Abstract: A semiconductor device includes an organic semiconductor layer 10 and an oxide semiconductor layer 11, and emits light.

Abstract: An object of the invention is to provide a TFT substrate and a method for producing a TFT substrate which is capable of drastically reducing the production cost by decreasing the number of steps in the production process and improving production yield. A TFT substrate includes: a substrate; a gate electrode and a gate wire formed above the substrate; a gate insulating film formed above the gate electrode and the gate wire; a first oxide layer formed above the gate insulating film which is formed at least above the gate electrode; and a second oxide layer formed above the first oxide layer; wherein at least a pixel electrode is formed from the second oxide layer.

Abstract: To provide a field-effect transistor improved in transparency, electrical properties, stability, uniformity, reproducibility, heat resistance and durability, and as a reduced overlap capacity between electrodes. A field-effect thin film transistor 1001 includes a gate electrode 1025, an active layer, a source electrode 1022 and a drain electrode 1023, wherein a crystalline oxide 1021 containing indium and having an electron carrier concentration of less than 1018/cm3 is used as the active layer, and the gate electrode 1025 is in self-alignment with the source electrode 1022 and the drain electrode 1023. The crystalline oxide 1021 contains a positive trivalent element different from a positive divalent element or indium.

Abstract: A sputtering target containing oxides of indium (In), gallium (Ga) and zinc (Zn), which includes a compound shown by ZnGa2O4 and a compound shown by InGaZnO4.

Abstract: To provide a thin film transistor having an indium oxide-based semiconductor film which allows only a thin metal film on the semiconductor film to be selectively etched. A thin film transistor having a crystalline indium oxide semiconductor film which is composed mainly of indium oxide and contains a positive trivalent metal oxide.

Abstract: A sputtering target which is formed of a sintered body including an oxide main components of which are In and Sm. A sputtering target in which a sintered body of an oxide including In and Sm as main components is doped with at least one element with an atomic valency of positive tetravalency or higher in an amount of 20 at. % or less relative to the total sum of all cation elements.

Abstract: A sputtering target which is composed of a sintered body of an oxide containing indium, tin and zinc as main components; the atomic ratio of In/(In+Sn+Zn) being 0.10 to 0.35; the atomic ratio of Sn/(In+Sn+Zn) being 0.15 to 0.35; and the atomic ratio of Zn/(In+Sn+Zn) being 0.50 to 0.70; and containing a hexagonal layered compound shown by In2O3(ZnO)m, wherein m is an integer of 3 to 9, and a spinel structure compound shown by Zn2SnO4.

Abstract: A fiber-reinforced resin composition comprising: (A) a polyolefin-based resin; (B) glass fibers having (B1) an average diameter of 3 to 30 ?m and (B2) an average aspect ratio of 50 to 6000; and (C) an acid-modified polypropylene-based resin exhibiting (C1) a change in amount of acid added, measured by Fourier transform infrared spectroscopy, before and after being treated in methyl ethyl ketone at 70° C. for three hours of 0.8 mass % or less, and having (C2) a melt flow rate (load: 2.16 kg, temperature: 230° C.) of 20 to 2000 g/10 min; the composition containing the components (A) to (C) at such a ratio (mass ratio) that (B):[(A)+(C)]=5 to 80:95 to 20 and (A):(C)=0 to 99.5:100 to 0.5.

Abstract: The present invention provides a semiconductor thin film which can be manufactured at a relatively low temperature even on a flexible resin substrate. As a semiconductor thin film having a low carrier concentration, a high Hall mobility and a large energy band gap, an amorphous film containing zinc oxide and tin oxide is formed to obtain a carrier density of 10+17 cm?3 or less, a Hall mobility of 2 cm2/V·sec or higher, and an energy band gap of 2.4 eV or more. Then, the amorphous film is oxidized to form a transparent semiconductor thin film 40.

Abstract: An amorphous transparent conductive film containing as a main component a six oxygen-coordinated metal oxide, and satisfying, in a radial distribution function (RDF) obtained by an X-ray scattering measurement, a relationship of A/B>1, providing that the maximum value of RDF at an interatomic distance of from 0.30 nm to 0.36 nm is A and the maximum value of RDF at an interatomic distance of from 0.36 nm to 0.42 nm is B.

