Patents by Inventor Kongkong SHANG

Kongkong SHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Camera module and mobile terminal
    Patent number: 11272088
    Abstract: The present disclosure provides a camera module and a mobile terminal. The camera module includes: a first camera, a second camera, an optical image stabilization (OIS) chip and a bracket. The first camera and the second camera are embedded in the bracket. A height from a top surface of a lens of the first camera to a bottom surface of the first camera is greater than a height from a top surface of a lens of the second camera to a bottom surface of the second camera. One end of the first camera away from the lens is provided with a first printed circuit board, and the first printed circuit board extends to an outside of the first camera and faces the second camera. The OIS chip is disposed on the first printed circuit board and faces the bottom surface of the second camera; the OIS chip is electrically connected to the first printed circuit board.
    Type: Grant
    Filed: March 14, 2019
    Date of Patent: March 8, 2022
    Assignee: VIVO MOBILE COMMUNICATION CO., LTD.
    Inventors: Jian Ding, Junke Gao, Lijun Zhu, Kongkong Shang, Bijun Chen, Hongzhi Yao
  • CAMERA MODULE AND MOBILE TERMINAL
    Publication number: 20210075944
    Abstract: The present disclosure provides a camera module and a mobile terminal. The camera module includes: a first camera, a second camera, an optical image stabilization (OIS) chip and a bracket. The first camera and the second camera are embedded in the bracket. A height from a top surface of a lens of the first camera to a bottom surface of the first camera is greater than a height from a top surface of a lens of the second camera to a bottom surface of the second camera. One end of the first camera away from the lens is provided with a first printed circuit board, and the first printed circuit board extends to an outside of the first camera and faces the second camera. The OIS chip is disposed on the first printed circuit board and faces the bottom surface of the second camera; the OIS chip is electrically connected to the first printed circuit board.
    Type: Application
    Filed: March 14, 2019
    Publication date: March 11, 2021
    Applicant: VIVO MOBILE COMMUNICATION CO., LTD.
    Inventors: Jian DING, Junke GAO, Lijun ZHU, Kongkong SHANG, Bijun CHEN, Hongzhi YAO