Abstract: Provided is a liquid surface protective material for semiconductor wafer processing, which is excellent in property of embedding a semiconductor wafer surface, and in which an adhesive residue (adhesion of a residue of the surface protective material) on the semiconductor wafer surface after the peeling can be suppressed. The liquid surface protective material for semiconductor wafer processing includes an acrylic emulsion resin. In addition, a protective film is formed of the liquid surface protective material for semiconductor wafer processing. A method of processing a semiconductor wafer includes: applying a liquid surface protective material for semiconductor wafer processing to a surface of the semiconductor wafer on which a circuit pattern is formed, to form a protective film; grinding a surface of the semiconductor wafer on which the protective film is not formed; and peeling off and removing the protective film.

Abstract: Provided is a paint-protective coating material formed from an acrylic coating composition comprising an acrylic polymer as base polymer. The acrylic polymer-forming monomers includes a monomer (mT) having a homopolymer Tg of 90° C. or higher and a monomer (mL) having a homopolymer Tg of ?30° C. or lower. The monomer (mT) includes at least acrylonitrile. In the monomers, the monomers (mT) and (mL) have a molar ratio (mT/mL) of 0.8 or higher and 1.5 or lower. The paint-protective coating material has storage moduli of 150 MPa or higher and 1000 MPa or lower at 23° C., and 0.40 MPa or higher at 70° C.

Abstract: Provided is a paint-protective coating material formed from a liquid coating composition. The coating composition comprises, as its base polymer, a polymer (A) that is a polymerization product of monomers comprising an acrylic monomer. The paint-protective coating material has a storage modulus at 70° C. of 0.40 MPa or higher and 1.30 or lower, a storage modulus at 23° C. of 250 MPa or higher and 800 MPa or lower, and a storage modulus at ?30° C. of 2300 MPa or less.

Abstract: Provided is a paint-protective coating material formed from a liquid coating composition. The coating composition comprises, as its base polymer, a polymer (A) that is a polymerization product of monomers comprising an acrylic monomer. The polymer (A) has an SP value of 9.8 (cal/cm3)1/2 or greater and a glass transition temperature of 0° C. or lower, calculated based on the composition of the monomers forming the polymer (A).

Abstract: Provided is a paint-protective coating material formed from a liquid coating composition. The coating composition comprises, as its base polymer, a polymer (A) that is a polymerization product of monomers comprising an acrylic monomer. The paint-protective coating material has a storage modulus at 70° C. of 0.40 MPa or higher and 1.30 or lower, a storage modulus at 23° C. of 250 MPa or higher and 800 MPa or lower, and a storage modulus at ?30° C. of 2300 MPa or less.

Abstract: Provided is a paint-protective coating material formed from an acrylic coating composition comprising an acrylic polymer as base polymer. The acrylic polymer-forming monomers includes a monomer (mT) having a homopolymer Tg of 90° C. or higher and a monomer (mL) having a homopolymer Tg of ?30° C. or lower. The monomer (mT) includes at least acrylonitrile. In the monomers, the monomers (mT) and (mL) have a molar ratio (mT/mL) of 0.8 or higher and 1.5 or lower. The paint-protective coating material has storage moduli of 150 MPa or higher and 1000 MPa or lower at 23° C., and 0.40 MPa or higher at 70° C.