Abstract: To provide an electro-optic apparatus which can directly control alternating current, output significantly high-frequency alternating current, stably output a large amount of power, and reduce manufacturing cost, as well as a TFT substrate for current control and the method for producing the same. A dispersion-type inorganic EL display apparatus 1c as an electro-optic apparatus is provided with a data line-driving circuit 11, a scanning line-driving circuit 12, a power supply line-controlling circuit 13a, a current-measuring circuit 15 and a TFT substrate 100c.

Abstract: This invention provides a transparent oxide semiconductor, which comprises an oxide comprising indium oxide as a main component and cerium oxide as an additive and has such properties that light-derived malfunction does not occur, there is no variation in specific resistance of a thin film caused by heating and the like, and the mobility is high, and a process for producing the same. A semiconductor thin film characterized by comprising indium oxide and cerium oxide and being crystalline and having a specific resistance of 10+1 to 10+8 ?cm is used. This semiconductor thin film has no significant change in specific resistance and has high mobility. Accordingly, an element having improved switching properties can be provided by constructing a switching element using this semiconductor thin film.

Abstract: A sputtering target which is formed of a sintered body including an oxide main components of which are In and Sm. A sputtering target in which a sintered body of an oxide including In and Sm as main components is doped with at least one element with an atomic valency of positive tetravalency or higher in an amount of 20 at. % or less relative to the total sum of all cation elements.

Abstract: A transparent electrode film including an oxide containing indium, zinc and tin and having a thickness of 25 nm or less. A transparent electrode film including an oxide containing indium and zinc and having a thickness of 30 nm or less.

Abstract: A transparent semiconductor thin film 40 having low carrier concentration and a large energy band gap is produced by forming a thin film which contains indium oxide and an oxide of a positive divalent element, and then oxidizing or crystallizing the thin film.

Abstract: An acid-modified polyolefin-based resin for glass fiber treatment having: (1) an amount of components extractable with boiling methyl ethyl ketone of 8 mass % or less; (2) a number average molecular weight (Mn), measured by gel permeation chromatography (GPC), of 6,000 to 48,000; and (3) an amount of an acid which has been added, measured by Fourier transform infrared spectroscopy, of 0.1 to 12 mass %.

Abstract: An object of the invention is to propose a TFT substrate and a reflective TFT substrate which can be operated stably for a prolonged period of time, can be prevented from being suffering from crosstalk, and is capable of significantly reducing manufacturing cost by decreasing the number of production steps, as well as to propose the method for producing these substrates. A TFT substrate 1001 comprises: a glass substrate 1010; a gate electrode 1023 and a gate wire 1024 insulated by having their top surfaces covered with a gate insulating film 1030 and by having their side surfaces covered with an interlayer insulating film 1050; an n-type oxide semiconductor layer 1040 formed on the gate insulating film 1030 above the gate electrode 1023; an oxide transparent conductor layer 1060 formed on the n-type oxide semiconductor layer 1040 with a channel part 1044 interposed therebetween; and a channel guard 1500 for protecting the channel part 1044.

Abstract: Disclosed is a fiber-reinforced polyolefin resin composition containing (A) 1-20 mass % of carbon fibers having a fiber diameter of 3-20 ?m, (B) 3-50 mass % of black lead (graphite) having an average particle diameter of 1-100 ?m, and (C) 25-95 mass % of a polyolefin resin, wherein the mass ratio of the black lead (graphite) (B) (Wg) to the carbon fibers (A) (Wcf), namely mass ratio (Wg/Wcf), is 1-10. Also disclosed is a molded body of such a fiber-reinforced polyolefin resin composition.

Abstract: A semiconductor device including a semiconductor 1, a first electrode 2, an insulating layer 3 interposed between the semiconductor 1 and the first electrode 2, the second electrode 4 which is in contact with the semiconductor 1 and is detached from the first electrode 2, and the third electrode 5 which is in contact with the semiconductor 1 and is detached from the first electrode 2 and the second electrode 4, wherein the semiconductor 1 is provided with the organic semiconductor layer 10 and the oxide semiconductor layer 11.

Abstract: A method for producing a fiber-reinforced resin composition including supplying a plurality of fiber bundles (1) into an impregnation chamber (10); supplying a molten thermoplastic resin from a resin flow inlet (4) into the impregnation chamber (10) so that the amount of the resin flow is almost the same on on each side the direction perpendicular to the fiber bundle (1) progress direction; contacting the molten thermoplastic resin with the fiber bundles (1) to impregnate the fiber bundles (1) with the molten thermoplastic resin; and withdrawing the fiber bundles (1) impregnated with the molten thermoplastic resin from the impregnation chamber (10).