Abstract: A method of characterizing warpage of a ball grid array (BGA) substrate having solder balls attached to its surface includes scanning each corner and a central portion of the substrate to obtain scanned data and measuring respective coplanarities of the solder balls in the central portion and each corner of the substrate. Average coplanarities for the central portion and each corner are calculated and differences between the average coplanarity of the central portion and the average coplanarities for each corner are calculated to determine a warpage characteristic for each corner of the substrate. A curvature profile based on the warpage characteristic of each corner is generated and pass/fail of the substrate can be determined based on the generated curvature profile.