Patents by Inventor Koshi Abe

Koshi Abe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210156503
    Abstract: A resin tube is prepared. Further, a formation tool having a pressing surface and a projection that projects from the pressing surface and is insertable into the resin tube is prepared. The projection of the formation tool is inserted from an end of the resin tube into the resin tube. The pressing surface of the formation tool is pressed against an end surface of the resin tube. Thermal energy is applied to the end of the resin tube, whereby a shape of the pressing surface of the formation tool is transferred to the end surface of the resin tube, and the end of the resin tube is formed into a flange shape.
    Type: Application
    Filed: November 9, 2020
    Publication date: May 27, 2021
    Inventors: Jun YANAGIBAYASHI, Kenichi YASUNAGA, Shinji TANAKA, Shinya IMAMURA, Ryo HOSONO, Hiromu YAMASAKI, Koshi ABE
  • Patent number: 6866718
    Abstract: A sealant applicator 1 is provided for applying a waterproofing treatment to a wire assembly, a plurality of wires are aligned in a line according to their diameters in a holder 4 provided on a wire laying board 3. Positioning members 21 of a main unit 2 are fitted to the holder 4. A pair of nozzles 22 are opposed to each other at the opposite sides of the aligned wires, and is caused to discharge a specified amount of the sealant by a feeding mechanism 26 while being moved in a wire alignment direction by a moving mechanism 27 and being brought closer to the wires by a relatively moving mechanism 25. This enables a variation of clearances between the wires and the nozzles to be reduced and the sealant to be uniformly applied.
    Type: Grant
    Filed: October 16, 2002
    Date of Patent: March 15, 2005
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Hisato Chujo, Koshi Abe, Hirotake Baba, Kenichi Uchiyama
  • Patent number: 6539617
    Abstract: An apparatus is provided for mounting a wire assembly made up of a ferrite and terminal-provided wires into a connector housing (C). The connector housing (C) includes a main body (C1) and a cover (C2) that are connected by a connecting piece. Operations are automated a mechanism (50) for mounting a portion of a wire assembly (AY) into a housing main body (C1), a mechanism (20, 25) for turning a cover (C2) after the wire assembly (AY) is fully mounted, a mechanism (40, 60) for connecting the cover (C2) with the main body (C1), and a mechanism (40, 70) for inserting a lock into a connector housing (C).
    Type: Grant
    Filed: July 13, 2001
    Date of Patent: April 1, 2003
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventor: Koshi Abe
  • Publication number: 20030037726
    Abstract: A sealant applicator 1 is provided for applying a waterproofing treatment to a wire assembly, a plurality of wires are aligned in a line according to their diameters in a holder 4 provided on a wire laying board 3. Positioning members 21 of a main unit 2 are fitted to the holder 4. A pair of nozzles 22 are opposed to each other at the opposite sides of the aligned wires, and is caused to discharge a specified amount of the sealant by a feeding mechanism 26 while being moved in a wire alignment direction by a moving mechanism 27 and being brought closer to the wires by a relatively moving mechanism 25. This enables a variation of clearances between the wires and the nozzles to be reduced and the sealant to be uniformly applied.
    Type: Application
    Filed: October 16, 2002
    Publication date: February 27, 2003
    Applicant: Sumitomo Wiring Systems, Ltd.
    Inventors: Hisato Chujo, Koshi Abe, Hirotake Baba, Kenichi Uchiyama
  • Patent number: 6521065
    Abstract: A sealant applicator 1 is provided for applying a waterproofing treatment to a wire assembly, a plurality of wires are aligned in a line according to their diameters in a holder 4 provided on a wire laying board 3. Positioning members 21 of a main unit 2 are fitted to the holder 4. A pair of nozzles 22 are opposed to each other at the opposite sides of the aligned wires, and is caused to discharge a specified amount of the sealant by a feeding mechanism 26 while being moved in a wire alignment direction by a moving mechanism 27 and being brought closer to the wires by a relatively moving mechanism 25. This enables a variation of clearances between the wires and the nozzles to be reduced and the sealant to be uniformly applied.
    Type: Grant
    Filed: July 5, 2000
    Date of Patent: February 18, 2003
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Hisato Chujo, Koshi Abe, Hirotaka Baba, Kenichi Uchiyama
  • Publication number: 20020004979
    Abstract: An apparatus is provided for mounting a wire assembly made up of a ferrite and terminal-provided wires into a connector housing (C). The connector housing (C) includes a main body (C1) and a cover (C2) that are connected by a connecting piece. Operations are automated a mechanism (50) for mounting a portion of a wire assembly (AY) into a housing main body (C1), a mechanism (20, 25) for turning a cover (C2) after the wire assembly (AY) is fully mounted, a mechanism (40, 60) for connecting the cover (C2) with the main body (C1), and a mechanism (40, 70) for inserting a lock into a connector housing (C).
    Type: Application
    Filed: July 13, 2001
    Publication date: January 17, 2002
    Inventor: Koshi Abe