Patents by Inventor Konatsu Nakamura

Konatsu Nakamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Support-provided insulating layer, laminate, and wiring board
    Patent number: 11319457
    Abstract: By producing a resin composition containing (A) an epoxy resin having two or more epoxy groups in one molecule thereof and containing a hexanediol structure, (B) an ultraviolet ray active ester group-containing compound, and (C) an epoxy resin curing accelerator, even in a state where an irregular shape of the surface of an insulating resin layer is small, a high adhesive force to a wiring conductor can be easily revealed.
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: May 3, 2022
    Assignee: SHOWA DENKO MATERIALS CO., LTD
    Inventors: Masaki Morita, Konatsu Nakamura, Shin Takanezawa
  • RESIN COMPOSITION, CURED RESIN PRODUCT, WIRING BOARD, AND MANUFACTURING METHOD FOR WIRING BOARD
    Publication number: 20190218415
    Abstract: By producing a resin composition containing (A) an epoxy resin having two or more epoxy groups in one molecule thereof and containing a hexanediol structure, (B) an ultraviolet ray active ester group-containing compound, and (C) an epoxy resin curing accelerator, even in a state where an irregular shape of the surface of an insulating resin layer is small, a high adhesive force to a wiring conductor can be easily revealed.
    Type: Application
    Filed: March 26, 2019
    Publication date: July 18, 2019
    Inventors: Masaki MORITA, Konatsu NAKAMURA, Shin TAKANEZAWA
  • RESIN COMPOSITION, CURED RESIN PRODUCT, WIRING BOARD, AND MANUFACTURING METHOD FOR WIRING BOARD
    Publication number: 20130199830
    Abstract: By producing a resin composition containing (A) an epoxy resin having two or more epoxy groups in one molecule thereof and containing a hexanediol structure, (B) an ultraviolet ray active ester group-containing compound, and (C) an epoxy resin curing accelerator, even in a state where an irregular shape of the surface of an insulating resin layer is small, a high adhesive force to a wiring conductor can be easily revealed.
    Type: Application
    Filed: August 5, 2011
    Publication date: August 8, 2013
    Applicant: Hitachi Chemical Company Ltd
    Inventors: Masaki Morita, Konatsu Nakamura, Shin Takanezawa