Abstract: An in-vehicle backup power supply device includes a battery unit having a plurality of unit batteries connected in series and a discharge circuit configured to perform a first discharge operation for supplying power to a third conductive path based on a charge accumulated in the battery unit, a balance circuit performs a cell balancing operation on the battery unit, and a control unit controls the balance circuit, and the balance circuit is performs a second discharge operation for supplying power to the third conductive path based on a charge accumulated in a plurality of power storage elements, and the control unit performs a first control for causing the balance circuit to perform the cell balancing operation and a second control for causing the balance circuit to perform the second discharge operation, and if a failure in which the first discharge operation cannot operate normally occurs, performs the second control.

Abstract: A method for controlling a hot metal temperature, includes: a first control loop for calculating a target value of pulverized coal ratio such that a hot metal temperature, predicted by a physical model that is able to calculate conditions inside a blast furnace, falls within a preset target range; and a second control loop for calculating pulverized coal flow rate manipulation quantity to compensate for a deviation between the pulverized coal ratio target value and a current pulverized coal ratio actual value.

Abstract: A metal member-equipped circuit board 21 includes: a printed circuit board 22 including a through hole 25; a metal member 30 including a shaft portion 31 that is inserted into the through hole 25, and a head portion 32 that is arranged outside the through hole 25, the head portion 32 having a diameter larger than a diameter A1 of the through hole 25, and a conductive bonding material 35 for bonding the shaft portion 31 and an inner wall of the through hole 25 to each other.

Abstract: Provided is a substrate unit including a case accommodating a circuit board; a bus bar electrically connected to the circuit board, and includes an extending portion extending out of the case; and an external thread portion for electrically connecting the extending portion to a connection terminal of a wire harness, the external thread portion including a shaft portion with an external thread, and a head portion that is noncircular, and protrudes at one end portion of the shaft portion in a radial direction of the shaft portion, wherein the case includes a fitting recess to which the head portion is fitted by sliding the external thread portion in a direction intersecting an axial direction of the external thread portion, and that has an abutment surface by which the head portion is stopped, and, at least on the two sides of the abutment surface, relief recesses that define a gap.

Abstract: The present invention provides: a binder for inorganic fibers, the binder being characterized by containing (B) an ammonia-modified maleic anhydride-containing copolymer at a quantity of 3 parts by mass or more relative to 100 parts by mass of (A) a cellulose ether having a viscosity at 20° C. of 500 mPa·s or less when in the form of a 2 mass % aqueous solution: and an inorganic fiber mat comprising inorganic fibers treated with the binder for inorganic fibers. By using this binder for inorganic fibers, it is possible to produce an inorganic fiber mat having a high recoverability similar to that of a phenol resin, and the amount of volatile organic compounds released from the inorganic fiber mat is extremely low.

Abstract: An object is to suitably press a composite material. A processing apparatus 10 includes: a mold 11 having a pressing surface 11a configured to press a composite material 1 in which a resin and fibers are compounded; a cooling water pipe 12 configured to adjust the temperature of the composite material 1; and a graphite sheet 13 provided between the pressing surface 11a and the composite material 1 and deformed by pressing force from the mold 11, the graphite sheet 13 having higher thermal conductivity in a direction along the pressing surface than in a direction intersecting the pressing surface. The graphite sheet 13 is provided between the entire surface of the pressing surface 11a and the composite material 1.

Abstract: The present invention provides a binder for inorganic fibers characterized by containing (A) 100 parts by mass of a polyvinyl alcohol-based resin having a degree of polymerization of 100-3500, (B) 1-50 parts by mass of a metal salt, and (C) 3 parts by mass of an ammonia denatured product of a copolymerization product containing maleic anhydride. By using the binder for inorganic fibers according to the present invention, it is possible to produce an inorganic fiber mat having a high recovery rate comparable to that of phenol resins. In addition, the amount of volatile organic compounds released from such an inorganic fiber mat is extremely low.

Abstract: The present invention provides a vinyl acetate-silicone copolymer resin obtained by graft polymerization of vinyl acetate (B) onto an organopolysiloxane (A) represented by a specific general formula, wherein a weight ratio of the organopolysiloxane (A) to the vinyl acetate (B) is (A):(B)=10:90 to 95:5, a method for producing the same, and a vinyl acetate-silicone copolymer resin composition. The vinyl acetate-silicone copolymer resin of the present invention has slidability, substrate adhesiveness, and organic solvent solubility, and is suitably used for coating agents for various substrates, adhesive agents, exterior and interior paints for structures and building materials and the like, and cosmetics and the like.

Abstract: Provided is a composite material molding apparatus that can evenly heat a molding surface of a metal mold and shorten the cycle time. The composite material molding apparatus includes an upper die and a lower die having molding surfaces that accommodate a composite material member and shape the composite material member. The upper die and the lower die each have a planar graphite heater provided along installation positions so as to have a constant distance from the molding surface in a manner corresponding to the shape of the molding surface.

