Patents by Inventor Kosaburo Ito
Kosaburo Ito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10955700Abstract: The present invention provides a panel capable of switching between a state transparent to external light, a point light emitting state, and a surface light emitting state. Provided is a transparent panel provided with light emitting function, including: an LED die; a light transmitting substrate for LED, on which the LED die is mounted; a wiring pattern provided on a surface of the light transmitting substrate for LED and bonded to the LED die; and a light diffusing panel laminated on the light transmitting substrate for LED. The light diffusing panel includes: a pair of light transmitting substrates for liquid crystal; a liquid crystal layer sandwiched between the pair of light transmitting substrates for liquid crystal; and transparent conductive films disposed on the light transmitting substrates for liquid crystal, and is switchable between a transparent state and a light diffusion state.Type: GrantFiled: May 22, 2018Date of Patent: March 23, 2021Assignee: STANLEY ELECTRIC CO., LTD.Inventors: Hiroto Fukushima, Akihiko Hanya, Kosaburo Ito, Tsukasa Imura, Reiki Tada
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Patent number: 10823362Abstract: A vehicular lamp fitting comprising a film light source that includes a transparent film having flexibility, and a plurality of semiconductor light-emitting elements which are fixed in a state of being two-dimensionally disposed on at least a front surface of the transparent film; and a reflection surface that is disposed in a state of facing a rear surface of the transparent film of the film light source, and that reflects light which is emitted from a part or all of the plurality of semiconductor light-emitting elements and transmitted through the transparent film.Type: GrantFiled: September 4, 2019Date of Patent: November 3, 2020Assignee: STANLEY ELECTRIC CO., LTD.Inventors: Hiroyuki Chikama, Norifumi Imazeki, Haruna Minami, Marino Mine, Akihiko Hanya, Kosaburo Ito, Takuya Yamamoto
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Patent number: 10808907Abstract: Provided is a vehicular lamp which has a novel lighting appearance and satisfies a light distribution standard required by certain laws as well as being capable of realizing lighting patterns of various luminances and various light-emitting shapes, e.g., various lighting graphics. The vehicular lamp is provided with a film light source including a film having flexibility and a plurality of semiconductor light-emitting elements fixed in a state of being two-dimensionally disposed on at least a surface of the film.Type: GrantFiled: August 22, 2019Date of Patent: October 20, 2020Assignee: STANLEY ELECTRIC CO., LTD.Inventors: Takuya Yamamoto, Marino Mine, Haruna Minami, Akihiko Hanya, Kosaburo Ito, Norifumi Imazeki, Hiroyuki Chikama
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Publication number: 20200166802Abstract: The present invention provides a panel capable of switching between a state transparent to external light, a point light emitting state, and a surface light emitting state. Provided is a transparent panel provided with light emitting function, including: an LED die; a light transmitting substrate for LED, on which the LED die is mounted; a wiring pattern provided on a surface of the light transmitting substrate for LED and bonded to the LED die; and a light diffusing panel laminated on the light transmitting substrate for LED. The light diffusing panel includes: a pair of light transmitting substrates for liquid crystal; a liquid crystal layer sandwiched between the pair of light transmitting substrates for liquid crystal; and transparent conductive films disposed on the light transmitting substrates for liquid crystal, and is switchable between a transparent state and a light diffusion state.Type: ApplicationFiled: May 22, 2018Publication date: May 28, 2020Applicant: STANLEY ELECTRIC CO., LTD.Inventors: Hiroto FUKUSHIMA, Akihiko HANYA, Kosaburo ITO, Tsukasa IMURA, Reiki TADA
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Publication number: 20200080703Abstract: A vehicular lamp fitting comprising a film light source that includes a transparent film having flexibility, and a plurality of semiconductor light-emitting elements which are fixed in a state of being two-dimensionally disposed on at least a front surface of the transparent film; and a reflection surface that is disposed in a state of facing a rear surface of the transparent film of the film light source, and that reflects light which is emitted from a part or all of the plurality of semiconductor light-emitting elements and transmitted through the transparent film.Type: ApplicationFiled: September 4, 2019Publication date: March 12, 2020Inventors: Hiroyuki Chikama, Norifumi Imazeki, Haruna Minami, Marino Mine, Akihiko Hanya, Kosaburo Ito, Takuya Yamamoto
