Patents by Inventor Koki Nishimuko
Koki Nishimuko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8231285Abstract: A resist pattern forming method using a coating and developing apparatus and an aligner being connected thereto which are controlled to form a resist film on a surface of a substrate with a base film and a base pattern formed thereon, followed by inspecting at least one of a plurality of measurement items selected from: reflection ratio and film thickness of the base film and the resist film, line width after a development, an accuracy that the base pattern matches with a resist pattern, a defect on the surface after the development, etc. A parameter subject to amendment is selected based on corresponding data of each measurement item, such as the film thickness of the resist and the line width after the development, and amendment of the parameter is performed. This results in a reduced workload of an operator, and the appropriate amendment can be performed.Type: GrantFiled: November 2, 2009Date of Patent: July 31, 2012Assignee: Tokyo Electron LimitedInventors: Kunie Ogata, Koki Nishimuko, Hiroshi Tomita, Yoshio Kimura, Ryouichi Uemura, Michio Tanaka
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Patent number: 7780366Abstract: A resist pattern forming method using a coating and developing apparatus and an aligner being connected thereto which are controlled to form a resist film on a surface of a substrate with a base film and a base pattern formed thereon, followed by inspecting at least one of a plurality of measurement items selected from: reflection ratio and film thickness of the base film and the resist film, line width after a development, an accuracy that the base pattern matches with a resist pattern, a defect on the surface after the development, etc. A parameter subject to amendment is selected based on corresponding data of each measurement item, such as the film thickness of the resist and the line width after the development, and amendment of the parameter is performed. This results in a reduced workload of an operator, and the appropriate amendment can be performed.Type: GrantFiled: July 31, 2007Date of Patent: August 24, 2010Assignee: Tokyo Electron LimitedInventors: Kunie Ogata, Koki Nishimuko, Hiroshi Tomita, Yoshio Kimura, Ryouichi Uemura, Michio Tanaka
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Publication number: 20100047702Abstract: A resist pattern forming method using a coating and developing apparatus and an aligner being connected thereto which are controlled to form a resist film on a surface of a substrate with a base film and a base pattern formed thereon, followed by inspecting at least one of a plurality of measurement items selected from: reflection ratio and film thickness of the base film and the resist film, line width after a development, an accuracy that the base pattern matches with a resist pattern, a defect on the surface after the development, etc. A parameter subject to amendment is selected based on corresponding data of each measurement item, such as the film thickness of the resist and the line width after the development, and amendment of the parameter is performed. This results in a reduced workload of an operator, and the appropriate amendment can be performed.Type: ApplicationFiled: November 2, 2009Publication date: February 25, 2010Applicant: TOKYO ELECTRON LIMITEDInventors: Kunie OGATA, Koki Nishimuko, Hiroshi Tomita, Yoshio Kimura, Ryouichi Uemura, Michio Tanaka
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Patent number: 7488127Abstract: A resist pattern forming apparatus comprising a controller having a controlling portion that controls a processing of a coating and developing apparatus with a coating unit and a developing unit being provided therewith and an aligner being connected thereto, while an inspecting portion and the like measures at least one of a plurality of measurement items selected from, a reflection ratio and a film thickness of a base film and a resist film, a line width after the development, an accuracy that the base film matches with a resist pattern, a defect after the development, and so on. The measured data is transmitted to the controller. At the controller, a parameter subject to an amendment is selected based on the corresponding data of each of the measurement item such as the film thickness of the resist and the line width after the development, and the amendment of the parameters subject to the amendment is performed.Type: GrantFiled: August 9, 2005Date of Patent: February 10, 2009Assignee: Tokyo Electron LimitedInventors: Kunie Ogata, Koki Nishimuko, Hiroshi Tomita, Yoshio Kimura, Ryouichi Uemura, Michio Tanaka
