Patents by Inventor Kong Peng LAM

Kong Peng LAM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230257444
    Abstract: The present invention relates to a soluble dimeric fusion protein comprising a first and second polypeptides, wherein the first and second polypeptides each comprises a Dectin-1 receptor polypeptide fused to a human Fc domain via a dimerization linker. Methods of using the soluble dimeric fusion protein for immunizing a subject against a fungal infection, preventing or treating a fungal infection in a subject and detecting a fungal infection in a subject are also provided. In one embodiment, a chimeric molecule comprising the fusion protein and a payload is provided. In one embodiment, the payload is Amphotericin B.
    Type: Application
    Filed: July 15, 2021
    Publication date: August 17, 2023
    Inventors: Linus Wei Jie Lim, Yue Wang, Say Kong Ng, Kong Peng Lam
  • Publication number: 20210061800
    Abstract: A compound of formula (I) or a salt, solvate or prodrug thereof: wherein R1 and R4 are independently selected from C1-C5 alkyl, C1-C5 haloalkyl, C1-C5 alkenyl, C1-C5 haloalkenyl, C1-C5 alkynyl, C1-C5 haloalkynyl, C1-C5 alkoxy or C1-C5 haloalkoxy; R2 is an optionally substituted heteroaryl selected from optionally substituted tetrazolyl or optionally substituted imidazopyridinyl; and R3 is selected from H or optionally substituted alkyl.
    Type: Application
    Filed: December 31, 2018
    Publication date: March 4, 2021
    Inventors: Surana UTTAM, Hong Hwa LIM, Chandra VERMA, Srinivasaraghavan KANNAN, Kong Peng LAM, Gireedhar VENKATACHALAM, Shi Qin Vanessa NG