Abstract: A method of processing a plate-shaped workpiece includes a workpiece supporting step of placing the plate-shaped workpiece on a thermocompression sheet whose area is larger than that of the plate-shaped workpiece, heating the thermocompression sheet to pressure-bond the thermocompression sheet to the plate-shaped workpiece, and supporting the plate-shaped workpiece on only the thermocompression sheet, a processing step of processing the plate-shaped workpiece to divide the plate-shaped workpiece into a plurality of chips, and a pick-up step of picking up the chips from the thermocompression sheet.

Abstract: A method of processing a plate-shaped workpiece includes a workpiece supporting step of placing a plate-shaped workpiece on an upper surface of a sheet whose area is larger than that of the plate-shaped workpiece through a liquid resin interposed therebetween and supporting the plate-shaped workpiece on only the liquid resin that has solidified and the sheet, a processing step of processing the plate-shaped workpiece to divide the plate-shaped workpiece into a plurality of chips, and a pick-up step of picking up the chips from the sheet.

Abstract: Disclosed is a method of peeling a protective member from a wafer, the protective member composed of a resin and a film, the film attached to one side of the wafer through the resin in a state in which a protruding portion is formed. The method includes: a step of holding the other side of the wafer, with the protective member on the lower side; an outer circumferential edge adhered resin peeling step of grasping the protruding portion of the protective member, and pulling the protruding portion to an outer side than an outer circumferential edge of the wafer, to peel the resin adhered to the outer circumferential edge of the wafer from the outer circumferential edge of the wafer; and a step of peeling, after the outer circumferential edge adhered resin peeling step, the whole body of the protective member from the wafer.

Abstract: Disclosed is a method of peeling a protective member from a wafer, the protective member composed of a resin and a film, the film attached to one side of the wafer through the resin in a state in which a protruding portion is formed. The method includes: a step of holding the other side of the wafer, with the protective member on the lower side; an outer circumferential edge adhered resin peeling step of grasping the protruding portion of the protective member, and pulling the protruding portion to an outer side than an outer circumferential edge of the wafer, to peel the resin adhered to the outer circumferential edge of the wafer from the outer circumferential edge of the wafer; and a step of peeling, after the outer circumferential edge adhered resin peeling step, the whole body of the protective member from the wafer.