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Publication number: 20200063941Abstract: Provided is a vehicular lamp which has a novel lighting appearance and satisfies a light distribution standard required by certain laws as well as being capable of realizing lighting patterns of various luminances and various light-emitting shapes, e.g., various lighting graphics. The vehicular lamp is provided with a film light source including a film having flexibility and a plurality of semiconductor light-emitting elements fixed in a state of being two-dimensionally disposed on at least a surface of the film.Type: ApplicationFiled: August 22, 2019Publication date: February 27, 2020Inventors: Takuya Yamamoto, Marino Mine, Haruna Minami, Akihiko Hanya, Kosaburo Ito, Norifumi Imazeki, Hiroyuki Chikama
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Patent number: 10217386Abstract: A thin light-transmitting substrate showing high thermal conduction efficiency, and having a function of raising surface temperature thereof is provided. The light-transmitting substrate of the present invention comprises a substrate that transmits at least a light of a predetermined wavelength, and a conductor pattern that is disposed on the substrate, and generates heat to raise temperature of the surface of the substrate when it is supplied with an electric current. The conductor pattern is directly disposed on the substrate without any adhesive layer.Type: GrantFiled: September 20, 2017Date of Patent: February 26, 2019Assignee: STANLEY ELECTRIC CO., LTD.Inventors: Akihiko Hanya, Kosaburo Ito, Yoshiyuki Abe
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Publication number: 20180090035Abstract: A thin light-transmitting substrate showing high thermal conduction efficiency, and having a function of raising surface temperature thereof is provided. The light-transmitting substrate of the present invention comprises a substrate that transmits at least a light of a predetermined wavelength, and a conductor pattern that is disposed on the substrate, and generates heat to raise temperature of the surface of the substrate when it is supplied with an electric current. The conductor pattern is directly disposed on the substrate without any adhesive layer.Type: ApplicationFiled: September 20, 2017Publication date: March 29, 2018Applicant: STANLEY ELECTRIC CO., LTD.Inventors: Akihiko HANYA, Kosaburo ITO, Yoshiyuki ABE
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Patent number: 9793455Abstract: A semiconductor light-emitting device can include a wavelength converting layer including a surrounding portion, which covers at least one semiconductor light-emitting chip in order to emit various colored lights including white light. The semiconductor light-emitting device can include a substrate, a frame located on the substrate, the chip mounted on the substrate, a transparent material layer located on the wavelength converting layer so as to reduce from the wavelength converting layer toward a light-emitting surface thereof, and a reflective material layer disposed at least between the frame and both side surfaces of the wavelength converting layer and the transparent material layer.Type: GrantFiled: May 4, 2016Date of Patent: October 17, 2017Assignee: STANLEY ELECTRIC CO., LTD.Inventor: Kosaburo Ito
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Patent number: 9726340Abstract: A reliable semiconductor light-emitting apparatus and a headlight using the light-emitting apparatus provided with a light source module including a semiconductor light-emitting device and a wavelength converting module including a wavelength converting layer. The wavelength converting module can include a base having a mounting board, which mounts the wavelength converting layer via metallic bumps, and the base can be configured to attach the light source module directly or via a connecting guide including an optical fiber, and therefore can transmit light emitted from the light-emitting device towards the wavelength converting layer while efficiently radiating heat generated from the wavelength converting layer.Type: GrantFiled: June 20, 2015Date of Patent: August 8, 2017Assignee: STANLEY ELECTRIC CO., LTD.Inventors: Toshihiro Seko, Kosaburo Ito, Kenji Akisada
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Publication number: 20160247987Abstract: A semiconductor light-emitting device can include a wavelength converting layer including a surrounding portion, which covers at least one semiconductor light-emitting chip in order to emit various colored lights including white light. The semiconductor light-emitting device can include a substrate, a frame located on the substrate, the chip mounted on the substrate, a transparent material layer located on the wavelength converting layer so as to reduce from the wavelength converting layer toward a light-emitting surface thereof, and a reflective material layer disposed at least between the frame and both side surfaces of the wavelength converting layer and the transparent material layer.Type: ApplicationFiled: May 4, 2016Publication date: August 25, 2016Inventor: Kosaburo Ito
