Abstract: The present invention relates to a waveguide-to-microstrip line transition package for superconducting film characterization. The package allows propagation and impedance properties thin-film microwave line superconductor to be characterized at millimeter wave frequencies as a function of frequency. The superconducting film's kinetic inductance can be varied by applying direct current along the ground plane via spring loaded probe. When implemented with a non-superconducting metal housing the present invention is highly suitable for measuring resonators with the quality factor, Q, ranges from 100 to 1×104. Through the use of a housing realized from an appropriate superconducting bulk material or coating the upper end of this range of applicability can be readily extended to >1×106.

Abstract: A two-way microwave power divider (the “power divider”) may include an input port and two output ports. The power divider may also include a junction that is configured to split a feedline from the input port into a first transmission line and a second transmission line. One or more resistors may be placed along the first transmission line and the second transmission line to provide isolation between the two output ports.

Abstract: The present invention relates to a waveguide-to-microstrip line transition package for superconducting film characterization. The package allows propagation and impedance properties thin-film microwave line superconductor to be characterized at millimeter wave frequencies as a function of frequency. The superconducting film's kinetic inductance can be varied by applying direct current along the ground plane via spring loaded probe. When implemented with a non-superconducting metal housing the present invention is highly suitable for measuring resonators with the quality factor, Q, ranges from 100 to 1×104. Through the use of a housing realized from an appropriate superconducting bulk material or coating the upper end of this range of applicability can be readily extended to >1×106.

Abstract: A via-less crossover for use in broadband microwave/mm-wave circuitry, including: a dielectric substrate; a top layer disposed on one side of the substrate and including a microstrip line with an input and an output, two tapered sections placed around the microstrip line along a co-planar waveguide (CPW) central line, one microstrip portion having an input and which connects to one top layer, rectangular stub disposed adjacent to one of the tapered sections, and another microstrip portion having an output and which connects to another top layer, rectangular stub disposed adjacent to the other of the tapered sections; and a ground layer disposed on an opposite side of the substrate and including a bottom layer CPW central line situated in a central cutout and which connects between a bottom layer, rectangular stub on one side and a bottom layer, rectangular stub on the other side situated in ground cutouts, respectively.

Abstract: A two-way microwave power divider (the “power divider”) may include an input port and two output ports. The power divider may also include a junction that is configured to split a feedline from the input port into a first transmission line and a second transmission line. One or more resistors may be placed along the first transmission line and the second transmission line to provide isolation between the two output ports.

Abstract: A via-less crossover for use in broadband microwave/mm-wave circuitry, including: a dielectric substrate; a top layer disposed on one side of the substrate and including a microstrip line with an input and an output, two tapered sections placed around the microstrip line along a co-planar waveguide (CPW) central line, one microstrip portion having an input and which connects to one top layer, rectangular stub disposed adjacent to one of the tapered sections, and another microstrip portion having an output and which connects to another top layer, rectangular stub disposed adjacent to the other of the tapered sections; and a ground layer disposed on an opposite side of the substrate and including a bottom layer CPW central line situated in a central cutout and which connects between a bottom layer, rectangular stub on one side and a bottom layer, rectangular stub on the other side situated in ground cutouts, respectively.

Abstract: A photonic waveguide choke includes a first waveguide flange member having periodic metal tiling pillars, a dissipative dielectric material positioned within an area between the periodic metal tiling pillars and a second waveguide flange member disposed to be coupled with the first waveguide flange member and in spaced-apart relationship separated by a gap. The first waveguide flange member has a substantially smooth surface, and the second waveguide flange member has an array of two-dimensional pillar structures formed therein.

