Patents by Inventor Kong W. Lee

Kong W. Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit assembly having vented heat-spreader
    Patent number: 8258013
    Abstract: An integrated circuit package assembly includes a substrate, a semiconductor die having opposing first and second surfaces, and a head-spreader. The semiconductor die is mounted on the substrate with the first surface facing the substrate. The heat-spreader includes a central region thermally coupled to the second surface of the semiconductor die, a flange region mounted on the substrate, and a side wall region between the central and flange regions. A cavity is formed between the heat-spreader, the substrate, and the semiconductor die. The heat-spreader has at least one vent extending from the cavity through the heat-spreader.
    Type: Grant
    Filed: February 12, 2010
    Date of Patent: September 4, 2012
    Assignee: Xilinx, Inc.
    Inventors: Kumar Nagarajan, S. Gabriel R. Dosdos, Dong W. Kim, Kong W. Lee