Abstract: An apparatus converts an AC power panel into a persistent DC power panel with a persistent power switch. The persistent power switch includes a removable power unit for coupling to the AC power switch in order to convert the AC power panel into a persistent DC power panel. The removable power unit can be mounted in the power panel or can be implemented as a stand-alone external device for connecting to the power panel.

Abstract: A DC power attachment device provides a convenient solution in adapting DC powers from AC sockets connected to an existing power distribution circuit. It enables multitude DC devices to concurrently access multiple DC powers at the same or at different voltages on the same power attachment device, which may be coupled to a DC power source, an existing socket, or directly connected to a DC power distribution circuit. The method on the assembly of a DC power attachment device is also addressed.

Abstract: Existing AC power distribution infrastructure in a building is leveraged for the DC power distribution, where one or more DC powers are delivered over an existing power distribution circuit and existing AC power sockets. A DC power attachment is coupled to an existing AC power socket to provide various DC voltages, including a high DC voltage for high power DC devices and a low DC voltage for low power DC devices. Transition from the AC centric environment to a DC environment is thus simplified thereby improving energy usage efficiency and making DC power readily available.

Abstract: A non-volatile memory module in parallel architecture is described. It includes memory function and data storage function in a single module. It enables host system to use memory bus to access storage devices and to use the same memory command protocol for storage device access. The parallel architecture enables contents in memory devices and storage devices to be exchanged freely on module under the control of host memory controller to boost performance of computer and to retain data even if power to computer is shut off. The configuration of non-volatile memory module can be partitioned or expanded into multiple independent channels on module seamlessly with or without ECC supports.

Abstract: A non-volatile dual-in-line memory module (NVDIMM) with a parallel architecture is described. It enables parallel access to on-board nonvolatile memory (NVM) to improve storage throughput and to alleviate layout design constraints.

Abstract: A method selects between AC and DC power inputs for delivery to power distribution circuits in a building. Power distribution circuits includes power distribution wiring and a socket. Power distribution wiring connects between the socket and a circuit breaker and is selectively coupled through the circuit breaker to either the AC or DC power input. DC and AC power inputs, and the circuit breaker are dispositioned at a building service panel. The method includes monitoring a voltage level of the DC power input using a detection circuit in the circuit breaker, using a switch circuit in the circuit breaker to couple the power connection wiring to the AC power input when the detection circuit detects the voltage level is below a threshold level, and coupling the power connection wiring to the DC power input when the detection circuit detects the voltage level is equal to or above the threshold level.

Abstract: An electrical apparatus for delivering DC power to an existing outlet in a building is presented. The electrical apparatus includes a first circuit breaker configured to convert an AC voltage provided from an AC power source to a DC voltage, replace a second circuit breaker already disposed in a service panel of the building with the first circuit breaker, and deliver DC power to the existing outlet, when the first circuit breaker is installed at the service panel.

Abstract: A method selects between AC and DC power inputs for delivery to power distribution circuits in a building. Power distribution circuits includes power distribution wiring and a socket. Power distribution wiring connects between the socket and a circuit breaker and is selectively coupled through the circuit breaker to either the AC or DC power input. DC and AC power inputs, and the circuit breaker are dispositioned at a building service panel. The method includes monitoring a voltage level of the DC power input using a detection circuit in the circuit breaker, using a switch circuit in the circuit breaker to couple the power connection wiring to the AC power input when the detection circuit detects the voltage level is below a threshold level, and coupling the power connection wiring to the DC power input when the detection circuit detects the voltage level is equal to or above the threshold level.

Abstract: An electrical apparatus for delivering DC power to an existing outlet in a building is presented. The electrical apparatus includes a first circuit breaker configured to convert an AC voltage provided from an AC power source to a DC voltage, replace a second circuit breaker already disposed in a service panel of the building with the first circuit breaker, and deliver DC power to the existing outlet, when the first circuit breaker is installed at the service panel.

Abstract: An electronic assembly including a substrate, an electronic component, a fixture, and a housing. The substrate includes a first contact array. The electronic component includes a second contact array. The fixture includes an opening adapted to position the electronic component on the substrate and to connect the second contact array to the first contact array when the fixture is aligned at a first position on the substrate. The housing is adapted to hold the substrate populated with the electronic component. The housing includes a first conductive pathway adapted to connect from an external surface at the housing to the substrate in a serial continuous conductive path when the fixture is aligned at the first position on the substrate. The electronic assembly includes a sensing device connected to the continuous conductive path to detect the integrity of the electronic assembly.

Abstract: An electronic device is presented for electrical connection between a first pad contact of an integrated circuit component and a target contact positioned substantially in a first plane of a target platform. The electronic device includes a first surface substantially parallel to the first plane and a second surface below the first surface substantially parallel to the first plane. The first surface includes a first contact region configured to connect to the first pad contact when the electronic device is connected between the first pad contact and the target contact. The second surface includes a second contact region configured to connect to the target contact when the electronic device is connected between the first pad contact and the target contact. The electronic device further includes a multitude of electrically passive elements connected between the first and second contact regions.

