Patents by Inventor Kong Lee

Kong Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250139486
    Abstract: Techniques are described herein regarding utilizing a quantum transformation to generate a transformed dataset from an original dataset and a quantum feature map. For example, one or more embodiments described herein can comprise a system, which can comprise a memory that can store computer executable components. The system can also comprise a processor, operably coupled to the memory, and that can execute the computer executable components stored in the memory. The computer executable components can include operations to transform a qubit of a quantum feature map from an initial state to a transformed state based on an input value of a first classical dataset. The computer executable components can further include operations that generate a second classical dataset based on the input value and the transformed state.
    Type: Application
    Filed: October 30, 2023
    Publication date: May 1, 2025
    Inventors: Brian Leo Quanz, Noriaki Shimada, Shungo Miyabe, Jae-Eun Park, Das Pemmaraju, Chee-Kong Lee, Takahiro Yamamoto
  • Publication number: 20240428108
    Abstract: Systems and methods for quantum machine learning are described. A plurality of qubits can be entangled to create a cluster state. The plurality of qubits can include at least an input qubit, an output qubit, and at least one ancilla qubit. The input qubit can represent data among a training data set of a machine learning model represented by a unitary operation. Sequential local measurements of the cluster state can be performed to generate a plurality of measurement outcomes. At least one of the plurality of qubits can be rotated according to the plurality of measurement outcomes and rotation parameters of the unitary operation. The sequential local measurements and rotation of the plurality of qubits can transform an input state of the input qubit into an output state of the output qubit. The machine learning model can be trained based on the output state of the output qubit.
    Type: Application
    Filed: June 26, 2023
    Publication date: December 26, 2024
    Inventors: Chee-Kong Lee, Jae-Eun Park, Brian Leo Quanz, VAIBHAW KUMAR
  • Patent number: 11855608
    Abstract: Systems and methods for packaging an acoustic device in an integrated circuit (IC) include walls formed on a wiring substrate. The walls have a height which is just shorter than an expected height of a solder bump on the acoustic device after solder reflow. The walls are positioned on either side of the acoustic device and a small portion lies underneath an exterior edge of the acoustic device such that a relatively small gap is formed between an upper surface of the wall and the lower surface of the acoustic device. By providing a small gap between wall and acoustic device, encroachment by an encapsulating material into a keep out zone of the acoustic device is minimized.
    Type: Grant
    Filed: August 31, 2020
    Date of Patent: December 26, 2023
    Assignee: RF360 SINGAPORE PTE. LTD.
    Inventors: Huan En Ku, Joo Shan Yam, Chee Kong Lee
  • Publication number: 20230326463
    Abstract: Learning means 81 generates a speaker embedding extracting neural network by learning a weighting factor so as to minimize a loss function indicating an error between a speaker label indicating a speaker of a voice signal and an output value output from an output layer, with respect to a neural network including an input layer that receives an input of the voice signal and the output layer that outputs the output value indicating a speaker of the voice signal. The speaker embedding extracting neural network includes a network that calculates a first accuracy from a feature in units of frames and calculates an average and a second accuracy of a posterior distribution from an average and an accuracy of a prior distribution and the feature and the first accuracy.
    Type: Application
    Filed: August 28, 2020
    Publication date: October 12, 2023
    Applicant: NEC Corporation
    Inventors: Aik Kong LEE, Takafumi Koshinaka
  • Patent number: 11487555
    Abstract: A system is configured to run jobs in Kubernetes based on PBS job inputs. The system may convert a PBS input, such as in the form of a PBS job command line input and/or a PBS job script, to a Kubernetes job configuration file. A Kubernetes system may then perform a job according to the Kubernetes job configuration file. Through implementation of the conversion process, PBS users can leverage the capabilities of Kubernetes to have jobs performed without having to know how to use Kubernetes.
