Abstract: Described herein is a stacked package according to the present invention, wherein a plurality of tape carriers which seal semiconductor chips, are multilayered in upward and downward directions. In the stacked package, one ends of leads formed over the whole surfaces of each tape carrier are electrically connected to their corresponding connecting terminals of the semiconductor chip. Other ends of the leads are electrically connected to their corresponding through holes defined in the tape carrier. Connecting terminals common to the plurality of semiconductor chips are formed at the same places of the plurality of tape carriers and withdrawn to the same external connecting terminals through a plurality of mutually-penetrated through holes.

Abstract: A low cost, a low power consumption and a small size are three very important factors for a mobile communication terminal. A great problem is posed by the conventional technique using a DSP and a CPU independent of each other which requires two external memory systems. Also, two peripheral units are required for data input and output of the DSP and CPU. As a result, an extraneous communication overhead occurs between the DSP and the CPU. The invention realizes a mobile communication terminal system by a DSP/CPU integrated chip comprising a DSP/CPU core (500) integrated as a single bus master, an integrated external bus interface (606) and an integrated peripheral circuit interface. The memory systems and the peripheral circuits of the DSP and the CPU can thus be integrated to realize a mobile communication terminal system low in cost and power consumption and small in size.

Abstract: Described herein is a stacked package according to the present invention, wherein a plurality of tape carriers which seal semiconductor chips, are multilayered in upward and downward directions. In the stacked package, one ends of leads formed over the whole surfaces of each tape carrier are electrically connected to their corresponding connecting terminals of the semiconductor chip. Other ends of the leads are electrically connected to their corresponding through holes defined in the tape carrier. Connecting terminals common to the plurality of semiconductor chips are formed at the same places of the plurality of tape carriers and withdrawn to the same external connecting terminals through a plurality of mutually-penetrated through holes.

Abstract: Described herein is a stacked package according to the present invention, wherein a plurality of tape carriers which seal semiconductor chips, are multilayered in upward and downward directions. In the stacked package, one ends of leads formed over the whole surfaces of each tape carrier are electrically connected to their corresponding connecting terminals of the semiconductor chip. Other ends of the leads are electrically connected to their corresponding through holes defined in the tape carrier. Connecting terminals common to the plurality of semiconductor chips are formed at the same places of the plurality of tape carriers and withdrawn to the same external connecting terminals through a plurality of mutually-penetrated through holes.

Abstract: An information processing apparatus includes a master module serving as a transfer source, a slave module serving as a transfer destination, a bus of a source clock synchronous system, and a means for transferring a signal based upon a protocol of an acknowledge type from the slave module to the master module via the bus of the source clock synchronous system. In the information processor, the signals of the acknowledge type are also transferred in the source clock synchronous system by using a source clock signal dedicated to signals of the acknowledge type. Therefore, it is prevented that the master side fails in acquiring signals of the acknowledge type from the slave side, and the reliability of the source clock synchronous bus and the data efficiency can be improved.

Abstract: An information processing apparatus includes a master module serving as a transfer source, a slave module serving as a transfer destination, a bus of a source clock synchronous system, and a means for transferring a signal based upon a protocol of an acknowledge type from the slave module to the master module via the bus of the source clock synchronous system. In the information processor, the signals of the acknowledge type are also transferred in the source clock synchronous system by using a source clock signal dedicated to signals of the acknowledge type. Therefore, it is prevented that the master side fails in acquiring signals of the acknowledge type from the slave side, and the reliability of the source clock synchronous bus and the data efficiency can be improved.

Abstract: Described herein is a stacked package according to the present invention, wherein a plurality of tape carriers which seal semiconductor chips, are multilayered in upward and downward directions. In the stacked package, one ends of leads formed over the whole surfaces of each tape carrier are electrically connected to their corresponding connecting terminals of the semiconductor chip. Other ends of the leads are electrically connected to their corresponding through holes defined in the tape carrier. Connecting terminals common to the plurality of semiconductor chips are formed at the same places of the plurality of tape carriers and withdrawn to the same external connecting terminals through a plurality of mutually-penetrated through holes.

Abstract: A built-in memory is divided into the following two types: first memories 5 and 7 and second memories 4 and 6, and made accessible in parallel by third buses XAB and XDB and second buses YAB and YDB respectively. Thereby, a CPU core 2 can simultaneously transfer two data values from the built-in memory to a DSP engine 3. Moreover, the third buses XAB and XDB and the second buses YAB and YDB are also separate from first buses IAB and IDB to be externally interfaced and the CPU core 2 can access an external memory in parallel with the access to the second memories 4 and 6 and the first memories 5 and 7.

Abstract: Described herein is a stacked package according to the present invention, wherein a plurality of tape carriers which seal semiconductor chips, are multilayered in upward and downward directions. In the stacked package, one ends of leads formed over the whole surfaces of each tape carrier are electrically connected to their corresponding connecting terminals of the semiconductor chip. Other ends of the leads are electrically connected to their corresponding through holes defined in the tape carrier. Connecting terminals common to the plurality of semiconductor chips are formed at the same places of the plurality of tape carriers and withdrawn to the same external connecting terminals through a plurality of mutually-penetrated through holes.

Abstract: A built-in memory is divided into the following two types: first memories 5 and 7 and second memories 4 and 6, and made accessible in parallel by third buses XAB and XDB and second buses YAB and YDB respectively. Thereby, a CPU core 2 can simultaneously transfer two data values from the built-in memory to a DSP engine 3.

