Patents by Inventor Koki Kitaoka

Koki Kitaoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20020070901
    Abstract: A microwave circuit or a millimeter wave circuit is formed on a semiconductor chip. A multilayer substrate is formed of a first dielectric layer, a second dielectric layer and a third dielectric layer. A high-frequency circuit line with the semiconductor chip mounted thereon is formed on the third dielectric layer. A slot hole is formed on one side of the second dielectric layer and an antenna feeding line is formed on the other side. The first dielectric layer has a plurality of slot holes formed therein that radiate electromagnetic waves. An organic substrate is laminated to the multilayer substrate by an adhesion layer.
    Type: Application
    Filed: April 17, 2001
    Publication date: June 13, 2002
    Inventors: Naoki Sakota, Atsushi Yamada, Koki Kitaoka
  • Patent number: 6388623
    Abstract: A microwave circuit or a millimeter wave circuit is formed on a semiconductor chip. A multilayer substrate is formed of a first dielectric layer, a second dielectric layer and a third dielectric layer. A high-frequency circuit line with the semiconductor chip mounted thereon is formed on the third dielectric layer. A slot hole is formed on one side of the second dielectric layer and an antenna feeding line is formed on the other side. The first dielectric layer has a plurality of slot holes formed therein that radiate electromagnetic waves. An organic substrate is laminated to the multilayer substrate by an adhesion layer.
    Type: Grant
    Filed: April 17, 2001
    Date of Patent: May 14, 2002
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Naoki Sakota, Atsushi Yamada, Koki Kitaoka