Patents by Inventor Kong Thum

Kong Thum has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making integrated circuit package with transparent encapsulant
    Patent number: 7741161
    Abstract: A method for making an IC package with transparent encapsulant includes providing a leadframe, where the leadframe includes a first die pad and a second die pad, disposing a first die on the first die pad and a second die on the second die pad, forming a cavity on the leadframe, where the cavity includes the first die pad and the second die pad, injecting an encapsulant material into the cavity and cutting the injected encapsulant material and the leadframe to form a first IC package and a second IC package. The encapsulant material is transparent for visible wavelengths. The injection of the encapsulant material is performed at an encapsulant temperature ranging from 140° C. to 160° C.
    Type: Grant
    Filed: June 30, 2008
    Date of Patent: June 22, 2010
    Assignee: Carsem (M) Sdn. Bhd.
    Inventors: Ah Lek Khor, Kock Huat Lee, Boon Meng Chan, Min Kong Thum, Hong Mun Tung, Mun Tuck Cheong
  • Method of Making Integrated Circuit Package with Transparent Encapsulant
    Publication number: 20080286901
    Abstract: A method for making an IC package with transparent encapsulant includes providing a leadframe, where the leadframe includes a first die pad and a second die pad, disposing a first die on the first die pad and a second die on the second die pad, forming a cavity on the leadframe, where the cavity includes the first die pad and the second die pad, injecting an encapsulant material into the cavity and cutting the injected encapsulant material and the leadframe to form a first IC package and a second IC package. The encapsulant material is transparent for visible wavelengths. The injection of the encapsulant material is performed at an encapsulant temperature ranging from 140° C. to 160° C.
    Type: Application
    Filed: June 30, 2008
    Publication date: November 20, 2008
    Applicant: Carsem (M) Sdn. Bhd.
    Inventors: Ah Lek Khor, Kock Huat Lee, Boon Meng Chan, Min Kong Thum, Hong Mun Tung, Mun Tuck Cheong
  • Integrated circuit package with transparent encapsulant and method for making thereof
    Publication number: 20050167790
    Abstract: IC package with transparent encapsulant and method for making thereof. The IC package includes a die pad including a pad bottom surface, a die disposed on the die pad and including an integrated circuit, a plurality of leads including a plurality of lead bottom surfaces, a plurality of conductive wires connecting the die and the plurality of leads, and an encapsulant material. The encapsulant material is transparent for visible wavelengths. The pad bottom surface is exposed without being covered by the encapsulant material, and the plurality of lead bottom surfaces each are exposed without being covered by the encapsulant material.
    Type: Application
    Filed: December 29, 2004
    Publication date: August 4, 2005
    Applicant: Carsem (M) Sdn.Bhd.
    Inventors: Lek Khor, Huat Lee, Meng Chan, Kong Thum, Mun Tung, Tuck Cheong