Patents by Inventor Kolins Chao

Kolins Chao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11916117
    Abstract: A semiconductor Schottky rectifier built in an epitaxial semiconductor layer over a substrate has an anode structure and a cathode structure extending from the surface of the epitaxial layer. The cathode contact structure has a trench structure near the epi-layer and a vertical sidewall surface covered with a gate oxide layer. The cathode structure further comprises a polysilicon element adjacent to the gate oxide layer.
    Type: Grant
    Filed: November 10, 2022
    Date of Patent: February 27, 2024
    Assignee: DIODES INCORPORATED
    Inventors: Kolins Chao, John Huang
  • Publication number: 20230343836
    Abstract: A method for forming a semiconductor Schottky rectifier device includes providing a semiconductor substrate, forming a hard mask for trench etch including openings for guard rings, an anode region, and a cathode region, and etching semiconductor epitaxial material layer to form a plurality of trenches. The method also includes forming a first dielectric layer and depositing a polysilicon layer, performing an anisotropic etch of the polysilicon layer to form polysilicon elements on sidewalls of the trench, and depositing and etching a second dielectric layer to expose a Schottky diode region and a bottom region of the trench in the cathode region. The method further includes depositing a first metal layer and performing a thermal treatment to form metal silicide in the Schottky diode region and the cathode region and forming a second metal layer and separating the second metal layer into an anode electrode and a cathode electrode.
    Type: Application
    Filed: June 14, 2023
    Publication date: October 26, 2023
    Applicant: Diodes Incorporated
    Inventors: Kolins Chao, John Huang
  • Publication number: 20230070850
    Abstract: A semiconductor Schottky rectifier built in an epitaxial semiconductor layer over a substrate has an anode structure and a cathode structure extending from the surface of the epitaxial layer. The cathode contact structure has a trench structure near the epi-layer and a vertical sidewall surface covered with a gate oxide layer. The cathode structure further comprises a polysilicon element adjacent to the gate oxide layer.
    Type: Application
    Filed: November 10, 2022
    Publication date: March 9, 2023
    Applicant: Diodes Incorporated
    Inventors: Kolins Chao, John Huang
  • Patent number: 11527627
    Abstract: A semiconductor Schottky rectifier built in an epitaxial semiconductor layer over a substrate has an anode structure and a cathode structure extending from the surface of the epitaxial layer. The cathode contact structure has a trench structure near the epi-layer and a vertical sidewall surface covered with a gate oxide layer. The cathode structure further comprises a polysilicon element adjacent to the gate oxide layer.
    Type: Grant
    Filed: July 7, 2020
    Date of Patent: December 13, 2022
    Assignee: Diodes Incorporated
    Inventors: Kolins Chao, John Huang
  • Publication number: 20210217857
    Abstract: A semiconductor Schottky rectifier built in an epitaxial semiconductor layer over a substrate has an anode structure and a cathode structure extending from the surface of the epitaxial layer. The cathode contact structure has a trench structure near the epi-layer and a vertical sidewall surface covered with a gate oxide layer. The cathode structure further comprises a polysilicon element adjacent to the gate oxide layer.
    Type: Application
    Filed: July 7, 2020
    Publication date: July 15, 2021
    Applicant: Diodes Incorporated
    Inventors: Kolins Chao, John Huang