Abstract: A device is provided that includes a stator including a stator element and a row of stator comb fingers, wherein the stator comb fingers extend away from the stator element in a y-direction. A device may include a rotor including a rotor element and a row of rotor comb fingers, wherein the rotor comb fingers extend away from the rotor element in a direction which is opposite to the y-direction, and wherein the stator comb fingers are interdigitated with the rotor comb fingers, and form an interdigitated row, and each pair of adjacent stator comb finger and rotor comb finger are separated from each other by a x-gap in a x-direction, which is perpendicular to the y-direction.

Abstract: An improved wafer bonding method applying at least one prebonding element that deflects in the out-of-plane direction.

Abstract: A MEMS device is provided that includes a cap layer and a device layer. The cap layer includes a cap wafer made of electrically insulating material, and the device layer includes at least one seismic element. Moreover, the cap layer includes at least one silicon-filled portion at a first face of the cap layer facing the device layer, and at least one of said at least one silicon-filled portion includes a gap that locally increases distance from the cap layer to the at least one seismic element in the device layer.

Abstract: An improved wafer bonding method applying at least one prebonding element that deflects in the out-of-plane direction.