Patents by Inventor Kosei Nagayama

Kosei Nagayama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-layer ceramic wiring circuit board and process for producing the same
    Patent number: 4620264
    Abstract: A multi-layer ceramic wiring board consisting of alternately laminated ceramic insulating substrates and wiring conductor layers in which the inner-layer ceramic insulating substrates contacting the inside layers of signal wiring conductor are made of a ceramic insulator having a relative dielectric constant of 6.0 or below and a relatively low density and the ceramic insulating substrates of other layers are made of a ceramic insulator having a tensile strength of 4 kgf/mm.sup.2 or above and a relatively high density. In preparation of the board, each of the inner-layer ceramic insulating substrates is preferably formed from a green sheet obtained by drying a thin layer of a slurry containing 70 to 90 parts of ceramic filler particles having a particle size of 5 .mu.
    Type: Grant
    Filed: December 21, 1984
    Date of Patent: October 28, 1986
    Assignee: Hitachi, Ltd.
    Inventors: Nobuyuki Ushifusa, Satoru Ogihara, Kosei Nagayama