Patents by Inventor Kong-Toon Ng

Kong-Toon Ng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220342165
    Abstract: A semiconductor package includes a first mold layer at least partially encasing at least one photonic integrated circuit. A redistribution layer structure is fabricated on the first mold layer, the redistribution layer structure including dielectric material and conductive structures. A second mold layer at least partially encasing at least one semiconductor chip is fabricated on the redistribution layer structure. The redistribution layer structure provides electrical pathways between the at least one semiconductor chip and the at least one photonic integrated circuit. One or more voids are defined in the second mold layer in an area above an optical interface of the at least one photonic integrated circuit such that light is transmittable through dielectric material above the optical interface.
    Type: Application
    Filed: June 28, 2021
    Publication date: October 27, 2022
    Inventors: BRETT P. WILKERSON, RAJA SWAMINATHAN, KONG TOON NG, RAHUL AGARWAL
  • Patent number: 11418002
    Abstract: An electronic package and a method for fabricating an electronic package are provided. An encapsulation layer encapsulates a first electronic component and a plurality of conductive pillars, and is defined with a reservation region and a removal region adjacent to the reservation region. A circuit structure is disposed on the encapsulation layer. The removal region and the circuit structure therewithin are removed for an optical communication element to protrude from a lateral surface of the encapsulation layer when the optical communication element is disposed on the circuit structure, so as to avoid a packaging material used in a subsequent process from being adhered to a protruding portion of the optical communication element.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: August 16, 2022
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Kong-Toon Ng, Yi-Chian Liao
  • Patent number: 11289346
    Abstract: An electronic package and a method for fabricating the same are provided. The method includes: forming a circuit structure on an encapsulant; embedding a first electronic component and a plurality of conductive posts in the encapsulant; and disposing a second electronic component on the circuit structure. Since the first and second electronic components are arranged on opposite sides of the circuit structure, the electronic package can provide multi-function and high efficiency.
    Type: Grant
    Filed: July 2, 2020
    Date of Patent: March 29, 2022
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Chen-Yu Huang, Chee-Key Chung, Chang-Fu Lin, Kong-Toon Ng, Rui-Feng Tai, Bo-Hao Ma
  • Publication number: 20210343546
    Abstract: An electronic package and a method for fabricating the same are provided. The electronic package includes a stepped recess formed at a peripheral portion of a packaging module to release stress of the electronic package.
    Type: Application
    Filed: June 8, 2020
    Publication date: November 4, 2021
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Yung-Ta Li, Yi-Chian Liao, Kong-Toon Ng, Chang-Fu Lin
  • Patent number: 11164755
    Abstract: An electronic package and a method for fabricating the same are provided. The electronic package includes a stepped recess formed at a peripheral portion of a packaging module to release stress of the electronic package.
    Type: Grant
    Filed: June 8, 2020
    Date of Patent: November 2, 2021
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Yung-Ta Li, Yi-Chian Liao, Kong-Toon Ng, Chang-Fu Lin
  • Publication number: 20210296295
    Abstract: An electronic package is provided, including: an encapsulation layer embedded with a first electronic component and conductive pillars; a circuit structure disposed on one surface of the encapsulation layer; a second electronic component disposed on the circuit structure; an insulation layer formed on the other surface of the encapsulation layer; and a circuit portion disposed on the insulation layer. Since the first and second electronic components are disposed on two sides of the circuit structure, respectively, the electronic package has various functions and high performance. A method for fabricating the electronic package is also provided.
