Patents by Inventor Kok Tee Lau

Kok Tee Lau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor component and method for producing a semiconductor component
    Patent number: 10121723
    Abstract: According to an embodiment of a method, the method includes forming a first thermally conductive layer on an outer surface of a semiconductor package. The first thermally conductive layer formed on the outer surface of the semiconductor package is configured to be mounted to an external heat sink.
    Type: Grant
    Filed: April 13, 2017
    Date of Patent: November 6, 2018
    Assignee: INFINEON TECHNOLOGIES AUSTRIA AG
    Inventors: Kok Tee Lau, Jayaganasan Narayanasamy
  • SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT
    Publication number: 20180301390
    Abstract: According to an embodiment of a method, the method includes forming a first thermally conductive layer on an outer surface of a semiconductor package. The first thermally conductive layer formed on the outer surface of the semiconductor package is configured to be mounted to an external heat sink.
    Type: Application
    Filed: April 13, 2017
    Publication date: October 18, 2018
    Inventors: Kok Tee Lau, Jayaganasan Narayanasamy