Abstract: A photoelectric conversion element includes a light guiding unit in which, on each of a first plane, a second plane, and a third plane, a first part of the light guiding unit and a second part of the light guiding unit, which is surrounded by the first part and a refractive index of which is lower than that of the first part, are included, a width of the second part on the first plane is a first length, the width of the second part on the second plane is a second length, and the width of the second part on the third plane is a third length, and the second length is shorter than each of the first length and the third length.

Abstract: Provided are a solid-state image pickup apparatus which includes: a semiconductor substrate having a plurality of photoelectric converters; a first and a second insulating layers formed on the semiconductor substrate; an optical waveguide formed above each of the plurality of photoelectric converters and in an opening portion of the first and the second insulating layers, and has a refractive index higher than a refractive index of the first insulating layer; and a light reflecting layer formed at a boundary between the optical waveguide and the second insulating layer, and has a refractive index lower than a refractive index of the optical waveguide, where the following expression is satisfied: ?<90°, where a represents an angle formed by a boundary surface between the light reflecting layer and the second insulating layer with respect to a boundary surface between the first insulating layer and the second insulating layer.

Abstract: An image sensor includes a plurality of pixels. At least a pixel of the plurality of pixels includes a plurality of photoelectric converters arranged in a semiconductor substrate and a light waveguide provided for the plurality of photoelectric converters. The light waveguide includes a main waveguide surrounded by an insulation film so as to pass light entering the plurality of photoelectric converters, and a plurality of sub waveguides each arranged between the main waveguide and a corresponding photoelectric converter of the plurality of photoelectric converters. The plurality of sub waveguides are separated from each other by a separator including an electrically conductive member.

Abstract: A photoelectric conversion element includes a light guiding unit in which, on each of a first plane, a second plane, and a third plane, a first part of the light guiding unit and a second part of the light guiding unit, which is surrounded by the first part and a refractive index of which is lower than that of the first part, are included, a width of the second part on the first plane is a first length, the width of the second part on the second plane is a second length, and the width of the second part on the third plane is a third length, and the second length is shorter than each of the first length and the third length.

Abstract: An image sensor includes a plurality of pixels. At least a pixel of the plurality of pixels includes a plurality of photoelectric converters arranged in a semiconductor substrate and a light waveguide provided for the plurality of photoelectric converters. The light waveguide includes a main waveguide surrounded by an insulation film so as to pass light entering the plurality of photoelectric converters, and a plurality of sub waveguides each arranged between the main waveguide and a corresponding photoelectric converter of the plurality of photoelectric converters. The plurality of sub waveguides are separated from each other by a separator including an electrically conductive member.

Abstract: Provided are a solid-state image pickup apparatus which includes: a semiconductor substrate having a plurality of photoelectric converters; a first and a second insulating layers formed on the semiconductor substrate; an optical waveguide formed above each of the plurality of photoelectric converters and in an opening portion of the first and the second insulating layers, and has a refractive index higher than a refractive index of the first insulating layer; and a light reflecting layer formed at a boundary between the optical waveguide and the second insulating layer, and has a refractive index lower than a refractive index of the optical waveguide, where the following expression is satisfied: ?<90°, where a represents an angle formed by a boundary surface between the light reflecting layer and the second insulating layer with respect to a boundary surface between the first insulating layer and the second insulating layer.

Abstract: Provided is a method of manufacturing an electronic device, including: forming a first electrode over a substrate forming a first insulating layer over the first electrode; forming a second electrode over the first insulating layer; forming a second insulating layer over the second electrode; and polishing a surface of the second insulating layer by CMP, in which an end portion of the second electrode that is closest to a rim of the substrate is formed at a location closer to the rim of the substrate than an end portion of the first electrode that is closest to the rim of the substrate is.

Abstract: A method for producing a semiconductor device includes preparing a wafer having plural portions and having an insulator having plural openings thereon, forming an embedding member in each of the plural openings and on the insulator, removing at least a part of the embedding member, and planarizing the embedding member. The plural portions have a first portion and a second portion and each of the first portion and the second portion has a first region and a second region. The density of the openings in the first region is higher than that in the second region. The process of removing at least a part of the embedding member includes removing the embedding member positioned in the second region of the first portion, and removing the embedding member positioned in the second region of the second portion. A first removal amount and a second removal amount in the processes are different.

Abstract: Provided is a method of manufacturing an electronic device, including: forming a first electrode over a substrate; forming a first insulating layer over the first electrode; forming a second electrode over the first insulating layer; forming a second insulating layer over the second electrode; and polishing a surface of the second insulating layer by CMP, in which an end portion of the second electrode that is closest to a rim of the substrate is formed at a location closer to the rim of the substrate than an end portion of the first electrode that is closest to the rim of the substrate is.

Abstract: A method for producing a semiconductor device includes preparing a wafer having plural portions and having an insulator having plural openings thereon, forming an embedding member in each of the plural openings and on the insulator, removing at least a part of the embedding member, and planarizing the embedding member. The plural portions have a first portion and a second portion and each of the first portion and the second portion has a first region and a second region. The density of the openings in the first region is higher than that in the second region. The process of removing at least a part of the embedding member includes removing the embedding member positioned in the second region of the first portion, and removing the embedding member positioned in the second region of the second portion. A first removal amount and a second removal amount in the processes are different.