Abstract: The invention is characterized by attaining a lower dielectric constant and including an inorganic dielectric film which is formed on the surface of a substrate and has a cyclic porous structure having a pore ratio of 50% or higher.

Abstract: There is included an inorganic insulating film having a porous structure including a cylindrical vacancy oriented in parallel with the surface of a substrate subjected to a hydrophilic treatment or a hydrophobic treatment.

Abstract: There is included an inorganic insulating film having a porous structure including a cylindrical vacancy oriented in parallel with the surface of a substrate subjected to a hydrophilic treatment or a hydrophobic treatment.

Abstract: The invention aims at providing a dielectric film having a low dielectric constant and enhanced mechanical strength. A surfactant and an silica derivative are dissolved into a solvent at a desired mole ratio. The precursor solution is applied over the substrate, and the substrate is exposed to a silica derivative atmosphere before being sintered, thereby supplying a silica derivative. Thus, contraction of the film stemming from hydrolysis is inhibited, and a sturdy mesoporous silica thin film which takes the self-assembly of the surfactant as a mold is obtained while cavities are maintained intact without being fractured. Thus, there is formed an inorganic dielectric film which is formed on the surface of the substrate and has a cyclic porous structure including layered or columnar pores oriented so as to become parallel with the surface of the substrate.

Abstract: It is an object to provide, with a high productivity, a dielectric thin film having a high degree of pore and a very great mechanical strength, and there are included a surfactant film forming step of forming a film including a surfactant on a surface of a substrate on which a thin film is to be formed, a vapor deposition step of causing the substrate to come in contact with a gas phase containing a silica derivative to form a thin film including the silica derivative, and a step of calcining the substrate having the thin film formed thereon and decomposing and removing the surfactant, the thin film being thus formed.

Abstract: The invention is characterized by attaining a lower dielectric constant and including an inorganic dielectric film which is formed on the surface of a substrate and has a cyclic porous structure having a pore ratio of 50% or higher.

Abstract: The invention is characterized by attaining a lower dielectric constant and including an inorganic dielectric film which is formed on the surface of a substrate and has a cyclic porous structure having a pore ratio of 50% or higher.

Abstract: A mesoporous silica is provided, having uniform mesopores and a periodic structure, which contains Zr in the form of a Si—O—Zr bond. The Zr content in the Si—O—Zr bond, represented by [Zr/(Si+Zr)], is 0.05 to 20 mole %. The mesoporous silica is superior in alkaline resistance and is suitably used as a separation membrane (e.g. a ceramic membrane) and a catalytic support for a solid-liquid system, in which an alkaline liquid may be used.

Abstract: A mesoporous silica has uniform mesopores and a periodic structure, which contains a Zr element in the form of a Si—O—Zr bond and wherein the Zr content in the Si—O—Zr bond, represented by [Zr/(Si+Zr)] is 0.05 to 20 mole %. The mesoporous silica is superior in alkali resistance and is suitably used particularly as a separation membrane (e.g. a ceramic membrane) and a catalytic support for solid-liquid system, in which an alkaline liquid may be used.

Abstract: It is an object to provide, with a high productivity, a dielectric thin film having a high degree of pore and a very great mechanical strength, and there are included a surfactant film forming step of forming a film including a surfactant on a surface of a substrate on which a thin film is to be formed, a vapor deposition step of causing the substrate to come in contact with a gas phase containing a silica derivative to form a thin film including the silica derivative, and a step of calcining the substrate having the thin film formed thereon and decomposing and removing the surfactant, the thin film being thus formed.

Abstract: The invention aims at providing a dielectric film having a low dielectric constant and enhanced mechanical strength. A surfactant and an silica derivative are dissolved into a solvent at a desired mole ratio. The precursor solution is applied over the substrate, and the substrate is exposed to a silica derivative atmosphere before being sintered, thereby supplying a silica derivative. Thus, contraction of the film stemming from hydrolysis is inhibited, and a sturdy mesoporous silica thin film which takes the self-assembly of the surfactant as a mold is obtained while cavities are maintained intact without being fractured. Thus, there is formed an inorganic dielectric film which is formed on the surface of the substrate and has a cyclic porous structure including layered or columnar pores oriented so as to become parallel with the surface of the substrate.

Abstract: The invention is characterized by attaining a lower dielectric constant and including an inorganic dielectric film which is formed on the surface of a substrate and has a cyclic porous structure having a pore ratio of 50% or higher.

Abstract: A mesoporous silica has uniform mesopores and a periodic structure, which contains a Zr element in the form of a Si—O—Zr bond and wherein the Zr content in the Si—O—Zr bond, represented by [Zr/(Si+Zr)] is 0.05 to 20 mole %. The mesoporous silica is superior in alkali resistance and is suitably used particularly as a separation membrane (e.g. a ceramic membrane) and a catalytic support for solid-liquid system, in which an alkaline liquid may be used.