Abstract: A frequency converter (1) for generating an output signal (5a) from an input signal (5), the output signal (5a) having different frequency than the input signal (5), the frequency converter (1) including: an input (7) for receiving an input signal (5); a transmission line (3) formed of a non-linear medium (3a), the medium (3a) arranged such that when the input signal (5) propagates along the line (3), one or more harmonics (5a,5b) of the input signal (5) are generated; a plurality of dispersion control elements (13), the dispersion control elements (13) arranged to control the dispersion relationship of the medium (3a), to phase match the input signal (5) and the one or more harmonics (5a,5b), such that energy is transferred from the input signal (5) to the one or more harmonics (5a,5b); and an output (9) for providing the one or more harmonics (5a, 5b) as an output signal.

Abstract: A four-wave mixing transmission line (3) including: an input (15, 17, 19) arranged to receive: a first pump signal (7a) having a first pump frequency; a second pump signal (7b), having a second pump frequency, different to the first pump frequency; and an input signal to be amplified (5); a non-linear medium (3a) having an intrinsic dispersion relationship, the medium (3a) arranged to allow interaction between the input signal (5), the first pump signal (7a) and the second pump signal (7b), such that the input signal (5) is amplified and an idler signal (9) is generated and amplified; and a plurality of dispersion control elements (31, 33, 49), the dispersion control elements (31, 33, 49) arranged to alter the dispersion relationship of the medium (3a) to diverge from the intrinsic dispersion relationship at one or more frequencies, such that the total phase difference between the input signal, (5) the first pump signal (7a), the second pump signal (7b) and the idler signal (9) is kept at zero or substantiall

Abstract: A frequency converter (1) for generating an output signal (5a) from an input signal (5), the output signal (5a) having different frequency than the input signal (5), the frequency converter (1) including: an input (7) for receiving an input signal (5); a transmission line (3) formed of a non-linear medium (3a), the medium (3a) arranged such that when the input signal (5) propagates along the line (3), one or more harmonics (5a,5b) of the input signal (5) are generated; a plurality of dispersion control elements (13), the dispersion control elements (13) arranged to control the dispersion relationship of the medium (3a), to phase match the input signal (5) and the one or more harmonics (5a,5b), such that energy is transferred from the input signal (5) to the one or more harmonics (5a,5b); and an output (9) for providing the one or more harmonics (5a, 5b) as an output signal.

Abstract: A four-wave mixing transmission line (3) including: an input (15, 17, 19) arranged to receive: a first pump signal (7a) having a first pump frequency; a second pump signal (7b), having a second pump frequency, different to the first pump frequency; and an input signal to be amplified (5); a non-linear medium (3a) having an intrinsic dispersion relationship, the medium (3a) arranged to allow interaction between the input signal (5), the first pump signal (7a) and the second pump signal (7b), such that the input signal (5) is amplified and an idler signal (9) is generated and amplified; and a plurality of dispersion control elements (31, 33, 49), the dispersion control elements (31, 33, 49) arranged to alter the dispersion relationship of the medium (3a) to diverge from the intrinsic dispersion relationship at one or more frequencies, such that the total phase difference between the input signal, (5) the first pump signal (7a), the second pump signal (7b) and the idler signal (9) is kept at zero or substantiall

Abstract: A system for assessing reliability of a semiconductor product design, the system comprising a first database for storing circuits data specifying cells of available circuits for semiconductor products; an input unit for input of reliability qualification data of tested semiconductor products; an uploading unit for uploading semiconductor product design data; and a processor for processing the reliability qualification data to generate reliability data at a circuit-level, a cell-level, or both utilizing the circuits data, and for assessing the reliability of the semiconductor product design based on the generated reliability data.

