Abstract: Electrically conducting adhesives having a broader selectable range of properties are provided by having random sizes of micrometer diameter range particles coated with a low melting temperature metal. The coated particles are suspended in a vehicle of a mixture of thermosetting resins together with a flux resin selected for viscosity and low shrinkage, for screen printability, for electrical and for mechanical properties over a broad range of specification conditions. The vehicle or resin system includes thermosetting cyclo-aliphatic epoxy, thermosetting phenoxy polymer and thermosetting mono-functional limonene oxide. The low temperature melting coating system for the particles includes In, Sn, and alloys such as In—Sn, Sn—Pb, Bi—Sn—In and InAg. The micrometer diameter range particles includes Cu, Ni, Co, Ag, Pd, Pt, polymer and ceramic.

Abstract: An encapsulant composition and an electronic package. The composition includes a resin, a flexibilizing agent, and a filler material. The electronic package includes a substrate, a semiconductor chip, and a material. The semiconductor chip is mounted on an upper surface of the substrate and electrically coupled to the substrate. The material is positioned on the upper surface of the substrate and against an edge surface of the semiconductor chip. The edge surface of the semiconductor chip is substantially perpendicular to a bottom surface of the semiconductor chip. The material is the encapsulant composition.

Abstract: A method of making an encapsulant composition. The method includes: providing a first quantity of resin material of epoxy or cyanate ester resins; adding to the first quantity of resin material a second quantity of flexibilizing agent; adding to the first quantity of resin material a third quantity of filler material; blending the resin material. After adding the flexibilizing agent, adding the filler material, and blending the resin material, applying the composition to a gap between a substrate and a semiconductor chip. After applying the composition to the gap, pregelling the composition. After pregelling the composition, substantially curing the composition.

Abstract: A method and structure relating to multisegmented plated through holes. A substrate includes a dielectric layer sandwiched between a first laminate layer and a second laminate layer. A through hole is formed through the substrate. The through hole passes through nonplatable dielectric material within the dielectric layer. As a result, subsequent seeding and electroplating of the through hole results in a conductive metal plating forming at a wall of the through hole on a segment of the first laminate layer and on a segment of the second laminate layer, but not on the nonplatable dielectric material of the dielectric layer. Thus, the conductive metal plating is not continuous from the first laminate layer to the second laminate layer.

Abstract: A method is provided for producing a capacitor to be embedded in an electronic circuit package comprising the steps of selecting a first conductor foil, selecting a dielectric material, coating the dielectric material on at least one side of the first conductor foil, and layering the coated foil with a second conductor foil on top of the coating of dielectric material. Also claimed is an electronic circuit package incorporating at least one embedded capacitor manufactured in accordance with the present invention.

Abstract: The electrical connections of an integrated circuit chip assembly comprised of an integrated circuit chip attached to a substrate are encapsulated and reinforced with a high viscosity encapsulant material by dispensing the encapsulant material through an opening in the substrate into the space between the integrated circuit chip and the substrate. An integrated circuit chin assembly having a reinforced electrical interconnection which is more resistant to weakening as a result of stress created by differences in coefficient of thermal expansion between the integrated circuit chip and the substrate to which the integrated circuit chip is attached is produced.

Abstract: A substrate that is substantially non-wettable to adhesive resin is disclosed. The substrate is coated with a fluorinated silane composition. Preferable fluorosilane compositions include perfluoroalkyl alkylsilanes of Formula III: R5nR6mSiX4−(n+m)  III wherein R5 is a perfluoroalkyl alkyl radical; R6 is alkyl or alkenyl; X is acetoxy, halogen or alkoxy; n is 1 or 2; and m is 0 or 1. The composition is preferably applied in solution and upon evaporation of the solvent, forms a durable, non-wetting, yet well-adhering surface. In a preferred embodiment, the substrate is a chip carrier with enhanced wire bondability for use in the manufacture of a semiconductor device.

Abstract: The electrical interconnections between an integrated circuit chip assembly are encapsulated and reinforced with a high viscosity encapsulant material in a single step molding process wherein a mold is placed over an integrated circuit chip assembly and encapsulant material is dispensed through an opening in the mold and forced around and under the integrated circuit chip by external pressure encapsulating the integrated circuit chip assembly. An integrated circuit chip assembly having a reinforced electrical connection which is more resistant to weakening as a result is stress created by differences in coefficient of thermal expansion between the integrated circuit chip and the substrate to which the integrated circuit chip is attached is produced.

Abstract: The electrical connections of an integrated circuit chip assembly comprised of an integrated circuit chip attached to a substrate are encapsulated and reinforced with a high viscosity encapsulant material by dispensing the encapsulant material through an opening in the substrate into the space between the integrated circuit chip and the substrate. An integrated circuit chin assembly having a reinforced electrical interconnection which is more resistant to weakening as a result of stress created by differences in coefficient of thermal expansion between the integrated circuit chip and the substrate to which the integrated circuit chip is attached is produced.