Abstract: An object is to significantly control the position of a void in a bonding material for bonding a metal member to a circuit board. A metal member equipped circuit board includes a circuit board in which a through hole is formed; a metal member disposed in the through hole forming a gap between the metal member and an inner peripheral surface of the through hole; and a bonding member that bonds together the circuit board and the metal member, wherein in a direction following an outer periphery of the metal member, a gap between an outer peripheral surface of the metal member and the inner peripheral surface of the through hole varies, and a void is present in a portion with a widest gap between the outer peripheral surface of the metal member and the inner peripheral surface of the through hole.

Abstract: Provided is a technique that can raise the temperature of a battery unit more effectively with a simpler configuration. An in-vehicle backup power supply device includes a battery unit in which a plurality of unit batteries are connected in series, a voltage conversion unit provided with a plurality of converters that step up or down a voltage that is input and output the resultant voltage, and a control unit configured to control the voltage conversion unit, a first circuit unit constituting a power path between the voltage conversion unit and the battery unit; and a second circuit unit constituting a power path between the voltage conversion unit and a load, the battery unit is provided with a plurality of conversion target portions, the conversion target portions are constituted by the unit battery or a plurality of the unit batteries connected in series.

Abstract: An in-vehicle backup power supply device includes a battery unit having a plurality of unit batteries connected in series and a discharge circuit configured to perform a first discharge operation for supplying power to a third conductive path based on a charge accumulated in the battery unit, a balance circuit performs a cell balancing operation on the battery unit, and a control unit controls the balance circuit, and the balance circuit is performs a second discharge operation for supplying power to the third conductive path based on a charge accumulated in a plurality of power storage elements, and the control unit performs a first control for causing the balance circuit to perform the cell balancing operation and a second control for causing the balance circuit to perform the second discharge operation, and if a failure in which the first discharge operation cannot operate normally occurs, performs the second control.

Abstract: A connector is realized that can simplify an electrical connection and a physical connection between a connector-related component such as a housing or a wiring part, and a power storage element. A connector includes a housing, a wiring part, and a power storage element. The power storage element is attached to the housing while being held by the housing. The power storage element is configured to be charged with power supplied via the wiring part, and discharge via the wiring part.

Abstract: A metal member-equipped circuit board 21 includes: a printed circuit board 22 including a through hole 25; a metal member 30 including a shaft portion 31 that is inserted into the through hole 25, and a head portion 32 that is arranged outside the through hole 25, the head portion 32 having a diameter larger than a diameter A1 of the through hole 25, and a conductive bonding material 35 for bonding the shaft portion 31 and an inner wall of the through hole 25 to each other.

Abstract: A circuit assembly includes: a substrate formed with a ground pattern and a through-hole; a metal member that is inserted into the through-hole and electrically connected to the ground pattern; a heat dissipation member made of metal, that is overlaid on the substrate and can be connected to an external ground potential; and conductive paste that connects the metal member and the heat dissipation member.

Abstract: The present invention provides a binder that is for inorganic fibers and that is characterized by containing (A) 100 parts by mass of a polyvinyl alcohol resin having a degree of polymerization of 100-3500, (B) 1-50 parts by mass of colloidal silica having an average particle size of 100 nm or less, and (C) 3 parts by mass or more of an ammonia-modified copolymer containing maleic anhydride. By using the binder for inorganic fibers according to the present invention, an inorganic fiber mat having resiliency comparable to that of phenolic resins can be fabricated, and the amount of volatile organic compounds released from the inorganic fiber mat is very small.

Abstract: A metal member-equipped circuit board includes: a printed circuit board including a through hole; a metal member including a shaft portion that is inserted into the through hole, and a head portion that is arranged outside the through hole, the head portion having a diameter larger than a diameter of the through hole, and a conductive bonding material for bonding the shaft portion and an inner wall of the through hole to each other.

Abstract: A circuit assembly includes a busbar substrate with busbars and a resin part that is in intimate contact with the busbars, a press-fit member that is made of metal with a thickness greater than the thickness of the busbars, and is press-fitted in the busbar substrate, an electronic component connected to the press-fit member, solder that connects the busbars and the press-fit member, and a solder accumulating portion that is formed with the resin part, and in which the solder is accumulated.

Abstract: A circuit assembly includes: a substrate formed with a ground pattern and a through-hole; a metal member that is inserted into the through-hole and electrically connected to the ground pattern; a heat dissipation member made of metal, that is overlaid on the substrate and can be connected to an external ground potential; and conductive paste that connects the metal member and the heat dissipation member.

Abstract: A circuit assembly includes a substrate having a thermally conductive portion that passes through a substrate in the plate-thickness direction thereof, and that includes an electrically conductive path. A semiconductor package is mounted to the substrate and includes a chip. A resin portion covers the chip. A first lead portion is connected to the chip and is exposed on the substrate side of the resin portion. A second lead portion is connected to the chip and is exposed to the side opposite to the substrate side of the resin portion. A heat dissipating member is arranged facing the side opposite to the semiconductor package with respect to the substrate and is connected to the thermally conductive portion in such a way as to conduct heat. An electrically conductive member connects the second lead portion and the thermally conductive portion.