    Type: Grant
    Filed: June 9, 2020
    Date of Patent: November 1, 2022
    Assignee: TENCENT AMERICA LLC
    Inventors: Matthew Chan, Chee-Kong Lee, Qiming Sun
  • Patent number: 11314536
    Abstract: The present disclosure discloses a method for obtaining optimal variational parameters of a ground state wavefunction for a Hamiltonian system. The method includes initializing a plurality of variational parameters and sending the variational parameters to a quantum computing portion to output a plurality of measurement results. The method includes transmitting the measurement results to a classical computing portion to update the plurality of variational parameters based on the plurality of measurement results and an update rule, and determining whether a measured energy satisfies a convergence rule. When the measured energy does not satisfy the convergence rule, the method includes sending the plurality of updated variational parameters to the quantum computing portion for a next iteration; and when the measured energy satisfies the convergence rule, the method includes obtaining a plurality of optimal variational parameters for the Hamiltonian system.
    Type: Grant
    Filed: July 8, 2019
    Date of Patent: April 26, 2022
    Assignee: TENCENT AMERICA LLC
    Inventors: Chee Kong Lee, Qiming Sun
  • Patent number: 11227806
    Abstract: An air cavity package includes a dielectric frame that is formed from an alumina ceramic, a polyimide, or a semi-crystalline thermoplastic. The dielectric frame is joined to a flange using a high temperature silicone adhesive. Leads may be bonded to the dielectric frame using a high temperature organic adhesive, a direct bond, or by brazing.
    Type: Grant
    Filed: May 9, 2017
    Date of Patent: January 18, 2022
    Assignee: Materion Corporation
    Inventors: Richard J. Koba, Chee Kong Lee, Wei Chuan Goh, Sin Yee Chin
  • Publication number: 20210382728
    Abstract: A system is configured to run jobs in Kubernetes based on PBS job inputs. The system may convert a PBS input, such as in the form of a PBS job command line input and/or a PBS job script, to a Kubernetes job configuration file. A Kubernetes system may then perform a job according to the Kubernetes job configuration file. Through implementation of the conversion process, PBS users can leverage the capabilities of Kubernetes to have jobs performed without having to know how to use Kubernetes.
    Type: Application
    Filed: June 9, 2020
    Publication date: December 9, 2021
    Applicant: Tencent Technology (Shenzhen) Company Limited
    Inventors: Matthew Chan, Chee-Kong Lee, Qiming Sun
  • Publication number: 20210313957
    Abstract: Systems and methods for packaging an acoustic device in an integrated circuit (IC) include walls formed on a wiring substrate. The walls have a height which is just shorter than an expected height of a solder bump on the acoustic device after solder reflow. The walls are positioned on either side of the acoustic device and a small portion lies underneath an exterior edge of the acoustic device such that a relatively small gap is formed between an upper surface of the wall and the lower surface of the acoustic device. By providing a small gap between wall and acoustic device, encroachment by an encapsulating material into a keep out zone of the acoustic device is minimized.
    Type: Application
    Filed: August 31, 2020
    Publication date: October 7, 2021
    Inventors: Huan En Ku, Joo Shan Yam, Chee Kong Lee
  • Publication number: 20210011748
    Abstract: The present disclosure discloses a method for obtaining optimal variational parameters of a ground state wavefunction for a Hamiltonian system. The method includes initializing a plurality of variational parameters and sending the variational parameters to a quantum computing portion to output a plurality of measurement results. The method includes transmitting the measurement results to a classical computing portion to update the plurality of variational parameters based on the plurality of measurement results and an update rule, and determining whether a measured energy satisfies a convergence rule. When the measured energy does not satisfy the convergence rule, the method includes sending the plurality of updated variational parameters to the quantum computing portion for a next iteration; and when the measured energy satisfies the convergence rule, the method includes obtaining a plurality of optimal variational parameters for the Hamiltonian system.
    Type: Application
    Filed: July 8, 2019
    Publication date: January 14, 2021
    Applicant: Tencent America LLC
    Inventors: Chee Kong LEE, Qiming SUN
  • Patent number: 10691169
    Abstract: A cover for an electronic device and methods of forming a cover is disclosed. The electronic device may include a housing, and a cover coupled to the housing. The cover may have an inner surface having at least one of an intermediate polish and a final polish, a groove formed on the inner surface, and an outer surface positioned opposite the inner surface. The outer surface may have at least one of the intermediate polish and the final polish. The cover may also have a rounded perimeter portion formed between the inner surface and the outer surface. The rounded perimeter portion may be positioned adjacent the groove. The method for forming the cover may include performing a first polishing process on the sapphire component using a polishing tool, and performing a second polishing process on the groove of the sapphire component forming the cover using blasting media.