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Patent number: 9368690Abstract: A semiconductor light-emitting device can include a wavelength converting layer including a surrounding portion, which covers at least one semiconductor light-emitting chip in order to emit various colored lights including white light. The semiconductor light-emitting device can include a substrate, a frame located on the substrate, the chip mounted on the substrate, a transparent material layer located on the wavelength converting layer so as to reduce from the wavelength converting layer toward a light-emitting surface thereof, and a reflective material layer disposed at least between the frame and both side surfaces of the wavelength converting layer and the transparent material layer.Type: GrantFiled: January 24, 2014Date of Patent: June 14, 2016Assignee: Stanley Electric Co., Ltd.Inventor: Kosaburo Ito
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Publication number: 20150372200Abstract: A reliable semiconductor light-emitting apparatus and a headlight using the light-emitting apparatus provided with a light source module including a semiconductor light-emitting device and a wavelength converting module including a wavelength converting layer. The wavelength converting module can include a base having a mounting board, which mounts the wavelength converting layer via metallic bumps, and the base can be configured to attach the light source module directly or via a connecting guide including an optical fiber, and therefore can transmit light emitted from the light-emitting device towards the wavelength converting layer while efficiently radiating heat generated from the wavelength converting layer.Type: ApplicationFiled: June 20, 2015Publication date: December 24, 2015Inventors: Toshihiro Seko, Kosaburo Ito, Kenji Akisada
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Patent number: 8921877Abstract: A semiconductor light-emitting device and a method for manufacturing the same can include a wavelength converting layer located on at least one semiconductor light-emitting chip in order to emit various colored lights including white light. The semiconductor light-emitting device can include a base board, the chip mounted on the base board and a transparent plate disposed on the wavelength converting layer including a spacer and a phosphor having a high density. The wavelength converting layer can be formed in a thin uniform thickness between the transparent plate and a top surface of the chip using the spacer so as to extend toward the transparent plate. The semiconductor light-emitting device can be configured to improve light-emitting efficiency of the chip by using the thin wavelength converting layer including the phosphor having a high density, and therefore can emit a wavelength-converted light having a high light-emitting efficiency from a small light-emitting surface.Type: GrantFiled: August 2, 2011Date of Patent: December 30, 2014Assignee: Stanley Electric Co., Ltd.Inventors: Kosaburo Ito, Toshihiro Seko, Kazuhiko Ueno, Naoto Suzuki
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Patent number: 8896199Abstract: There is provided a method for producing a light emitting device having a small light emitting area and showing high light extraction efficiency. An uncured resin 13? is dropped on either one or both of a light emitting element 11 and a tabular member 14 in such an amount that the resin is maintained on them by surface tension, the light emitting element 11 and the tabular member 14 are piled up with the uncured resin 13? maintained between them and on a side of the light emitting element by surface tension of the uncured resin 13? to form an uncured resin layer 13? having an inclined side 130, and then the resin layer 13 is cured. The tabular member is constituted with a material having an alkali metal oxide content of 0.2% by weight or lower.Type: GrantFiled: August 4, 2012Date of Patent: November 25, 2014Assignee: Stanley Electric Co., Ltd.Inventors: Kosaburo Ito, Toshihiro Seko, Kazuhiko Ueno, Naoto Suzuki
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Publication number: 20140203306Abstract: A semiconductor light-emitting device can include a wavelength converting layer including a surrounding portion, which covers at least one semiconductor light-emitting chip in order to emit various colored lights including white light. The semiconductor light-emitting device can include a substrate, a frame located on the substrate, the chip mounted on the substrate, a transparent material layer located on the wavelength converting layer so as to reduce from the wavelength converting layer toward a light-emitting surface thereof, and a reflective material layer disposed at least between the frame and both side surfaces of the wavelength converting layer and the transparent material layer.Type: ApplicationFiled: January 24, 2014Publication date: July 24, 2014Applicant: Stanley Electric Co., Ltd.Inventor: Kosaburo Ito