Abstract: An electrical apparatus includes a printed circuit board (PCB) and a socket to electrically interface with the PCB. The PCB includes conductive traces formed in a layer of the PCB and one or more recess. Each of the recess includes an inner surface. A portion of the inner surface forms a first electrical contact connected to one of the conductive traces. The socket includes a multitude of conductive pins and one or more mechanical support matching the position of the recesses. Each of the mechanical support includes an outer surface. A portion of the outer surface forms a second electrical contact connected to an interface pin. The first electrical contact at the PCB and the second electrical contact at the socket form a conduction path from one of the conductive traces on the PCB to the interface pin at the socket when the PCB is inserted into the socket.

Abstract: An electric apparatus is adapted to be electrically coupled to a target platform. The electric apparatus includes a first printed circuit including a first surface parallel to a first plane and a second surface parallel to a second plane perpendicular to the first plane. The first surface has a first area and the second surface has a second area smaller than the first area. A multitude of conductive traces are formed in a layer of the first printed circuit parallel to the first plane. First and second contact regions respectively overlay first and second portions of the second surface. The first and second contact regions are electrically connected to first and second ones of the multitude of conductive traces respectively. The first printed circuit is coupled to the target platform at the first and second contact regions when the first printed circuit is electrically coupled to the target platform.

Abstract: A method for placing a component on a target platform includes providing component alignment marks, target platform reference marks, a first multiple-sensor probe including first sensors, and a second multiple-sensor probe including third sensors. The method further includes determining second sensors included in the first sensors, and sensing a first signal from a first one of the alignment marks by at least one of the second sensors. The method further includes determining fourth sensors included in the third sensors. The method further includes sensing a second signal from a second one of the alignment marks by at least one of the fourth sensors, and detecting a deviation of the component from the target platform associated with a first position of one of the second sensors that sense the first signal and a second position of one of the fourth sensors that sense the second signal.

Abstract: An electric apparatus for connecting to a first printed circuit includes a second printed circuit, which includes a first surface substantially parallel to a first plane and a second surface substantially parallel to a second plane perpendicular to the first plane. The first surface includes a first area and the second surface includes a smaller second area. The second printed circuit includes conductive traces in a layer of the second printed circuit. The electric apparatus further includes first and second conductive pins including first and second longitudinal axes, respectively. First and second notches in the second printed circuit include respective first and second openings through the second surface adapted to receive portions of the first and second pins and adapted to electrically connect the pins to first and second respective ones of the conductive traces. The first and second longitudinal axes are installed substantially parallel to the first plane.

Abstract: The present invention relates generally to assembly techniques. According to the present invention, the alignment and probing techniques to improve the accuracy of component placement in assembly are described. More particularly, the invention includes methods and structures to detect and improve the component placement accuracy on a target platform by incorporating alignment marks on component and reference marks on target platform under various probing techniques. A set of sensors grouped in any array to form a multiple-sensor probe can detect the deviation of displaced components in assembly.

Abstract: An electronic device is presented for electrical connection between a first pad contact of an integrated circuit component and a target contact positioned substantially in a first plane of a target platform. The electronic device includes a first surface substantially parallel to the first plane and a second surface below the first surface substantially parallel to the first plane. The first surface includes a first contact region configured to connect to the first pad contact when the electronic device is connected between the first pad contact and the target contact. The second surface includes a second contact region configured to connect to the target contact when the electronic device is connected between the first pad contact and the target contact. The electronic device further includes a multitude of electrically passive elements connected between the first and second contact regions.

Abstract: An electronic assembly including a substrate, an electronic component, a fixture, and a housing. The substrate includes a first contact array. The electronic component includes a second contact array. The fixture includes an opening adapted to position the electronic component on the substrate and to connect the second contact array to the first contact array when the fixture is aligned at a first position on the substrate. The housing is adapted to hold the substrate populated with the electronic component. The housing includes a first conductive pathway adapted to connect from an external surface at the housing to the substrate in a serial continuous conductive path when the fixture is aligned at the first position on the substrate. The electronic assembly includes a sensing device connected to the continuous conductive path to detect the integrity of the electronic assembly.

Abstract: A manufacturing technique for constructing passive electronic components in vertical configurations is disclosed. Electrically passive components are constructed in a structure that is substantially perpendicular to target platform including a first plane to provide a larger electrode contact area and a smaller physical dimension. Passive components structured to be substantially perpendicular to a plane associated with a target platform can be directly connected to pad contacts of an integrated circuit or substrate or can be embedded in a package to reduce the area overhead of a passive component while improving the effectiveness of the passive components in their applications.

Abstract: An electronic device is disclosed for coupling to a target platform, which includes a multitude of pad contacts. The electronic device includes a substrate, a multitude of pad contacts on the substrate, and a multitude of contact regions in one of the of pad contacts on the substrate. Each of the multitude of pad contacts on the substrate electrically couples to a corresponding one of the multitude of pad contacts on the target platform when the substrate and the target platform are assembled. The multitude of contact regions corresponds to one of the multitude of pad contacts on the target platform when the substrate and the target platform are assembled.