Abstract: A fingerprint sensor device with built-in liveness detection capabilities includes: an area sensor disposed on a top surface of a substrate; a stiffener disposed below a bottom surface of the substrate; a printed circuit making electrical connection to the sensor disposed below the stiffener; and a light source and a photodetector. At least one of the light source and photodetector is disposed on the printed circuit below the area sensor. The stiffener includes at least one through-hole located with respect to the light source or photodetector to allow light from the light source to transmit through the stiffener towards a finger located on the area sensor or to allow light reflected from the finger to pass through the stiffener to the photodetector.

Abstract: A fingerprint sensor device with built-in liveness detection capabilities includes: an area sensor disposed on a top surface of a substrate; a stiffener disposed below a bottom surface of the substrate; a printed circuit making electrical connection to the sensor disposed below the stiffener; and a light source and a photodetector. At least one of the light source and photodetector is disposed on the printed circuit below the area sensor. The stiffener includes at least one through-hole located with respect to the light source or photodetector to allow light from the light source to transmit through the stiffener towards a finger located on the area sensor or to allow light reflected from the finger to pass through the stiffener to the photodetector.

Abstract: A fingerprint sensor device with built-in liveness detection capabilities includes: an area sensor disposed on a top surface of a substrate; a stiffener disposed below a bottom surface of the substrate; a printed circuit making electrical connection to the sensor disposed below the stiffener; and a light source and a photodetector. At least one of the light source and photodetector is disposed on the printed circuit below the area sensor. The stiffener includes at least one through-hole located with respect to the light source or photodetector to allow light from the light source to transmit through the stiffener towards a finger located on the area sensor or to allow light reflected from the finger to pass through the stiffener to the photodetector.

Abstract: A fingerprint sensor device with built-in liveness detection capabilities includes: an area sensor disposed on a top surface of a substrate; a stiffener disposed below a bottom surface of the substrate; a printed circuit making electrical connection to the sensor disposed below the stiffener; and a light source and a photodetector. At least one of the light source and photodetector is disposed on the printed circuit below the area sensor. The stiffener includes at least one through-hole located with respect to the light source or photodetector to allow light from the light source to transmit through the stiffener towards a finger located on the area sensor or to allow light reflected from the finger to pass through the stiffener to the photodetector.

Abstract: A prelam layer for use in forming a laminated card includes a flexible circuit substrate; a fingerprint sensor disposed on the flexible circuit substrate, the fingerprint sensor having upper and bottom surfaces, the bottom surface of the fingerprint sensor being disposed on the substrate, an active layer of the fingerprint sensor disposed towards the upper surface of the fingerprint sensor; a first integrated circuit chip disposed on the substrate and having at least one lead electrically connected to the flexible circuit substrate; and an adapter flexible circuit electrically bonded to the active layer of the fingerprint sensor. The integrated circuit chip is adapted to communicate with the fingerprint sensor through the adapter flexible circuit.

Abstract: A prelam layer for use in forming a laminated card includes a flexible circuit substrate; a fingerprint sensor disposed on the flexible circuit substrate, the fingerprint sensor having upper and bottom surfaces, the bottom surface of the fingerprint sensor being disposed on the substrate, an active layer of the fingerprint sensor disposed towards the upper surface of the fingerprint sensor; a first integrated circuit chip disposed on the substrate and having at least one lead electrically connected to the flexible circuit substrate; and an adapter flexible circuit electrically bonded to the active layer of the fingerprint sensor. The integrated circuit chip is adapted to communicate with the fingerprint sensor through the adapter flexible circuit.

Abstract: A prelam layer for use in forming a laminated card includes a flexible circuit substrate; a fingerprint sensor disposed on the flexible circuit substrate, the fingerprint sensor having upper and bottom surfaces, the bottom surface of the fingerprint sensor being disposed on the substrate, an active layer of the fingerprint sensor disposed towards the upper surface of the fingerprint sensor; a first integrated circuit chip disposed on the substrate and having at least one lead electrically connected to the flexible circuit substrate; and an adapter flexible circuit electrically bonded to the active layer of the fingerprint sensor. The integrated circuit chip is adapted to communicate with the fingerprint sensor through the adapter flexible circuit.

Abstract: A prelam layer for use in forming a laminated card includes a flexible circuit substrate; a fingerprint sensor disposed on the flexible circuit substrate, the fingerprint sensor having upper and bottom surfaces, the bottom surface of the fingerprint sensor being disposed on the substrate, an active layer of the fingerprint sensor disposed towards the upper surface of the fingerprint sensor; a first integrated circuit chip disposed on the substrate and having at least one lead electrically connected to the flexible circuit substrate; and an adapter flexible circuit electrically bonded to the active layer of the fingerprint sensor. The integrated circuit chip is adapted to communicate with the fingerprint sensor through the adapter flexible circuit.

Abstract: A method for the production of a portable data carrier having an integrated circuit and a contact field galvanically connected to the integrated circuit. In an area defined by the contact field, the portable data carrier is shaped and the contact field is embodied such that a direct contacting of the contact field by a contacting component embodied in accordance with the USB standard is possible. The portable data carrier in its final form is produced in chip card technology. Alternatively, an element is produced in chip card technology, which element features the integrated circuit and the contact filed, and data and/or program code required for the operation of the portable data carrier are loaded into the integrated circuit. Subsequently the element is permanently connected to a carrier.

Abstract: A method is described for identifying and initializing digitized biometric features to provide encryption or coding of secret data.

Abstract: The invention relates to a method for the production of a portable data carrier (1) having an integrated circuit (10) and a contact field (7) galvanically connected to the integrated circuit (10). In the area of the contact field (7) the portable data carrier (1) is shaped in such a way and the contact field (7) is embodied in such a way that a direct contacting of the contact field (7) by a contacting element embodied in accordance with the USB standard is possible. The portable data carrier (1) in its final form is produced in chip card technology. Alternatively, an element is produced in chip card technology, which element features the integrated circuit (10) and the contact field (7), and data and/or program code required for the operation of the portable data carrier (1) are loaded into the integrated circuit (10). Subsequently the element is permanently connected to a carrier (3).