Patents by Inventor Kok Wai Chan
Kok Wai Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240071944Abstract: The invention relates to the field of chip fabrication, in particular to the fabrication of superconducting integrated circuits for use in quantum computers. Raised and recessed alignment structures are provided on the surfaces of two substrate such that the raised and recessed alignment structure extends within the recessed alignment structure to a maximum depth determined by the geometry of the alignment structures. The alignment structures act as a hard stop for positioning and aligning the substrates for flip chip bonding.Type: ApplicationFiled: November 7, 2023Publication date: February 29, 2024Inventors: Máté JENEI, Kok Wai Chan, Kuan Yen Tan
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Patent number: 11907805Abstract: A three-dimensional superconducting qubit and a method for manufacturing the same are disclosed. In an example, a three-dimensional superconducting qubit comprises a structural base comprising one or more insulating materials, and superconductive patterns on surfaces of the structural base. The superconductive patterns form at least a capacitive part and an inductive part of the three-dimensional superconducting qubit. A first surface of the surfaces of the structural base defines a first plane and a second surface of the surfaces of the structural base defines a second plane, the second plane being oriented differently than the first plane. At least one superconductive pattern of the superconductive patterns extends from the first surface to the second surface.Type: GrantFiled: October 6, 2021Date of Patent: February 20, 2024Assignee: IQM Finland OyInventors: Caspar Ockeloen-Korppi, Tianyi Li, Wei Liu, Vasilii Sevriuk, Tiina Naaranoja, Mate Jenei, Jan Goetz, Kuan Yen Tan, Mikko Möttönen, Kok Wai Chan
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Patent number: 11849651Abstract: This disclosure describes a superconducting device comprising a trench and a cavity that extends through a superconducting base layer. The trench crosses the cavity. The superconducting device further comprises a first junction layer that extends from a first region of the superconducting base layer to the cavity, an insulating layer on the surface of the first junction layer, and a second junction layer that extends from a second region of the superconducting base layer to the cavity. The second junction layer overlaps with the insulating layer on the bottom of the cavity. The disclosure also describes a method for producing this disclosed superconducting device.Type: GrantFiled: January 14, 2022Date of Patent: December 19, 2023Assignee: IQM Finland OyInventors: Tianyi Li, Wei Liu, Manjunath Ramachandrappa Venkatesh, Hasnain Ahmad, Kok Wai Chan
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Patent number: 11621388Abstract: The present invention relates to the manufacture of Josephson junctions. Such Josephson junctions may be suitable for use in qubits. High-quality, potentially monocrystalline, electrode and dielectric layers are formed using blanket deposition. Subsequently, the structure of one of more Josephson junctions is formed using multi-photon lithography to create openings in a resist followed by etching the electrode and dielectric layers.Type: GrantFiled: December 3, 2021Date of Patent: April 4, 2023Assignee: IQM Finland OyInventors: Tianyi Li, Wei Liu, Manjunath Ramachandrappa Venkatesh, Hasnain Ahmad, Kok Wai Chan, Kuan Yen Tan
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Patent number: 11605586Abstract: An airbridge implements connections on a superconducting chip. It comprises a strip of superconductive material between a first superconductive area and a second superconductive area. A first end of said strip comprises a first planar end portion attached to and parallel with said first superconductive area, and a second end of said strip comprises a respective second planar end portion. A middle portion is located between said first and second planar end portions, forming a bend away from a plane defined by the surfaces of the first and second superconductive areas. First and second separation lines separate the end portions from the middle portion. At least one of said first and second separation lines is directed otherwise than transversally across said strip.Type: GrantFiled: July 17, 2020Date of Patent: March 14, 2023Assignee: IQM Finland OyInventors: Kok Wai Chan, Tianyi Li, Wei Liu, Caspar Ockeloen-Korppi
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Publication number: 20220359808Abstract: The invention relates to a method for forming flip chip bumps using electroplating. The method allows the formation of flip chip bumps in a way that is compatible with already-formed sensitive electronic components, such as Josephson junctions, which may be used in quantum processing units. The invention also relates to a product and a flip chip package in which flip chip bumps are formed with the disclosed method.Type: ApplicationFiled: May 2, 2022Publication date: November 10, 2022Inventors: Máté Jenei, Kok Wai Chan, Hasnain Ahmad, Manjunath Ramachandrappa Venkatesh, Wei Liu, Lily Yang, Tianyi Li, Jean-Luc Orgiazzi, Caspar Ockeloen-Korppi, Alessandro Landra, Mario Palma
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Publication number: 20220359415Abstract: Superconducting through substrate vias (STSVs) are disclosed. The STSVs provide superconducting interconnections between opposite faces of a substrate. In an example, a method of forming STSVs includes etching openings that extend from a first side of a substrate partially through the substrate towards a second side of the substrate. The method also includes depositing a seed layer over the first side of the substrate and interior surfaces of the openings in the substrate. The method further includes forming a resist or hardmask on the first side of the substrate above the seed layer, such that the resist or hardmask comprises openings aligned with the etched openings in the substrate. The etched openings in the substrate are filled with a superconducting filler material. The substrate is thinned by removing material from the second side of the substrate until the deposited seed layer is exposed on the second side of the substrate.Type: ApplicationFiled: May 4, 2022Publication date: November 10, 2022Inventors: Máté Jenei, Kok Wai Chan, Hasnain Ahmad, Manjunath Ramachandrappa Venkatesh, Wei Liu, Lily Yang, Tianyi Li, Jean-Luc Orgiazzi, Caspar Ockeloen-Korppi, Alessandro Landra, Mario Palma
