Abstract: The multilayer ceramic chip capacitor includes a multilayer ceramic capacitor chip having internal electrodes and an external electrode that is formed of a sintered layer of a paste containing both an electroconductive metal powder and a glass frit on both end faces of the multilayer ceramic capacitor chip and having an electric connection to the internal electrodes. A coating of plated metal is deposited on the surface of the external electrode. The multilayer ceramic capacitor chip is chamfered to a radius of curvature (R) of 0.10 mm or more on the periphery of each of the end faces at which the internal electrodes are to be connected to the external electrode and/or the external electrode has a dual structure consisting of an undercoat in contact with the internal electrodes and a topcoat in superposition on the surface of the undercoat.

Abstract: A jig in a plate form capable of efficient formation of side electrodes on electronic components in a plate form. After electrode formation on one side of each electronic component, an electrode can be formed on the other side without causing spalling or chipping of the already formed side electrode. The jig 1 includes a core member 3 having a soft member 4 joined thereto and has a multiple of grooves 5 and 6 formed on reverse sides, respectively, in such a way that aligned electronic components A can be pushed into the grooves. The inner sides of each groove are composed of the soft member 4. Side electrodes B are formed on both sides of an electronic component as it is held between the opposed inner sides of grooves 5 or 6.

Abstract: The present invention provides a capacitor having a changeable dielectric capacity which has advantages in changing the dielectric capacity and increasing the maximum dielectric capacity. The capacitor having a changeable dielectric capacity comprises ceramic main body part 1 in which a first and second internal electrodes 2a and 2b are formed. Four terminal electrodes 3 are formed apart on a face of the ceramic main body part 1. A common terminal electrode 4 is formed on the ceramic main body part 1 so that it connects with the internal electrodes 2a and 2b. To these terminal electrodes 3 and 4 are connected their respective lead wires 5 for wiring.

Abstract: An object of the present invention is to provide a method for forming connector terminal electrodes of a lamination capacitor which has firm connection between the internal electrodes and the connector terminal electrode. The ceramic main body part (10) having internal electrodes of palladium is put into a mixture of two powders, one being a silver powder (3) with a diffusion coefficient different from the internal electrodes and the other being a zirconium powder (2) which is inactive to both the internal electrode and the silver powder (3). The ceramic main body part (10) in the mixture is subjected to a heat treatment at a heat temperature. Thereafter a connector terminal electrode (20) is formed on each of the sides of the ceramic main body part (10).

Abstract: There is provided terminal electrodes and methods of manufacture thereof which overcome the drawbacks of the prior art multilayer ceramic capacitor, namely, thickened terminal electrodes and size variation (low size precision) thereof. A ceramic main body (11) is provided with internal electrodes (12) therein, and terminal electrodes (13) on a front and a rear sides, and at least one of adjacent four sides. The terminal electrode (13) is formed as a three-layer structure consisting of a first external electrode layer (14) of metal highly adhesive to ceramic, a second external electrode layer (15) of metal having solderability, and a third external electrode layer (16) of metal having solder wettability. The three-layer structure of the terminal electrode is approximately 1 to 3 .mu.m thick.