Abstract: Described herein is a stacked package according to the present invention, wherein a plurality of tape carriers which seal semiconductor chips, are multilayered in upward and downward directions. In the stacked package, one ends of leads formed over the whole surfaces of each tape carrier are electrically connected to their corresponding connecting terminals of the semiconductor chip. Other ends of the leads are electrically connected to their corresponding through holes defined in the tape carrier. Connecting terminals common to the plurality of semiconductor chips are formed at the same places of the plurality of tape carriers and withdrawn to the same external connecting terminals through a plurality of mutually-penetrated through holes.

Abstract: A built-in memory is divided into the following two types: first memories 5 and 7 and second memories 4 and 6, and made accessible in parallel by third buses XAB and XDB and second buses YAB and YDB respectively. Thereby, a CPU core 2 can simultaneously transfer two data values from the built-in memory to a DSP engine 3. Moreover, the third buses XAB and XDB and the second buses YAB and YDB are also separate from first buses IAB and IDB to be externally interfaced and the CPU core 2 can access an external memory in parallel with the access to the second memories 4 and 6 and the first memories 5 and 7.

Abstract: Disclosed herein are a semiconductor integrated circuit and a recording medium wherein the amount of test data inputted from and outputted to the outside to test a plurality of circuit modules and the amount of test result data are reduced and a test time interval is shortened. When each of tested circuits is tested, test control information is externally inputted to a test interface circuit, and test control information is set to each of scan registers of circuit modules to be tested, through a test signal chain. When an instruction for a test operation is given to each of test control circuits through a control terminal, a test circuit allows the tested circuits to be tested based on the test control information on a parallel basis. Test results are read into the test interface circuit from the scan registers through the test signal chain, followed by output to the outside.

Abstract: A low cost, a low power consumption and a small size are three very important factors for a mobile communication terminal. A great problem is posed by the conventional technique using a DSP and a CPU independent of each other which requires two external memory systems. Also, two peripheral units are required for data input and output of the DSP and CPU. As a result, an extraneous communication overhead occurs between the DSP and the CPU. The invention realizes a mobile communication terminal system by a DSP/CPU integrated chip comprising a DSP/CPU core (500) integrated as a single bus master, an integrated external bus interface (606) and an integrated peripheral circuit interface. The memory systems and the peripheral circuits of the DSP and the CPU can thus be integrated to realize a mobile communication terminal system low in cost and power consumption and small in size.

Abstract: Disclosed herein are a semiconductor integrated circuit and a recording medium wherein the amount of test data inputted from and outputted to the outside to test a plurality of circuit modules and the amount of test result data are reduced and a test time interval is shortened. When each of tested circuits is tested, test control information is externally inputted to a test interface circuit, and test control information is set to each of scan registers of circuit modules to be tested, through a test signal chain. When an instruction for a test operation is given to each of test control circuits through a control terminal, a test circuit allows the tested circuits to be tested based on the test control information on a parallel basis. Test results are read into the test interface circuit from the scan registers through the test signal chain, followed by output to the outside.

Abstract: Described herein is a stacked package according to the present invention, wherein a plurality of tape carriers which seal semiconductor chips, are multilayered in upward and downward directions. In the stacked package, one ends of leads formed over the whole surfaces of each tape carrier are electrically connected to their corresponding connecting terminals of the semiconductor chip. Other ends of the leads are electrically connected to their corresponding through holes defined in the tape carrier. Connecting terminals common to the plurality of semiconductor chips are formed at the same places of the plurality of tape carriers and withdrawn to the same external connecting terminals through a plurality of mutually-penetrated through holes.

Abstract: Disclosed herein are a semiconductor integrated circuit and a recording medium wherein the amount of test data inputted from and outputted to the outside to test a plurality of circuit modules and the amount of test result data are reduced and a test time interval is shortened. When each of tested circuits is tested, test control information is externally inputted to a test interface circuit, and test control information is set to each of scan registers of circuit modules to be tested, through a test signal chain. When an instruction for a test operation is given to each of test control circuits through a control terminal, a test circuit allows the tested circuits to be tested based on the test control information on a parallel basis. Test results are read into the test interface circuit from the scan registers through the test signal chain, followed by output to the outside.

Abstract: A low cost, a low power consumption and a small size are three very important factors for a mobile communication terminal. A great problem is posed by the conventional technique using a DSP and a CPU independent of each other which requires two external memory systems. Also, two peripheral units are required for data input and output of the DSP and CPU. As a result, an extraneous communication overhead occurs between the DSP and the CPU. The invention realizes a mobile communication terminal system by a DSP/CPU integrated chip comprising a DSP/CPU core (500) integrated as a single bus master, an integrated external bus interface (606) and an integrated peripheral circuit interface. The memory systems and the peripheral circuits of the DSP and the CPU can thus be integrated to realize a mobile communication terminal system low in cost and power consumption and small in size.

Abstract: In microcomputers and digital signal processorspin which a central processing unit for controlling the entire system and a digital signal processing unit having a product sum function required to process digital signals efficiently are mounted on one and the same chippthis invention prevents an increase in the number of processing steps caused by differing types of data handled by the calculators, thereby enhancing the efficiency of the digital signal processing.

Abstract: Described herein is a stacked package according to the present invention, wherein a plurality of tape carriers which seal semiconductor chips, are multilayered in upward and downward directions. In the stacked package, one ends of leads formed over the whole surfaces of each tape carrier are electrically connected to their corresponding connecting terminals of the semiconductor chip. Other ends of the leads are electrically connected to their corresponding through holes defined in the tape carrier. Connecting terminals common to the plurality of semiconductor chips are formed at the same places of the plurality of tape carriers and withdrawn to the same external connecting terminals through a plurality of mutually-penetrated through holes.