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Publication number: 20220238781Abstract: This disclosure describes a superconducting device comprising a trench and a cavity that extends through a superconducting base layer. The trench crosses the cavity. The superconducting device further comprises a first junction layer that extends from a first region of the superconducting base layer to the cavity, an insulating layer on the surface of the first junction layer, and a second junction layer that extends from a second region of the superconducting base layer to the cavity. The second junction layer overlaps with the insulating layer on the bottom of the cavity. The disclosure also describes a method for producing this disclosed superconducting device.Type: ApplicationFiled: January 14, 2022Publication date: July 28, 2022Inventors: Tianyi Li, Wei Liu, Manjunath Ramachandrappa Venkatesh, Hasnain Ahmad, Kok Wai Chan
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Publication number: 20220181538Abstract: The present invention relates to the manufacture of Josephson junctions. Such Josephson junctions may be suitable for use in qubits. High-quality, potentially monocrystalline, electrode and dielectric layers are formed using blanket deposition. Subsequently, the structure of one of more Josephson junctions is formed using multi-photon lithography to create openings in a resist followed by etching the electrode and dielectric layers.Type: ApplicationFiled: December 3, 2021Publication date: June 9, 2022Inventors: Tianyi Li, Wei Liu, Manjunath Ramachandrappa Venkatesh, Hasnain Ahmad, Kok Wai Chan, Kuan Yen Tan
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Publication number: 20220164690Abstract: A three-dimensional superconducting qubit and a method for manufacturing the same are disclosed. In an example, a three-dimensional superconducting qubit comprises a structural base comprising one or more insulating materials, and superconductive patterns on surfaces of the structural base. The superconductive patterns form at least a capacitive part and an inductive part of the three-dimensional superconducting qubit. A first surface of the surfaces of the structural base defines a first plane and a second surface of the surfaces of the structural base defines a second plane, the second plane being oriented differently than the first plane. At least one superconductive pattern of the superconductive patterns extends from the first surface to the second surface.Type: ApplicationFiled: October 6, 2021Publication date: May 26, 2022Inventors: Caspar Ockeloen-Korppi, Tianyi Li, Wei Liu, Vasilii Sevriuk, Tiina Naaranoja, Mate Jenei, Jan Goetz, Kuan Yen Tan, Mikko Möttönen, Kok Wai Chan
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Publication number: 20220012617Abstract: A quantum computing circuit is disclosed herein. An example quantum computing circuit includes a first chip with at least one qubit thereon. The quantum computing circuit also includes a second chip with at least other quantum circuit elements other than qubits thereon. The first chip and the second chip are stacked together in a flip-chip configuration and attached to each other with bump bonding that includes bonding bumps.Type: ApplicationFiled: December 31, 2020Publication date: January 13, 2022Inventors: Juha Hassel, Wei Liu, Vasilii Sevriuk, Johannes Heinsoo, Mate Jenei, Manjunath Venkatesh, Tianyi Li, Kok Wai Chan, Kuan Yen Tan, Mikko Möttönen
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Publication number: 20210406750Abstract: A method, system, and arrangement for resetting qubits are disclosed. An example system includes one or more quantum circuit refrigerators for resetting qubits. Each of the quantum circuit refrigerators includes a tunneling junction and a control input for receiving a control signal. Photon-assisted single-electron tunneling takes place across the respective tunneling junction in response to a control signal. Capacitive or inductive coupling elements between the qubits and the quantum circuit refrigerators couple each qubit to the quantum circuit refrigerator(s). The qubits, quantum circuit refrigerators, and coupling elements are located in a cryogenically cooled environment. A common control signal line to the control inputs crosses into the cryogenically cooled environment from a room temperature environment.Type: ApplicationFiled: November 3, 2020Publication date: December 30, 2021Inventors: Tianyi Li, Kok Wai Chan, Kuan Yen Tan, Jan Goetz, Mikko Möttönen
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Publication number: 20210265261Abstract: An airbridge implements connections on a superconducting chip. It comprises a strip of superconductive material between a first superconductive area and a second superconductive area. A first end of said strip comprises a first planar end portion attached to and parallel with said first superconductive area, and a second end of said strip comprises a respective second planar end portion. A middle portion is located between said first and second planar end portions, forming a bend away from a plane defined by the surfaces of the first and second superconductive areas. First and second separation lines separate the end portions from the middle portion. At least one of said first and second separation lines is directed otherwise than transversally across said strip.Type: ApplicationFiled: July 17, 2020Publication date: August 26, 2021Inventors: Kok Wai Chan, Tianyi Li, Wei Liu, Caspar Ockeloen-Korppi
