Patents by Inventor Kok Siang Saw

Kok Siang Saw has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LIGHT-EMITTING DIODE (LED) PACKAGE WITH REFLECTIVE COATING AND METHOD OF MANUFACTURE
    Publication number: 20230155073
    Abstract: A light-emitting diode (LED) package and method of manufacture are described. An LED package includes an LED die that has a top surface, a bottom surface and side surfaces. The package further includes a wavelength converting element having a top surface, a bottom surface and side surfaces. The bottom surface of the wavelength converting element is adjacent the top surface of the LED die. The package further includes a light reflecting coating surrounding at least the side surfaces of both the LED die and the wavelength converting element. The light reflective coating has at a least a portion that extends above the top surface of the wavelength converting element.
    Type: Application
    Filed: November 18, 2022
    Publication date: May 18, 2023
    Applicant: LUMILEDS LLC
    Inventors: Grigoriy Basin, Mikhail Fouksman, Venkata Ananth Tamma, Tze Yang Hin, Kok Siang Saw, Ruen Ching Law