Abstract: A wafer chuck apparatus includes a chuck with a body and a vacuum line system formed within the body. The wafer chuck apparatus has sealing devices each operably disposed in respective recesses formed in the body at an upper surface of the chuck. Each sealing device is contractible between an expanded operating position and a contracted operating position. The top end of each sealing device is configured to form a vacuum seal with a corresponding portion of a backside of a wafer. The sealing devices extend above the upper surface of the chuck higher than typical seals and guide the wafer down to the upper surface of the chuck where it can be engaged by vacuum features that chuck the wafer to the upper surface of the chuck. The sealing devices are particularly useful for chucking warped wafers.

Abstract: A method of, and apparatus for, mechanically masking a workpiece to form exposure exclusion regions is disclosed. The apparatus includes a mask that is arranged atop the photosensitive surface of the workpiece. The mask is opaque to the wavelength of radiation that activates the photosensitive workpiece surface. The mask is placed onto the workpiece prior to lithographic exposure of the workpiece so that the photosensitive material (e.g., negative acting photoresist) can be removed from select regions of the workpiece to provide, for example, electrical contact directly to the workpiece upper surface.

Abstract: A system and method for performing alignment of a substrate using alignment marks on the backside of a substrate supported by a movable chuck is disclosed. The system includes an imaging optical system arranged such that the movable chuck can position one end of the optical system either adjacent the front surface of the substrate or near the front surface but outside the perimeter of the substrate. In one embodiment, secondary optical systems are arranged within the chuck at the chuck perimeter so as to be in optical communication with corresponding alignment marks. The chuck is movable so that the imaging optical system can be placed in optical communication with the second optical system and image the alignment marks onto a detector. The detector converts the alignment mark images into digital electronic images, which are stored in a computer system and processed. The chuck then moves the substrate to exposure locations based on the result of processing the images.

Abstract: A system and method for performing alignment of a substrate using alignment marks on the backside of a substrate supported by a movable chuck is disclosed. The system includes an imaging optical system arranged such that the movable chuck can position one end of the optical system either adjacent the front surface of the substrate or near the front surface but outside the perimeter of the substrate. In one embodiment, secondary optical systems are arranged within the chuck at the chuck perimeter so as to be in optical communication with corresponding alignment marks. The chuck is movable so that the imaging optical system can be placed in optical communication with the second optical system and image the alignment marks onto a detector. The detector converts the alignment mark images into digital electronic images, which are stored in a computer system and processed. The chuck then moves the substrate to exposure locations based on the result of processing the images.

Abstract: A system capable of automatically compensating for the thickness of a workpiece which comprises: at least one actuator assembly which comprises a vacuum chuck capable of supporting a workpiece thereon vacuum means capable of providing the vacuum chuck with sufficient vacuum for maintain the workpiece in contact with the vacuum chuck, the vacuum means including a centrally located vacuum conduit portion, means for adjustably securing the vacuum chuck to the vacuum conduit portion, actuator means rotatably disposed about the vacuum conduit portion, and means for reciprocally moving the actuator means such that its movement produces a similar reciprocal movement by the vacuum chuck; motor means and gear assembly connected to the means for reciprocally moving the actuator means; means for detecting the thickness of the workpiece; and means for controlling the motor means and gear assembly so as to move the actuator means, whereby the height of the workpiece can be automatically and continuously adjusted to the va