Abstract: The present invention relates to a symmetric absorber-coupled far-infrared microwave kinetic inductance detector including: a membrane having an absorber disposed thereon in a symmetric cross bar pattern; and a microstrip including a plurality of conductor microstrip lines disposed along all edges of the membrane, and separated from a ground plane by the membrane. The conducting microstrip lines are made from niobium, and the pattern is made from a superconducting material with a transition temperature below niobium, including one of aluminum, titanium nitride, or molybdenum nitride. The pattern is disposed on both a top and a bottom of the membrane, and creates a parallel-plate coupled transmission line on the membrane that acts as a half-wavelength resonator at readout frequencies. The parallel-plate coupled transmission line and the conductor microstrip lines form a stepped impedance resonator. The pattern provides identical power absorption for both horizontal and vertical polarization signals.

Abstract: A waveguide choke joint includes a first array of pillars positioned on a substrate, each pillar in the first array of pillars having a first size and configured to receive an input plane wave at a first end of the choke joint. The choke joint has a second end configured to transmit the input plane wave away from the choke joint. The choke joint further includes a second array of pillars positioned on the substrate between the first array of pillars and the second end of the choke joint. Each pillar in the second array of pillars has a second size. The choke joint also has a third array of pillars positioned on the substrate between the second array and the second end of the choke joint. Each pillar in the third array of pillars has a third size.

Abstract: A waveguide structure for a dual polarization waveguide includes a first flange member, a second flange member, and a waveguide member disposed in each of the first flange member and second flange member. The first flange member and the second flange member are configured to be coupled together in a spaced-apart relationship separated by a gap. The first flange member has a substantially smooth surface, and the second flange member has an array of two-dimensional pillar structures formed therein.

Abstract: A compact planar microwave blocking filter includes a dielectric substrate and a plurality of filter unit elements disposed on the substrate. The filter unit elements are interconnected in a symmetrical series cascade with filter unit elements being organized in the series based on physical size. In the filter, a first filter unit element of the plurality of filter unit elements includes a low impedance open-ended line configured to reduce the shunt capacitance of the filter.

Abstract: A waveguide structure for a dual polarization waveguide includes a first flange member, a second flange member, and a waveguide member disposed in each of the first flange member and second flange member. The first flange member and the second flange member are configured to be coupled together in a spaced-apart relationship separated by a gap. The first flange member has a substantially smooth surface, and the second flange member has an array of two-dimensional pillar structures formed therein.

Abstract: The design of a compact low-loss Magic-T is described. The planar Magic-T incorporates a compact microstrip-slotline tee junction and small microstrip-slotline transition area to reduce slotline radiation. The Magic-T produces broadband in-phase and out-of-phase power combiner/divider responses, has low in-band insertion loss, and small in-band phase and amplitude imbalance.

Abstract: A compact planar microwave blocking filter includes a dielectric substrate and a plurality of filter unit elements disposed on the substrate. The filter unit elements are interconnected in a symmetrical series cascade with filter unit elements being organized in the series based on physical size. In the filter, a first filter unit element of the plurality of filter unit elements includes a low impedance open-ended line configured to reduce the shunt capacitance of the filter.

Abstract: The design of a compact low-loss Magic-T is described. The planar Magic-T incorporates a compact microstrip-slotline tee junction and small microstrip-slotline transition area to reduce slotline radiation. The Magic-T produces broadband in-phase and out-of-phase power combiner/divider responses, has low in-band insertion loss, and small in-band phase and amplitude imbalance.

Abstract: A planar Magic-T that incorporates complementary microstrip-slotline tee junction and microstrip-slotline transition area to produce a compact broadband out-of-phase combining structure with minimum loss due to slotline radiation. The Magic-T structure layout is symmetric which causes the structure to be less dependent on the transmission line phase variation. The Magic-T produces broadband in-phase and out-of-phase power combiner/divider responses, has low in-band insertion loss, and small in-band phase and amplitude imbalance. A multi-section impedance transformation network is used to increase the operating bandwidth and minimize the parasitic coupling around the microstrip-slotline tee junction. As a result, the improved magic-T has greater bandwidth and lower phase imbalance at the sum and difference ports than the earlier magic-T designs.