Patents by Inventor Koshi Okita

Koshi Okita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11902679
    Abstract: An imaging element according to an embodiment includes: a unit pixel including a first pixel having a first photoelectric conversion element and including a second pixel having a second photoelectric conversion element, the second pixel being arranged adjacent to the first pixel; and an accumulation portion that accumulates a charge generated by the second photoelectric conversion element and converts the accumulated charge into a voltage. The accumulation portion is disposed at a boundary between the unit pixel and another unit pixel adjacent to the unit pixel.
    Type: Grant
    Filed: December 8, 2020
    Date of Patent: February 13, 2024
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Tomohiko Asatsuma, Ryosuke Nakamura, Satoko Iida, Koshi Okita
  • Publication number: 20230254602
    Abstract: An imaging element according to an embodiment includes: a unit pixel including a first pixel having a first photoelectric conversion element and including a second pixel having a second photoelectric conversion element, the second pixel being arranged adjacent to the first pixel; and an accumulation portion that accumulates a charge generated by the second photoelectric conversion element and converts the accumulated charge into a voltage. The accumulation portion is disposed at a boundary between the unit pixel and another unit pixel adjacent to the unit pixel.
    Type: Application
    Filed: April 13, 2023
    Publication date: August 10, 2023
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Tomohiko ASATSUMA, Ryosuke NAKAMURA, Satoko IIDA, Koshi OKITA
  • Publication number: 20230018370
    Abstract: An imaging element according to an embodiment includes: a unit pixel including a first pixel having a first photoelectric conversion element and including a second pixel having a second photoelectric conversion element, the second pixel being arranged adjacent to the first pixel; and an accumulation portion that accumulates a charge generated by the second photoelectric conversion element and converts the accumulated charge into a voltage. The accumulation portion is disposed at a boundary between the unit pixel and another unit pixel adjacent to the unit pixel.
    Type: Application
    Filed: December 8, 2020
    Publication date: January 19, 2023
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Tomohiko ASATSUMA, Ryosuke NAKAMURA, Satoko IIDA, Koshi OKITA
  • Patent number: 11054548
    Abstract: A plastic optical fiber including a first cladding; a first core forming a first sea portion inside the first cladding; and a first island portion formed inside the first core with at least an outer periphery having a lower refractive index than the first sea portion, wherein the first core includes a polymethyl methacrylate-based resin.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: July 6, 2021
    Assignee: ASAHI KASEI KABUSHIKI KAISHA
    Inventor: Koshi Okita
  • Publication number: 20200264337
    Abstract: A plastic optical fiber including a first cladding; a first core forming a first sea portion inside the first cladding; and a first island portion formed inside the first core with at least an outer periphery having a lower refractive index than the first sea portion, wherein the first core includes a polymethyl methacrylate-based resin.
    Type: Application
    Filed: August 31, 2018
    Publication date: August 20, 2020
    Applicant: ASAHI KASEI KABUSHIKI KAISHA
    Inventor: Koshi OKITA
  • Patent number: 8389116
    Abstract: Problem to be Solved To provide a photosensitive resin composition which has good processability even in a relatively low temperature condition near room temperature and exhibits good efficiency in removing debris generated while shaping a printing plate by laser engraving. Solution A photosensitive resin composition, characterized by comprising: (a) 100 parts by mass of a resin having a number average molecular weight of 1,000 or more; and (b) 0.1 to 10 parts by mass of ultrafine particles having a number average particle diameter of primary particles of 5 nm or more and 100 nm or less; wherein the photosensitive resin composition has a viscosity at 20° C. of 50 Pa·s or more and 10,000 Pa·s or less; and a precursor composition, which is obtained by excluding the component (b) from the photosensitive resin composition, has a viscosity at 20° C. of 5 Pa·s or more and 500 Pa·s or less.
    Type: Grant
    Filed: September 4, 2007
    Date of Patent: March 5, 2013
    Assignee: Asahi Kasel Chemicals Corporation
    Inventors: Shinji Funakoshi, Koshi Okita, Hiroshi Yamada, Kei Tomeba
  • Publication number: 20100189941
    Abstract: Problem to be Solved To provide a photosensitive resin composition which has good processability even in a relatively low temperature condition near room temperature and exhibits good efficiency in removing debris generated while shaping a printing plate by laser engraving. Solution A photosensitive resin composition, characterized by comprising: (a) 100 parts by mass of a resin having a number average molecular weight of 1,000 or more; and (b) 0.1 to 10 parts by mass of ultrafine particles having a number average particle diameter of primary particles of 5 nm or more and 100 nm or less; wherein the photosensitive resin composition has a viscosity at 20° C. of 50 Pa·s or more and 10,000 Pa·s or less; and a precursor composition, which is obtained by excluding the component (b) from the photosensitive resin composition, has a viscosity at 20° C. of 5 Pa·s or more and 500 Pa·s or less.
    Type: Application
    Filed: September 4, 2007
    Publication date: July 29, 2010
    Inventors: Shinji Funakoshi, Koshi Okita, Hiroshi Yamada, Kei Tomeba
  • Publication number: 20050176250
    Abstract: A polishing fluid for metallic films, wherein the etching rate is 10 nm/min. or less, the polishing rate under a load of 10 KPa is 200 nm/min. or more, and the contrast, a ratio of the above-mentioned polishing rate to the etching rate, is 20 or more; and a method for producing a semiconductor substrate using the same.
    Type: Application
    Filed: August 8, 2002
    Publication date: August 11, 2005
    Inventors: Hideaki Takahashi, Koshi Okita, Kuon Miyazaki, Takayuki Matsuda