with a common alignment and with the heat sink fins located outside the connector housing.
    Type: Application
    Filed: September 16, 2005
    Publication date: April 24, 2008
    Applicant: Molex Incorporated
    Inventor: Kok Meng Goh