Patents by Inventor KokWah Tan

KokWah Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7848051
    Abstract: An assembly comprises a housing and a rotatable data disc within the housing. The rotatable data disc creates a gas flow within the housing when the rotatable data disc rotates. The assembly further comprises a filter at a perimeter position of the rotatable data disc positioned to capture a portion of the gas flow, a first support element fixed relative to the housing and adjacent an upstream side of the filter, wherein the portion of the gas flow circumscribes the first support element and a second support element fixed to the housing and adjacent a downstream side of the filter, wherein the portion of the gas flow also circumscribes the second support element.
    Type: Grant
    Filed: July 11, 2007
    Date of Patent: December 7, 2010
    Assignee: Seagate Technology LLC
    Inventors: Yiren Hong, Yichao Ma, KokWah Tan
  • Patent number: 7359144
    Abstract: In general, the invention is directed to techniques for forming a seal between parts of an overmold component. The overmold component includes a first part forming one or more thorough-holes and a second part overmolded to the first part. A through-hole may be, for example, a screw hole or an overmold material entrance hole. The through-holes formed by the first part are surrounded by an adhesive prior to overmolding the second part. After overmolding, the adhesive locally bonds the surface of the first part to the overmold part to make a seal around the through holes. For example, the overmold component may combine with a cover to form a housing of a disc drive or other electronic device defining an internal environment. In this example, the adhesive prevents external contaminants from entering the internal environment via the through-holes.
    Type: Grant
    Filed: June 28, 2005
    Date of Patent: April 15, 2008
    Assignee: Seagate Technology LLC
    Inventors: Mo Xu, Johaan S. J. Koong, ChinHup Chua, KhaiYi AuYeong, KokWah Tan
  • Publication number: 20060291093
    Abstract: In general, the invention is directed to techniques for forming a seal between parts of an overmold component. The overmold component includes a first part forming one or more thorough-holes and a second part overmolded to the first part. A through-hole may be, for example, a screw hole or an overmold material entrance hole. The through-holes formed by the first part are surrounded by an adhesive prior to overmolding the second part. After overmolding, the adhesive locally bonds the surface of the first part to the overmold part to make a seal around the through holes. For example, the overmold component may combine with a cover to form a housing of a disc drive or other electronic device defining an internal environment. In this example, the adhesive prevents external contaminants from entering the internal environment via the through-holes.
    Type: Application
    Filed: June 28, 2005
    Publication date: December 28, 2006
    Inventors: Mo Xu, Johaan Koong, ChinHup Chua, KhaiYi AuYeong, KokWah Tan