Patents by Inventor Koo Eng Luon

Koo Eng Luon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stitch bump stacking design for overall package size reduction for multiple stack
    Patent number: 8357563
    Abstract: A method for die stacking is disclosed. In one embodiment a first die is formed overlying a substrate. A first wire is bonded to the first die and to a bond finger of the substrate, wherein the first wire is bonded to the bond finger with a first bond. A first stitch bump is formed overlying the first stitch bond, wherein the first stitch bump is formed from a molten ball of conductive material. A second die is formed overlying the first die. A second wire is bonded to the second die and to the first stitch bump, wherein the second wire is bonded to the first stitch bump with a second bond.
    Type: Grant
    Filed: August 10, 2010
    Date of Patent: January 22, 2013
    Assignee: Spansion LLC
    Inventors: Lai Nguk Chin, Foong Yue Ho, Wong Kwet Nam, Koo Eng Luon, Sally Foong, Kevin Guan
  • STITCH BUMP STACKING DESIGN FOR OVERALL PACKAGE SIZE REDUCTION FOR MULTIPLE STACK
    Publication number: 20120038059
    Abstract: A method for die stacking is disclosed. In one embodiment a first die is formed overlying a substrate. A first wire is bonded to the first die and to a bond finger of the substrate, wherein the first wire is bonded to the bond finger with a first bond. A first stitch bump is formed overlying the first stitch bond, wherein the first stitch bump is formed from a molten ball of conductive material. A second die is formed overlying the first die. A second wire is bonded to the second die and to the first stitch bump, wherein the second wire is bonded to the first stitch bump with a second bond.
    Type: Application
    Filed: August 10, 2010
    Publication date: February 16, 2012
    Inventors: Lai Nguk CHIN, Foong Yue HO, Wong Kwet NAM, Koo Eng LUON, Sally FOONG, Kevin GUAN