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Publication number: 20210255076Abstract: A sample cell is provided for holding a sample to be placed in a cryogenically cooled environment. The sample cell comprises an airtight, openable and closable enclosure. Within said enclosure is a sample base for receiving the sample. A refrigerator attachment is provided for attaching the sample cell to a refrigerated body of a cryogenically cooled environment. The sample cell comprises a thermal connection between the sample base and the refrigerator attachment. One or more airtight connectors are provided for establishing electric connections between inside and outside of said enclosure.Type: ApplicationFiled: June 29, 2020Publication date: August 19, 2021Inventors: Kok Wai Chan, Tianyi Li, Juha Hassel, Jari Penttilä
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Patent number: 9544147Abstract: Authentication is widely used to protect consumer data and computing services, such as email, document storage, and online banking. Current authentication models, such as those employed by online identity providers, may have limited options and configurations for authentication schemes. Accordingly, as provided herein, a model based authentication scheme may be configured based upon a policy and/or an authentication mechanism list. The policy may define the target resource, a user, a group the user belongs to, devices used to connect to the target resource, a service owning the target resource, etc. The authentication mechanism list may comprise predefined authentication mechanisms and/or user plug-in authentication mechanisms (e.g., user created authentication mechanism). Once the authentication scheme is configured, it may be enforced upon authentication requests from a user. Feedback may be provided to the user based upon patterns of usage of the target resource.Type: GrantFiled: May 22, 2009Date of Patent: January 10, 2017Assignee: Microsoft Technology Licensing, LLCInventors: Yordan I. Rouskov, Wei-Qiang Michael Guo, Orville Charles McDonald, Ramu Movva, Kyle Stapley Young, Kok Wai Chan
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Publication number: 20150295869Abstract: Technologies are described herein for filtering of electronic messages. A method for filtering messages includes receiving an electronic message for transmission to a recipient, generating a fingerprint for the electronic message, determining if the electronic message is associated with a known cluster of previously transmitted electronic messages, and filtering the electronic message based on the determining. The fingerprint is a fixed length of appended bits selected from hash values determined by applying hash functions to separate textual words included in the electronic message.Type: ApplicationFiled: April 14, 2014Publication date: October 15, 2015Inventors: Weisheng Li, Kok Wai Chan, Rui Chen
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Patent number: 8997189Abstract: Embodiments of multi-user web service sign-in client side components are presented herein. In an implementation, the currently authenticated user account of a first application of a client is transferred to another application of a client. In another implementation, a common credential store is used to share data for a plurality of user accounts associated with a client between a plurality of applications of the client, and for the applications to output multi-user interfaces having portions corresponding to the plurality of accounts.Type: GrantFiled: May 31, 2013Date of Patent: March 31, 2015Assignee: Microsoft Technology Licensing, LLCInventors: Erren Dusan Lester, Kok Wai Chan, Lynn C. Ayres, Naresh Jain, Rui Chen, Trevin M. Chow
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Publication number: 20130263285Abstract: Embodiments of multi-user web service sign-in client side components are presented herein. In an implementation, the currently authenticated user account of a first application of a client is transferred to another application of a client. In another implementation, a common credential store is used to share data for a plurality of user accounts associated with a client between a plurality of applications of the client, and for the applications to output multi-user interfaces having portions corresponding to the plurality of accounts.Type: ApplicationFiled: May 31, 2013Publication date: October 3, 2013Inventors: Erren Dusan Lester, Kok Wai Chan, Lynn C. Ayres, Naresh Jain, Rui Chen, Trevin M. Chow
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Patent number: 8458775Abstract: Embodiments of multi-user web service sign-in client side components are presented herein. In an implementation, the currently authenticated user account of a first application of a client is transferred to another application of a client. In another implementation, a common credential store is used to share data for a plurality of user accounts associated with a client between a plurality of applications of the client, and for the applications to output multi-user interfaces having portions corresponding to the plurality of accounts.Type: GrantFiled: August 11, 2006Date of Patent: June 4, 2013Assignee: Microsoft CorporationInventors: Erren Dusan Lester, Lynn C Ayres, Trevin M Chow, Kok Wai Chan, Rui Chen, Naresh Jain
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Patent number: 8341718Abstract: An integrated authentication service is described which may receive a bundled request from one or more clients. One or more of the described techniques may be utilized to provide, in response to a single bundled request, a token for proof of identity and a certificate for establishing secure communications.Type: GrantFiled: December 10, 2010Date of Patent: December 25, 2012Assignee: Microsoft CorporationInventors: Trevin M Chow, Pui-Yin Winfred Wong, Yordan I Rouskov, Kok Wai Chan, Wei Jiang, Colin Chow, Sanjeev M Nagvekar, Matt Sullivan, Kalyan Sayyaparaju, Dilip K. Pai, Avinash Belur