Patents by Inventor Koki Wakabayashi

Koki Wakabayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8703244
    Abstract: A reinforced-fiber sheet impregnated with a matrix resin, a protective film having an irregular surface is applied to at least one surface of the reinforced-fiber sheet impregnated with the matrix resin such that the irregular surface faces the reinforced-fiber sheet. The thus-formed reinforced-fiber sheet covered with a protective film is kept at a temperature of 50-130° C. for four hours or more such that the viscosity of the impregnated resin is 100-10000 poise.
    Type: Grant
    Filed: June 13, 2008
    Date of Patent: April 22, 2014
    Assignee: Mitsubishi Rayon Co., Ltd.
    Inventors: Shirou Asada, Hisao Koba, Akihiro Ito, Kazutami Mitani, Kimihiro Ikezaki, Koki Wakabayashi
  • Publication number: 20080248204
    Abstract: The present invention relates to a prepreg which is free from the phenomenon that air is trapped between layers to generate voids, has good handling characteristics and can produce molded articles having any complicated shape and also relates to a method of producing the prepreg. A reinforced-fiber sheet is impregnated with a matrix resin so as to form a continuous resin layer at least in the inside thereof, and then, a protective film having an irregular surface is applied to at least one surface of the reinforced-fiber sheet impregnated with the matrix resin such that the irregular surface faces the reinforced-fiber sheet. In this state, the prepreg is allowed to leave at 30 to 60° C. under the atmosphere for 12 hours or more.
    Type: Application
    Filed: June 13, 2008
    Publication date: October 9, 2008
    Applicant: Mitsubishi Rayon Co., Ltd.
    Inventors: Shirou Asada, Hisao Koba, Akihiro Ito, Kazutami Mitani, Kimihiro Ikezaki, Koki Wakabayashi
  • Publication number: 20060020074
    Abstract: The present invention relates to a prepreg which is free from the phenomenon that air is trapped between layers to generate voids, has good handling characteristics and can produce molded articles having any complicated shape and also relates to a method of producing the prepreg. A reinforced-fiber sheet is impregnated with a matrix resin so as to form a continuous resin layer at least in the inside thereof, and then, a protective film having an irregular surface is applied to at least one surface of the reinforced-fiber sheet impregnated with the matrix resin such that the irregular surface faces the reinforced-fiber sheet. In this state, the prepreg is allowed to leave at 30 to 60° C. under the atmosphere for 12 hours or more.
    Type: Application
    Filed: October 23, 2002
    Publication date: January 26, 2006
    Applicant: Mitsubishi Rayon Co., Ltd.
    Inventors: Shirou Asada, Hisao Koba, Akihiro Ito, Kazutami Mitani, Kimihiro Ikezaki, Koki Wakabayashi
  • Patent number: 6838176
    Abstract: Epoxy resin compositions comprising (a) an epoxy resin, (b) a latent curing agent with curing power at 100° C. or below and (c) an aromatic amine-based curing agent and/or an alicyclic amine-based curing agent, which are curable in two stages, or epoxy resin compositions further comprising (d) a curing accelerator, as well as a prepregs comprising reinforcing fiber materials impregnated with the epoxy resin compositions. The compositions give die-releasable cured products by primary curing at low temperature, give highly heat-resistant cured products by secondary curing, and exhibit satisfactory stability at room temperature.
    Type: Grant
    Filed: April 20, 2001
    Date of Patent: January 4, 2005
    Assignee: Mitsubishi Rayon Co., Ltd.
    Inventors: Kazuya Goto, Shigetsugu Hayashi, Tadayoshi Saito, Takashi Kaneko, Kazutami Mitani, Koki Wakabayashi, Yasuo Takagi
  • Publication number: 20030135011
    Abstract: Epoxy resin compositions comprising (a) an epoxy resin, (b) a latent curing agent with curing power at 100° C. or below and (c) an aromatic amine-based curing agent and/or an alicyclic amine-based curing agent, which are curable in two stages, or epoxy resin compositions further comprising (d) a curing accelerator, as well as a prepregs comprising reinforcing fiber materials impregnated with the epoxy resin compositions. The compositions give die-releasable cured products by primary curing at low temperature, give highly heat-resistant cured products by secondary curing, and exhibit satisfactory stability at room temperature.
    Type: Application
    Filed: October 21, 2002
    Publication date: July 17, 2003
    Inventors: Kazuya Goto, Shigetsugu Hayashi, Tadayoshi Saito, Takashi Kaneko, Kazutami Mitani, Koki Wakabayashi, Yasuo Takagi