    Type: Application
    Filed: June 3, 2021
    Publication date: September 23, 2021
    Inventors: Kong-Toon Ng, Hung-Ho Lee, Chee-Key Chung, Chang-Fu Lin, Chi-Hsin Chiu
  • Patent number: 11056470
    Abstract: An electronic package is provided, including: an encapsulation layer embedded with a first electronic component and conductive pillars; a circuit structure disposed on one surface of the encapsulation layer; a second electronic component disposed on the circuit structure; an insulation layer formed on the other surface of the encapsulation layer; and a circuit portion disposed on the insulation layer. Since the first and second electronic components are disposed on two sides of the circuit structure, respectively, the electronic package has various functions and high performance. A method for fabricating the electronic package is also provided.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: July 6, 2021
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Kong-Toon Ng, Hung-Ho Lee, Chee-Key Chung, Chang-Fu Lin, Chi-Hsin Chiu
  • Publication number: 20210066883
    Abstract: An electronic package and a method for fabricating an electronic package are provided. An encapsulation layer encapsulates a first electronic component and a plurality of conductive pillars, and is defined with a reservation region and a removal region adjacent to the reservation region. A circuit structure is disposed on the encapsulation layer. The removal region and the circuit structure therewithin are removed for an optical communication element to protrude from a lateral surface of the encapsulation layer when the optical communication element is disposed on the circuit structure, so as to avoid a packaging material used in a subsequent process from being adhered to a protruding portion of the optical communication element.
    Type: Application
    Filed: October 31, 2019
    Publication date: March 4, 2021
    Inventors: Kong-Toon Ng, Yi-Chian Liao
  • Publication number: 20200402965
    Abstract: An electronic package is provided, including: an encapsulation layer embedded with a first electronic component and conductive pillars; a circuit structure disposed on one surface of the encapsulation layer; a second electronic component disposed on the circuit structure; an insulation layer formed on the other surface of the encapsulation layer; and a circuit portion disposed on the insulation layer. Since the first and second electronic components are disposed on two sides of the circuit structure, respectively, the electronic package has various functions and high performance. A method for fabricating the electronic package is also provided.
    Type: Application
    Filed: July 16, 2019
    Publication date: December 24, 2020
    Inventors: Kong-Toon Ng, Hung-Ho Lee, Chee-Key Chung, Chang-Fu Lin, Chi-Hsin Chiu
  • Publication number: 20200335447
    Abstract: An electronic package and a method for fabricating the same are provided. The method includes: forming a circuit structure on an encapsulant; embedding a first electronic component and a plurality of conductive posts in the encapsulant; and disposing a second electronic component on the circuit structure. Since the first and second electronic components are arranged on opposite sides of the circuit structure, the electronic package can provide multi-function and high efficiency.
    Type: Application
    Filed: July 2, 2020
    Publication date: October 22, 2020
    Inventors: Chen-Yu Huang, Chee-Key Chung, Chang-Fu Lin, Kong-Toon Ng, Rui-Feng Tai, Bo-Hao Ma
  • Patent number: 10741500
    Abstract: An electronic package and a method for fabricating the same are provided. The method includes: forming a circuit structure on an encapsulant; embedding a first electronic component and a plurality of conductive posts in the encapsulant; and disposing a second electronic component on the circuit structure. Since the first and second electronic components are arranged on opposite sides of the circuit structure, the electronic package can provide multi-function and high efficiency.
    Type: Grant
    Filed: May 4, 2018
    Date of Patent: August 11, 2020
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Chen-Yu Huang, Chee-Key Chung, Chang-Fu Lin, Kong-Toon Ng, Rui-Feng Tai, Bo-Hao Ma
  • Publication number: 20190237374
    Abstract: An electronic package and a method for fabricating the same are provided. The method includes: forming a circuit structure on an encapsulant; embedding a first electronic component and a plurality of conductive posts in the encapsulant; and disposing a second electronic component on the circuit structure. Since the first and second electronic components are arranged on opposite sides of the circuit structure, the electronic package can provide multi-function and high efficiency.
    Type: Application
    Filed: May 4, 2018
    Publication date: August 1, 2019
    Inventors: Chen-Yu Huang, Chee-Key Chung, Chang-Fu Lin, Kong-Toon Ng, Rui-Feng Tai, Bo-Hao Ma