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Publication number: 20080182211Abstract: A resist pattern forming method using a coating and developing apparatus and an aligner being connected thereto which are controlled to form a resist film on a surface of a substrate with a base film and a base pattern formed thereon, followed by inspecting at least one of a plurality of measurement items selected from: reflection ratio and film thickness of the base film and the resist film, line width after a development, an accuracy that the base pattern matches with a resist pattern, a defect on the surface after the development, etc. A parameter subject to amendment is selected based on corresponding data of each measurement item, such as the film thickness of the resist and the line width after the development, and amendment of the parameter is performed. This results in a reduced workload of an operator, and the appropriate amendment can be performed.Type: ApplicationFiled: July 31, 2007Publication date: July 31, 2008Applicant: TOKYO ELECTRON LIMITEDInventors: Kunie OGATA, Koki Nishimuko, Hiroshi Tomita, Yoshio Kimura
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Patent number: 6984477Abstract: A resist pattern forming method using a coating and developing apparatus and an aligner being connected thereto which are controlled to form a resist film on a surface of a substrate with a base film and a base pattern formed thereon, followed by inspecting at least one of a plurality of measurement items selected from: reflection ratio and film thickness of the base film and the resist film, line width after a development, an accuracy that the base pattern matches with a resist pattern, a defect on the surface after the development, etc. A parameter subject to amendment is selected based on corresponding data of each measurement item, such as the film thickness of the resist and the line width after the development, and amendment of the parameter is performed. This results in a reduced workload of an operator, and an appropriate amendment can be performed.Type: GrantFiled: September 27, 2001Date of Patent: January 10, 2006Assignee: Tokyo Electron LimitedInventors: Kunie Ogata, Koki Nishimuko, Hiroshi Tomita, Yoshio Kimura, Ryouichi Uemura, Michio Tanaka
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Publication number: 20050271382Abstract: A resist pattern forming apparatus comprising a controller having a controlling portion that controls a processing of a coating and developing apparatus with a coating unit and a developing unit being provided therewith and an aligner being connected thereto, while an inspecting portion and the like measures at least one of a plurality of measurement items selected from, a reflection ratio and a film thickness of a base film and a resist film, a line width after the development, an accuracy that the base film matches with a resist pattern, a defect after the development, and so on. The measured data is transmitted to the controller. At the controller, a parameter subject to an amendment is selected based on the corresponding data of each of the measurement item such as the film thickness of the resist and the line width after the development, and the amendment of the parameters subject to the amendment is performed.Type: ApplicationFiled: August 9, 2005Publication date: December 8, 2005Inventors: Kunie Ogata, Koki Nishimuko, Hiroshi Tomita, Yoshio Kimura, Ryouichi Uemura, Michio Tanaka
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Publication number: 20020037462Abstract: A resist pattern forming apparatus comprising a controller having a controlling portion that controls a processing of a coating and developing apparatus with a coating unit and a developing unit being provided therewith and an aligner being connected thereto, while an inspecting portion and the like measures at least one of a plurality of measurement items selected from, a reflection ratio and a film thickness of a base film and a resist film, a line width after the development, an accuracy that the base film matches with a resist pattern, a defect after the development, and so on. The measured data is transmitted to the controller. At the controller, a parameter subject to an amendment is selected based on the corresponding data of each of the measurement item such as the film thickness of the resist and the line width after the development, and the amendment of the parameters subject to the amendment is performed.Type: ApplicationFiled: September 27, 2001Publication date: March 28, 2002Inventors: Kunie Ogata, Koki Nishimuko, Hiroshi Tomita, Yoshio Kimura, Ryouichi Uemura, Michio Tanaka
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Patent number: 6281962Abstract: Inspection equipment for detecting defects in a wafer is provided in a coating and developing system including a plurality of kinds of processing units for performing processing necessary for coating a wafer with a resist and processing necessary for developing the resist on the wafer. The transfer of the wafer between the processing units and the inspection equipment is performed by means of a main transfer device. The inspection equipment sends an inspection result as a detection signal to a controller, and the controller which receives the detection signal controls exposure conditions for an aligner according to the presence or absence of defects and adjusts a frequency regulating mechanism to control inspection frequency. The wafer is transferred between the processing units and the inspection equipment by the main transfer device, whereby the wafer is not artificially contaminated.Type: GrantFiled: December 17, 1999Date of Patent: August 28, 2001Assignee: Tokyo Electron LimitedInventors: Kunie Ogata, Koki Nishimuko