Patents by Inventor Kong Joo Jeon

Kong Joo Jeon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component having a body and sealing thin film disposed in a microhole of the body
    Patent number: 11996240
    Abstract: An electronic component includes a microbody including a body including a plurality of dielectric layers and a plurality of internal electrodes disposed with a corresponding dielectric layer interposed therebetween, and an electrode layer disposed on an external side surface of the body and connected to a portion of the plurality of internal electrodes; and a sealing thin film. The microbody includes a microhole extending in at least a portion of the dielectric layer, the internal electrode, and the electrode layer through a surface of the microbody. The sealing thin film includes an internal sealing thin film disposed in at least a portion of an internal space of the open microhole to seal the microhole.
    Type: Grant
    Filed: October 7, 2021
    Date of Patent: May 28, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kong Joo Jeon, So Jung An, Kwang Yeun Won, Woo Kyung Sung, Kyu Sik Park, Myung Jun Park
  • SEMICONDUCTOR MANUFACTURING EQUIPMENT, AND METHOD FOR TRANSPORTING REPLACEABLE COMPONENTS IN THE SEMICONDUCTOR MANUFACTURING EQUIPMENT
    Publication number: 20240120224
    Abstract: A semiconductor manufacturing equipment may include a process chamber for treating a substrate; a front-end module including a first transfer robot, wherein the first transfer robot may be configured to transport the substrate received in a container; a transfer chamber between the front-end module and the process chamber, wherein the transfer chamber may be configured to load or unload the substrate into or out of the process chamber; and a cassette capable of receiving a replaceable component capable of being used in the process chamber. The front-end module may include a seat plate configured to move in a sliding manner so as to retract or extend into or from the front-end module. The cassette may be configured to be loaded into the front-end module while the cassette is seated on the seat plate.
    Type: Application
    Filed: September 12, 2023
    Publication date: April 11, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jin Hyuk CHOI, Beom Soo HWANG, Kong Woo LEE, Myung Ki SONG, Ja-Yul KIM, Kyu Sang LEE, Hyun Joo JEON, Nam Young CHO
  • ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20220199331
    Abstract: An electronic component includes a microbody including a body including a plurality of dielectric layers and a plurality of internal electrodes disposed with a corresponding dielectric layer interposed therebetween, and an electrode layer disposed on an external side surface of the body and connected to a portion of the plurality of internal electrodes; and a sealing thin film. The microbody includes a microhole extending in at least a portion of the dielectric layer, the internal electrode, and the electrode layer through a surface of the microbody. The sealing thin film includes an internal sealing thin film disposed in at least a portion of an internal space of the open microhole to seal the microhole.
    Type: Application
    Filed: October 7, 2021
    Publication date: June 23, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kong Joo Jeon, So Jung An, Kwang Yeun Won, Woo Kyung Sung, Kyu Sik Park, Myung Jun Park