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: June 23, 2020
    Assignee: APPLE INC.
    Inventors: Jeffrey C. Mylvaganam, Erik G. de Jong, Dale N. Memering, Xiao Bing Cai, Palaniappan Chinnakaruppan, Jong Kong Lee, Srikanth Kamireddi, Sawako Kamei, Feng Min, Jing Zhang, Xiang Du, Sai Feng Liu
  • Patent number: 10479867
    Abstract: Method of producing super soft PAU core-shell copolymer dispersions is a solvent free process. The products have characteristics of both polyurethane and polyacrylate including being non-sticky, having a feeling of touching a peach when touching it by the hand, and having improved adhesion, tensile strength, and toughness.
    Type: Grant
    Filed: September 19, 2017
    Date of Patent: November 19, 2019
    Assignee: HO YU TEXTILE CO., LTD
    Inventors: Da-Kong Lee, Chin-Jen Jwo, Wun-Syu Zeng
  • Publication number: 20190298083
    Abstract: A furniture structure including: one or more generally vertical side panels; one or more shelf boards configured to extend from the one or more side panels; two electrical conductors coupled to a side panel of the furniture structure, to receive electrical power of differing polarity from a power supply; an electrical component coupled to a shelf board, wherein said electrical component includes two power terminals located at one end of the electrical component, the power terminals being accessible from a side surface of the shelf board; and wherein the electrical power is supplied to the electrical component via a direct physical contact between the power terminals of the electrical component and the two electrical conductors.
    Type: Application
    Filed: June 28, 2017
    Publication date: October 3, 2019
    Inventors: Joshua Huang Min Lee, Jerry Wei Kong Lee, Chung Ming Chuo
  • Patent number: 10357841
    Abstract: A cap assembly for optical communications comprising a housing that includes a front side perpendicular from a bottom side, opposing parallel first and second sides perpendicular from the bottom side, and a back side disposed perpendicularly between the first side and the second side offset from respective ends of the first side and the second side opposite the front side. The back side includes an opening there-through and a three-sided ledge formed along an interior of the first side leg, an exterior of the back side, and an interior of the second side leg. The cap assembly further includes a window configured to contact the three-sided ledge of the back side, the glass panel covering the opening there-through and attached to the assembly via a solder pre-form.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: July 23, 2019
    Assignee: MATERION CORPORATION
    Inventors: Ramesh Kothandapani, Chee Kong Lee
  • Publication number: 20190085135
    Abstract: Method of producing super soft PAU core-shell copolymer dispersions is a solvent free process. The products have characteristics of both polyurethane and polyacrylate including non-sticky, having a feeling of touching a peach when touching it by the hand, and improved adhesion, tensile strength, and toughness.
    Type: Application
    Filed: September 19, 2017
    Publication date: March 21, 2019
    Applicant: HO YU TEXTILE CO., LTD.
    Inventors: Da-Kong Lee, Chin-Jen Jwo, Wun-Syu Zeng
  • Patent number: 10163743
    Abstract: An air cavity package includes a flange and a pedestal extending upward from the flange. A dielectric frame is joined to the flange and surrounds the pedestal. The semiconductor die is placed on the pedestal, which reduces the length of the wires joining the die to the leads of the air cavity package.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: December 25, 2018
    Assignee: MATERION CORPORATION
    Inventors: Richard J. Koba, Chee Kong Lee, Wei Chuan Goh, Sin Yee Chin
  • Publication number: 20180284843
    Abstract: A cover for an electronic device and methods of forming a cover is disclosed. The electronic device may include a housing, and a cover coupled to the housing. The cover may have an inner surface having at least one of an intermediate polish and a final polish, a groove formed on the inner surface, and an outer surface positioned opposite the inner surface. The outer surface may have at least one of the intermediate polish and the final polish. The cover may also have a rounded perimeter portion formed between the inner surface and the outer surface. The rounded perimeter portion may be positioned adjacent the groove. The method for forming the cover may include performing a first polishing process on the sapphire component using a polishing tool, and performing a second polishing process on the groove of the sapphire component forming the cover using blasting media.
