Abstract: A light-emitting device package includes: a package body on which a mount portion and a terminal portion are disposed; a light-emitting device chip that is mounted on the mount portion; and a bonding wire that electrically connects an electrode of the light-emitting device chip and the terminal portion. The bonding wire includes a rising portion that rises from the light-emitting device chip to a loop peak, and an extended portion that connects the loop peak and the terminal portion. A first kink portion, which is bent in a direction intersecting a direction in which the rising portion rises, is disposed on the rising portion.

Abstract: A light-emitting diode (LED) package and related method of manufacturing are provided. The LED package includes a resin blocking portion to prevent a transparent resin from reaching a contact terminal of the LED package during the formation of the lens for the LED package.

Abstract: A light-emitting device package includes: a package body on which a mount portion and a terminal portion are disposed; a light-emitting device chip that is mounted on the mount portion; and a bonding wire that electrically connects an electrode of the light-emitting device chip and the terminal portion. The bonding wire includes a rising portion that rises from the light-emitting device chip to a loop peak, and an extended portion that connects the loop peak and the terminal portion. A first kink portion, which is bent in a direction intersecting a direction in which the rising portion rises, is disposed on the rising portion.

Abstract: The apparatus for transferring the semiconductor chip includes: a holder member including a first vacuum hole connected to a vacuum line; a plate member including at least one second vacuum hole corresponding to the first vacuum hole and redistributed to edges of the plate member, the plate member combined with the holder member; and an absorption member including at least one third vacuum hole corresponding to the second vacuum hole and a groove connected to the third vacuum hole, the absorption member combined with the plate member and the holder member.

Abstract: A bonder viewer system may provide an automated procedure for determining a wire bonding sequence based on information provided by a drawing management system. The bonder viewer system may include a bonding sequence decision unit receiving pad and lead coordinate data corresponding to an IC chip, and determining a bonding sequence for bonding wires of the IC chip. The bonder viewer system may further include a turning point check unit and a bonding simulation unit which may provide modifications to the bonding sequence information, which may be based on whether a capillary of a wire bonder is in contact with a pre-bonded wire of the IC chip. The bonder viewer system may also include a standard file generator for generating data based on the bonding sequence information and a translator for preparing the data in a format suitable for a wire bonder.

Abstract: A controller may receive a wire disconnection signal from a wire bonding monitoring system and operate a wire clamp to clamp a disconnected wire. A series of operations, which may include a wire drawing operation, a wire tail forming operation and a ball forming operation, may be automatically performed. A sensor may measure the length of the wire drawn through the capillary and the location of a ball that may be formed at a wire tail. An auxiliary clamp may be installed between the wire clamp and the capillary for drawing the wire using sensor information.

Abstract: Provided are an apparatus for transferring a semiconductor chip and a method of transferring a semiconductor chip using the same, which can inhibit the occurrence of a void to enhance the reliability of a semiconductor package. The apparatus for transferring the semiconductor chip includes: a holder member including a first vacuum hole connected to a vacuum line; a plate member including at least one second vacuum hole corresponding to the first vacuum hole and redistributed to edges of the plate member, the plate member combined with the holder member; and an absorption member including at least one third vacuum hole corresponding to the second vacuum hole and a groove connected to the third vacuum hole, the absorption member combined with the plate member and the holder member.

Abstract: An apparatus and method for wire bonding and die attaching using a system for determining reject frames by determining a z-level distance using a z-axis sensor are provided. The apparatus includes a z-axis sensor that may be moved between a reference position and an upper surface of frames on a PCB; a z-axis sensor controller for positioning and moving the z-axis sensor relative to the frame to measure the z-level distance between the reference position and a z-axis sensor contact position on an upper surface of the frame; and a host controller for determining whether the frame is a reject frame by comparing the measured z-level distance with a reference level. The apparatus and method provides for the dynamic determination of which frames are suitable for additional processing with a low error rate and thereby increase the exclusion rate for reject frames resulting in increased production capacity.

Abstract: A bonder viewer system may provide an automated procedure for determining a wire bonding sequence based on information provided by a drawing management system. The bonder viewer system may include a bonding sequence decision unit receiving pad and lead coordinate data corresponding to an IC chip, and determining a bonding sequence for bonding wires of the IC chip. The bonder viewer system may further include a turning point check unit and a bonding simulation unit which may provide modifications to the bonding sequence information, which may be based on whether a capillary of a wire bonder is in contact with a pre-bonded wire of the IC chip. The bonder viewer system may also include a standard file generator for generating data based on the bonding sequence information and a translator for preparing the data in a format suitable for a wire bonder.

Abstract: A controller may receive a wire disconnection signal from a wire bonding monitoring system and operate a wire clamp to clamp a disconnected wire. A series of operations, which may include a wire drawing operation, a wire tail forming operation and a ball forming operation, may be automatically performed. A sensor may measure the length of the wire drawn through the capillary and the location of a ball that may be formed at a wire tail. An auxiliary clamp may be installed between the wire clamp and the capillary for drawing the wire using sensor information.

Abstract: Provided are a variety of snap cure apparatus configuration and corresponding methods for operating each such apparatus in order to snap cure an adhesive composition. Each of the configurations includes at least one vertical stack of heater blocks whereby the horizontal area required for conducting the snap cure processing may be reduced. Depending on the configuration utilized, two or more transfer devices may be required to remove the substrate(s) from a conveyor, index the substrate(s) through the heater blocks to apply the predetermined thermal cycle and return the cured substrate to the conveyor. Similarly, depending on the particular adhesive utilized, the number, relative temperatures, and duration of the substrate(s) on each of the heater blocks may be adjusted to provide the desired degree of curing.