Patents by Inventor Koki SHIRAISHI

Koki SHIRAISHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ADHESIVE FOR ELECTRICAL STORAGE DEVICE PACKAGING MATERIAL, ELECTRICAL STORAGE DEVICE PACKAGING MATERIAL, ELECTRICAL STORAGE DEVICE CONTAINER, AND ELECTRICAL STORAGE DEVICE
    Publication number: 20230313007
    Abstract: An adhesive for an electrical storage device packaging material containing a polyol compound (A), a polyisocyanate compound (B), and an epoxy resin (C), in which the polyol compound (A) contains an ester bond-containing polyol, and the following formula is satisfied when a stress at the time when a cured film obtained by performing curing under the condition of 80° C. for 2 weeks is stretched to twice its length at a speed of 6 mm/min under an environment of 20° C. and 65% RH is S1 [N/mm2], and a stress at the time when the cured film is held for 100 seconds in a stretched state is S2 [N/mm2]. Formula: 10.0?(S1?S2)/S1×100?40.0.
    Type: Application
    Filed: March 29, 2023
    Publication date: October 5, 2023
    Applicants: TOYO INK SC HOLDINGS CO., LTD., TOYO-MORTON, LTD., TOYOCHEM CO., LTD.
    Inventors: Koki SHIRAISHI, Hiroshi HANAKI, Tsutomu HIROSHIMA, Takafumi AKIYAMA