Patents by Inventor Kong Joo Jeon

Kong Joo Jeon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component having a body and sealing thin film disposed in a microhole of the body
    Patent number: 11996240
    Abstract: An electronic component includes a microbody including a body including a plurality of dielectric layers and a plurality of internal electrodes disposed with a corresponding dielectric layer interposed therebetween, and an electrode layer disposed on an external side surface of the body and connected to a portion of the plurality of internal electrodes; and a sealing thin film. The microbody includes a microhole extending in at least a portion of the dielectric layer, the internal electrode, and the electrode layer through a surface of the microbody. The sealing thin film includes an internal sealing thin film disposed in at least a portion of an internal space of the open microhole to seal the microhole.
    Type: Grant
    Filed: October 7, 2021
    Date of Patent: May 28, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kong Joo Jeon, So Jung An, Kwang Yeun Won, Woo Kyung Sung, Kyu Sik Park, Myung Jun Park
  • ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20220199331
    Abstract: An electronic component includes a microbody including a body including a plurality of dielectric layers and a plurality of internal electrodes disposed with a corresponding dielectric layer interposed therebetween, and an electrode layer disposed on an external side surface of the body and connected to a portion of the plurality of internal electrodes; and a sealing thin film. The microbody includes a microhole extending in at least a portion of the dielectric layer, the internal electrode, and the electrode layer through a surface of the microbody. The sealing thin film includes an internal sealing thin film disposed in at least a portion of an internal space of the open microhole to seal the microhole.
    Type: Application
    Filed: October 7, 2021
    Publication date: June 23, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kong Joo Jeon, So Jung An, Kwang Yeun Won, Woo Kyung Sung, Kyu Sik Park, Myung Jun Park