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Patent number: 8581287Abstract: A semiconductor light-emitting device and a method for manufacturing the same can include a wavelength converting layer in order to emit various colored lights including white light. The device can include a board, a frame located on the board, at least one light-emitting chip mounted on the board, the wavelength converting layer located between an optical plate and an outside surface of the chips so that a density of a peripheral region is lower than that of a middle region, and a reflective material layer disposed at least between the frame and a side surface of the wavelength-converting layer. The device can have the reflective material layer form each reflector and can use a wavelength converting layer having different densities, and therefore can emit a wavelength-converted light having a high light-emitting efficiency and a uniform color tone from various small light-emitting surfaces.Type: GrantFiled: January 23, 2012Date of Patent: November 12, 2013Assignee: Stanley Electric Co., Ltd.Inventors: Takeshi Waragaya, Kosaburo Ito, Toshihiro Seko, Kazuhiko Ueno, Soji Owada
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Patent number: 8461610Abstract: A semiconductor light-emitting device and a method for manufacturing the same can include a wavelength converting layer located over at least one semiconductor light-emitting chip in order to emit various colored lights including white light. The semiconductor light-emitting device can include a base board, a frame located on the base board, the chip mounted on the base board, a transparent material layer located between the wavelength converting layer and a side surface of the chip so as to extend toward the wavelength converting layer, and a reflective material layer disposed at least between the frame and both side surfaces of the wavelength converting layer and the transparent material layer. The semiconductor light-emitting device can be configured to improve light-emitting efficiency of the chip by using the reflective material layer as a reflector, and therefore can emit a wavelength-converted light having a high light-emitting efficiency from a small light-emitting surface.Type: GrantFiled: June 16, 2011Date of Patent: June 11, 2013Assignee: Stanley Electric Co., Ltd.Inventors: Kosaburo Ito, Toshihiro Seko, Kazuhiko Ueno, Soji Owada
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Patent number: 8455907Abstract: A semiconductor light-emitting device and a method for manufacturing the same can include a wavelength converting layer in order to emit various colored lights including white light. The semiconductor light-emitting device can include a base board, a frame located on the base board, at least one light-emitting chip mounted on the base board, the wavelength converting layer located between an optical plate and each outside surface of the chips so as to extend toward the optical plate using a meniscus control structure, and a reflective material layer disposed at least between the frame and both side surfaces of the wavelength converting layer and the optical plate. The semiconductor light-emitting device can be configured to improve light-emitting efficiency and color variability between the light-emitting chips by using the reflective material layer as each reflector, and therefore can emit a wavelength-converted light having a high light-emitting efficiency from various small light-emitting surfaces.Type: GrantFiled: December 13, 2011Date of Patent: June 4, 2013Assignee: Stanley Electric Co., Ltd.Inventors: Takeshi Waragawa, Kosaburo Ito
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Patent number: 8373182Abstract: A semiconductor light-emitting device and a method for manufacturing the same can include a wavelength converting layer encapsulating at least one semiconductor light-emitting chip to emit various colored lights including white light. The semiconductor light-emitting device can include a base board with the chip mounted thereon, a frame located on the base board, a transparent plate located on the wavelength converting layer, a reflective material layer disposed between the frame and both side surfaces of the wavelength converting layer and the transparent plate, and a light-absorbing layer located on the reflective material layer. The semiconductor light-emitting device can be configured to improve light-emitting efficiency and a contrast between a light-emitting and non-light-emitting surfaces by using the transparent material and light-absorbing layer.Type: GrantFiled: September 9, 2011Date of Patent: February 12, 2013Assignee: Stanley Electric Co., Ltd.Inventors: Toshihiro Seko, Kosaburo Ito