    Type: Application
    Filed: May 9, 2018
    Publication date: October 4, 2018
    Inventors: Jeffrey C. Mylvaganam, Erik G. de Jong, Dele N. Memering, Xiao Bing Cai, Palaniappan Chinnakaruppan, Jong Kong Lee, Srikanth Kamireddi, Sawako Kamei, Feng Min, Jing Zhang, Xiang Du, Sai Feng Liu
  • Publication number: 20180265619
    Abstract: A method of producing PUD by a solvent free process includes drying polyol in vacuum; placing the dried polyol and DMBA in a reaction vessel to mix until a first mixture becomes transparent; adding diisocyanate which having functional group of isocyanate(—NCO) to the first mixture to react until —NCO terminated first prepolymer is formed; decreasing temperature of the —NCO terminated first prepolymer to 65° C.; adding a neutralizing agent to the —NCO terminated first prepolymer until —NCO terminated second prepolymer is formed; adding the remaining diisocyanate having isocyanate functional group to the —NCO terminated second prepolymer to form a second mixture; adding deionized water to the second mixture to form prepolymer dispersion; and adding chain extension agent to the prepolymer dispersion to rotate at a range of 200 to 2,000 rpm for chain extension for 1-3 hours until solid content 40.0 wt. % solvent free PUD is produced.
    Type: Application
    Filed: March 16, 2017
    Publication date: September 20, 2018
    Applicant: HO YU TEXTILE CO., LTD.
    Inventors: Da-Kong Lee, Chin-Jen Jwo, Yong-Shen Luo
  • Patent number: 10077329
    Abstract: A method of producing PUD by a solvent free process includes drying polyol in vacuum; placing the dried polyol and DMBA in a reaction vessel to mix until a first mixture becomes transparent; adding diisocyanate which having functional group of isocyanate (—NCO) to the first mixture to react until —NCO terminated first prepolymer is formed; decreasing temperature of the —NCO terminated first prepolymer to 65° C.; adding a neutralizing agent to the —NCO terminated first prepolymer until —NCO terminated second prepolymer is formed; adding the remaining diisocyanate having isocyanate functional group to the —NCO terminated second prepolymer to form a second mixture; adding deionized water to the second mixture to form prepolymer dispersion; and adding chain extension agent to the prepolymer dispersion to rotate at a range of 200 to 2,000 rpm for chain extension for 1-3 hours until solid content 40.0 wt. % solvent free PUD is produced.
    Type: Grant
    Filed: March 16, 2017
    Date of Patent: September 18, 2018
    Assignee: HO YU TEXTILE CO., LTD.
    Inventors: Da-Kong Lee, Chin-Jen Jwo, Yong-Shen Luo
  • Patent number: 9977464
    Abstract: A cover for an electronic device and methods of forming a cover is disclosed. The electronic device may include a housing, and a cover coupled to the housing. The cover may have an inner surface having at least one of an intermediate polish and a final polish, a groove formed on the inner surface, and an outer surface positioned opposite the inner surface. The outer surface may have at least one of the intermediate polish and the final polish. The cover may also have a rounded perimeter portion formed between the inner surface and the outer surface. The rounded perimeter portion may be positioned adjacent the groove. The method for forming the cover may include performing a first polishing process on the sapphire component using a polishing tool, and performing a second polishing process on the groove of the sapphire component forming the cover using blasting media.
    Type: Grant
    Filed: August 26, 2015
    Date of Patent: May 22, 2018
    Assignee: APPLE INC.
    Inventors: Jeffrey C. Mylvaganam, Erik G. de Jong, Dale N. Memering, Xiao Bing Cai, Palaniappan Chinnakaruppan, Jong Kong Lee, Srikanth Kamireddi, Sawako Kamei, Feng Min, Jing Zhang, Xiang Du, Sai Feng Liu