Abstract: The present invention relates to an orthodontic appliances, particularly a bracket, comprising a base portion adapted for bonding to a surface of a tooth, a body portion extending from the base portion and having an archwire receiving means having a first part (3) which has at least a first dimension substantially adapted to receive a portion of an archwire (4) and having a second part comprising a narrowing portion (2) having a second dimension substantially more narrow than the first dimension.

Abstract: A flat panel display unit (1) has a display screen (3) on a front side (5) and a rear panel (7) having an outer surface (9) on an opposite rear side (11), the display unit being provided with attachment means for the removable attachment of the rear panel (7) of the display unit (1) to a surface (13) of a supporting structure such as a room wall, a car dashboard, a refrigerator cabinet, a piece of furniture, etc., the attachment the elements: adhesive means (39), suction cup means (19), hook-and-loop fastening means (45), hook means, permanent magnet means (33). The display unit (1) is provided with at least one integrated attachment unit (15; 17) comprising a plurality of attachment means constituting a subset of said attachment means set and being permanently secured to the rear panel (7) outer surface (9).

Abstract: Stacked microfeature devices and associated methods of manufacture are disclosed. A package in accordance with one embodiment includes first and second microfeature devices having corresponding first and second bond pad surfaces that face toward each other. First bond pads can be positioned at least proximate to the first bond pad surface and second bond pads can be positioned at least proximate to the second bond pad surface. A package connection site can provide electrical communication between the first microfeature device and components external to the package. A wirebond can be coupled between at least one of the first bond pads and the package connection site, and an electrically conductive link can be coupled between the first microfeature device and at least one of the second bond pads of the second microfeature device. Accordingly, the first microfeature device can form a portion of an electrical link to the second microfeature device.

Abstract: The invention is directed to a clip and frame assembly for a louvre window, including a frame with a frame channel and a clip rotatably coupled to the frame, the clip having at least one chamber on its back surface adapted to direct water along a flow path to an aperture into the frame channel. The invention extends to a pairing of adjacent clips wherein one or more chambers in an upper clip direct water into a chamber in a lower clip which is, in turn, directed into the frame channel. Preferably, the clip includes four chambers on the back surface with each chamber in fluid connection with at least one other chamber either in the same clip or in an adjacent clip. The invention extends to a chamber being formed in a recess adapted to receive an edge of a louvre plate wherein water in this chamber is also directed into the frame channel through an aligned aperture. Further embodiments of the invention may include one or more chambers which discharge water outwardly of the clip.

Abstract: A burn-in PCB comprising an adapter socket for receiving at least one program card; a plurality of test sockets for receiving test components; wherein one or more of the test sockets are electrically connected to the adapter socket by way of the printed circuit of the burn-in PCB; and wherein electrical connections for burn-in testing to respective test components received in said one or more test sockets on the burn-in PCB are at least in part formed by the printed circuit on said at least one program card received in the adapter socket.

Abstract: A curve tracing method comprising simultaneously connecting a test IC sample and a reference IC sample to a switchboard; and selectively connecting a scanning voltage output or a sensing input of a curve tracer unit to each of the pins of the test IC sample and the reference IC sample via the pin switches and the IC sockets.

Abstract: Stacked microfeature devices and associated methods of manufacture are disclosed. A package in accordance with one embodiment includes first and second microfeature devices having corresponding first and second bond pad surfaces that face toward each other. First bond pads can be positioned at least proximate to the first bond pad surface and second bond pads can be positioned at least proximate to the second bond pad surface. A package connection site can provide electrical communication between the first microfeature device and components external to the package. A wirebond can be coupled between at least one of the first bond pads and the package connection site, and an electrically conductive link can be coupled between the first microfeature device and at least one of the second bond pads of the second microfeature device. Accordingly, the first microfeature device can form a portion of an electrical link to the second microfeature device.

Abstract: A method and apparatus for generating invoices at a buyer of goods or services employs a system in which the goods or services actually received are evidenced by documentation. Based upon this documentation, the buyer creates an invoice that is provided to the supplier or a third party logistics provider.