Abstract: A coating composition has 5-15% by weight of a polymeric binder selected from a polyester polyol, an acrylic polyol, an epoxy, silicone, a silicone hybrid and a fluoropolymer. The composition has 20-40% by weight of microparticles, where the microparticles are made of a polyamide, a polyethylene, a polypropylene, a polyurea, a polyurethane, a polymethyl methacrylate, a polystyrene or mixtures thereof and the microparticles have a mean particle diameter d50 size ranging from 5 ?m to 60 ?m. The composition has 2-12% by weight of nanoparticles, said nanoparticles are made of inorganic oxides with a primary particle size ranging from 5 nm to 50 nm; 0-15% by weight of a crosslinker having reactivity to the polymeric binder; 0-20% by weight of pigments and/or fillers, and 40-80% by weight of an organic solvent.

Abstract: The present invention relates to a component carrier tray, and more particularly, a thermoformed carrier tray for integrated circuit (IC) components such as IC chips. The trays of the present invention have the benefit of being suitable for all parts of the IC component manufacturing process, including being suitable for the steps of transporting, sorting, storing, baking, etc. Thus the trays of the present invention reduce the need for transferring IC components from one tray to another and as a result reduce manufacturing cost and risk of part damage. The trays of the present invention are particularly suitable for mid-temperature applications.