Abstract: An underfill composition having improved mechanical properties resulting from the inclusion of a novel “core-shell” substance. The core-shell substance includes a fine powder, whose particles each having an outer shell with a Tg significantly above room temperature, and an inner core with a Tg significantly below room temperature. The shell substance often includes an acrylate or methacrylate and the core includes a wide range of materials, such as acrylates and silicone or butadiene-based rubbers.

Abstract: The electrical interconnections between an integrated circuit chip assembly are encapsulated and reinforced with a high viscosity encapsulant material in a single step molding process wherein a mold is placed over an integrated circuit chip assembly and encapsulant material is dispensed through an opening in the mold and forced around and under the integrated circuit chip by external pressure encapsulating the integrated circuit chip assembly. An integrated circuit chip assembly having a reinforced electrical connection which is more resistant to weakening as a result is stress created by differences in coefficient of thermal expansion between the integrated circuit chip and the substrate to which the integrated circuit chip is attached is produced.

Abstract: A substrate that is substantially non-wettable to adhesive resin is disclosed. The substrate is coated with a fluorinated silane composition.

Abstract: A method is provided for producing a capacitor to be embedded in an electronic circuit package comprising the steps of selecting a first conductor foil, selecting a dielectric material, coating the dielectric material on at least one side of the first conductor foil, and layering the coated foil with a second conductor foil on top of the coating of dielectric material. Also claimed is an electronic circuit package incorporating at least one embedded capacitor manufactured in accordance with the present invention.

Abstract: A substrate that is substantially non-wettable to adhesive resin is disclosed. The substrate is coated with a fluorinated silane composition. Preferable fluorosilane compositions include perfluoroalkyl alkylsilanes of Formula III: R5nR6mSiX4-(n+m)  III wherein R5 is a perfluoroalkyl alkyl radical; R6 is alkyl or alkenyl; X is acetoxy, halogen or alkoxy; n is 1 or 2; and m is 0 or 1. The composition is preferably applied in solution and upon evaporation of the solvent, forms a durable, non-wetting, yet well-adhering surface. In a preferred embodiment, the substrate is a chip carrier with enhanced wire bondability for use in the manufacture of a semiconductor device.

Abstract: A composition comprising a thermoset resin which may or may not contain fluorine, bromine or both and containing at least one bromine-containing homo- or multicomponent thermoplastic polymer modifier optionally containing a different halogen which is soluble in the thermoset. Said thermoplastic polymer undergoes an in-situ phase separation process during cure to form a microphase-separated multiphase thermoset material.

Abstract: The electrical connections of an integrated circuit chip assembly comprised of an integrated circuit chip attached to a substrate are encapsulated and reinforced with a high viscosity encapsulant material by dispensing the encapsulant material through an opening in the substrate into the space between the integrated circuit chip and the substrate. An integrated circuit chip assembly having a reinforced electrical interconnection which is more resistant to weakening as a result of stress created by differences in coefficient of thermal expansion between the integrated circuit chip and the substrate to which the integrated circuit chip is attached is produced.

Abstract: Disclosed is an admixture which is curable to form a crack resistant, photosensitive polycyanurate resist. Also disclosed is a structure for its use and process of making. The resist can be tailored to be either positively or negatively sensitive to actinic radiation. Because of its improved thermal and mechanical properties, the cured resist is suitable for use at high temperature, such as in electronic packaging applications.

Abstract: The present invention relates to a curable thermosetting resin composition having enhanced fracture toughness as a results of the incorporation of reactive thermoplastic oligomers therein. More specifically, the present invention relates to a composition comprising a thermoset resin which contains fluorine and containing at least one fluorine containing thermoplastic homopolymer component which is soluble in the thermoset. Said thermoplastic polymer undergoes an in-situ phase separation process during cure to form a microphase separated multiphase thermoset material.

Abstract: A composition having enhanced fracture resistance comprising a heat curable reaction product of a fluorine-containing thermoset material and a fluorine-containing homopolymer, wherein the cured reaction product comprises the thermoset material having a plurality of discrete phases of said fluorine-containing homopolymer dispersed therein, the homopolymer phases being in the range of micron to submicron size.

Abstract: The invention involves a fluid treatment device to solution or melt impregnate a resin or polymer or any combination thereof into a reinforcement which can be utilized to fabricate composite materials for laminates, circuit boards, structural/aerospace materials, automotive components, etc. The invention offers significant advantages and benefits over existing methods and equipment and allows the impregnation process to be performed at lower cost and higher efficiency with increased environmental safety.